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Titre : Recherche sur les mots clés power cycling of power device, mai 2002.

Cité dans : [DIV096]  Recherches bibliographiques diverses, janvier 2019.
Cité dans : [DATA035] Recherche sur les mots clés thermal + fatigue + semiconductor et reliability + thermal + cycle, mars 2004.
Cité dans : [DIV334]  Recherche sur les mots clés power cycling of power device, mai 2002.
Cité dans : [PAP360]  T. LEQUEU, Les tests en fiabilité, rapport interne LMP, novembre 2001.

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Vers : Ajout du 11 mai 2002
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Vers : Recherche LMP du 7 mai 2002
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Recherche maison du 8 mai 2002

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 [46] : [SHEET336] Y.H. PAO, W. JUNG, R. COOPER, V.A. SANKARAN, X. XU, Thermal Fatigue Modeling of Solder Interlayer in Power Electronics, Advances in Electronic Packaging, 1995, vol. 10, pp. 1059-1068.
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 [50] : [SHEET387] M. MARZ, P. NANCE, Thermal Modeling of Power-electronic Systems, Application Notes, Infineon Technologies AG, Munich.
 [51] : [SHEET516] G. COQUERY, R. LALLEMAND, Failure criteria for long term Accelerated Power Cycling Test linked to electrical turn off SOA on IGBT module. A 4000 hours test on 1200A-3300V module with AlSiC base plate, ESREF'2000, pp. 1665-1670.

 [52] :  [PAP310]  R. BLISH, N. DURRANT, Semiconductor Device Reliability Failure Models, International SEMATECH, Technology Transfer # 00053955A-XFR, May 31, 2000, 34 pages.
 [53] :  [PAP360]  T. LEQUEU, Les tests en fiabilité, rapport interne LMP, novembre 2001.
 [54] :  [PAP371]  R. Schlegel, E. Herr, F. Richter, Reliability of non-hermetic pressure contact IGBT modules, ESREF'2001, pp. 1689-1694
 [55] :  [PAP372]  G. COQUERY, S. CARUBELLI, J.P. OUSTEN, R. LALLEMAND, F. LECOQ, D. LHOTELLIER, V. DE VIRY, PH. DUPUY, Power module lifetime estimation from chip temperature direct measurement in an automotive traction inverter, ESREF'2001, pp. 1695-1700
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 [64] :  [DATA035] Recherche sur les mots clés thermal + fatigue + semiconductor et reliability + thermal + cycle, mars 2004.
 [65] :  [DATA046] IAS'97, Industrial and Commercial Power Systems Technical Conference, 1997 IEEE/IAS, 1997
 [66] :  [DATA126] ESREF'2000, 11th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Dresden, Germany, 2-6 octobre 2000.
 [67] :  [DATA146] LTN, Laboratoire des Technologies Nouvelles, INRETS, Arcueil, France.
 [68] :  [DATA227] ESREF'2001, 12th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Arcachon, France , 1-5 octobre 2001.
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 [71] :  [DIV333]  Recherche sur les mots clés thermal + shock + liquid , février 2002.
 [72] :  [DIV334]  Recherche sur les mots clés power cycling of power device, mai 2002.

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Issue du rapport PAP360

  [1] :  [PAP360]  T. LEQUEU, Les tests en fiabilité, rapport interne LMP, novembre 2001.

  [2] :  [PAP254]  S. WEN, L. M. KEER, A Fatigue Theory for Solders, IRPS'2001, pp. 120-127.
  [3] :  [PAP255]  X. MA, Y. QIAN, X. ZHANG, The Concept of Relative Damage Stress and its Application to Electronic Packaging Solder Joint Reliability, IRPS'2001, pp. 128-131.
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Recherche STN Easy du 6 mai 2002

Vers : Question : power cycling
Vers : Question : power cycling and solder
Vers : Question : power cycling and electronic device
Vers : Question : power cycling and electronic 169

Question : power cycling

Question : power cycling and solder

26 Effect of component heterogeneity on global CTE mismatch displacement in areal-array solder interconnects.
27 Versatile mutilayer MCM-D structure for high reliability applications.
28 Experimental studies of SMT solder joint reliability.
29 Power cycling reliability of IGBT power modules.
30 Integrated flow-thermo-mechanical analysis of solder joints fatigue in a low air flow C4/CBGA package.
31 Optical coupling of a SMF to flip-chip bonded laser diode for low-cost subscriber's transmitter module.
32 Substrate-to-base solder joint reliability in high power IGBT modules.
33 Development of reflowable Sn-Pb alloy bump for Al pad.
34 Deformation measurements of surface mount assembly under power cycling using optical interferometry.
35 Anisothermal fatigue analysis of solder joints in a convective CBGA package under power cycling.
36 Effects of multiple ceramics on reliability in high current power modules.
37 Thermal reliability of power insulated gate bipolar transistor (IGBT) modules.
38 Reliability studies of leadless chip carrier assemblies using the integrated matrix creep method.
39 Innovative reliability tests as a means to shorten the product development cycle.
40 Wire interconnect technology, a new flip-chip technique.
41 Stresses in idealized triangular shaped surface mounted solder joints.
42 Solder joint reliability of large plastic ball grid array assemblies under bending, twisting, and vibration conditions.
43 Reliability testing of solder joints in surface mounted assembly using real-time holographic interferometry.
44 Thermal fatigue modeling of solder interlayer in power electronics.
45 Wire interconnect technology: A new flip chip to substrate connection method.
46 Power cycling and stress variation in a multichip module.
47 Reliability issues of replacing solder with conductive adhesives in power modules.
48 Thermal conduction and thermal stress analyses of surface-mount assembly with a solder joint element.
49 Solder joint crack initiation and crack propagation in a TSOP using strain energy partitioning.
50 Finite Element Analysis for Solder Ball Connect (SBC) Structural Design Optimization.

51 Effect of solder thickness on mechanical reliability of die-bonded chip package during chip encapsulation and accelerated thermal cycling.
52 Influence of substrate deformations on the thermal fatigue life of SMT solder joints.
53 Solder joint reliability of TSOPs-an overview.
54 Predicting thermal fatigue lifetimes for SMT solder joints.
55 A fracture mechanics approach to thermal fatigue life prediction of solder joints.
56 Fatigue analysis of flip chip assemblies using thermal stress simulations and a Coffin-Manson relation.
57 Silicon interconnect--A critical factor in device thermal management.
58 Plastic deformation kinetics of eutectic Pb-Sn solder joints in monotonic loading and low-cycle fatigue.
59 Thermal cycling reliability of electronic interconnections for automotive under the hood applications.
60 Silicon interconnect--A critical factor in device thermal management.
61 The reliability of AlN power hybrids using Cu thick film conductive.
62 Modelling of thermal fatigue failure in soft-soldered semiconductor devices using the internal variable method.
63 Solder joint reliability.Design implications from finite element modeling and experimental testing.
64 Combined vibrational and thermal solder joint fatigue.A generalized strain versus life approach.
65 Multichip packaging technology with laser-patterned interconnects.
66 Multichip packaging technology with laser-patterned interconnects.
67 Can power cycling life of solder joint interconnections be assessed on the basis of temperature cycling tests?.
68 Creep and tensile behavior of lead-rich lead-tin solder alloys.
69 CREEP AND STRESS RELAXATION IN SOLDER JOINTS OF SURFACE-MOUNTED CHIP CARRIERS.
70 VALIDITY OF CYCLIC TESTS FOR ASSESSING THE JOINTS IN SURFACE-MOUNTED ASSEMBLIES.
71 SOLDER FATIGUE DEPENDENCIES IN HYBRID ELECTRONIC PACKAGES.
72 ASSESSING THE JOINTS IN SURFACE-MOUNTED ASSEMBLIES.
73 EFFECT OF MICROSTRUCTURE AND IMPURITIES ON FATIGUE RESISTANCE OF SOFT SOLDERS.
74 ADVANCE POLYMER MATERIALS AND NEW MANUFACTURING METHODS TO CREATE HIGH DENSITY CIRCUITS FOR MICROELECTRONICS.
75 CREEP AND STRESS RELAXATION IN SOLDER JOINTS IN SURFACE-MOUNTED CHIP CARRIERS.

76 RAPIDLY SOLIDIFIED SOFT SOLDER DIE-ATTACH TECHNOLOGY.
77 METALLURGICAL BONDING TECHNOLOGY FOR POWER HYBRIDS.
78 THERMAL AND THERMOMECHANICAL ANALYSIS AND TESTING OF ELECTRONIC PACKAGING SYSTEMS.
79 EFFECT OF LEAD COPLANARITY ON PLCC SOLDER JOINT STRENGTH.
80 LAYER DAMAGE MODEL FOR CALCULATING THERMAL FATIGUE LIFETIME OF POWER DEVICES.
81 RAPIDLY SOLIDIFIED SOFT SOLDER DIE-ATTACH TECHNOLOGY.
82 ASSESSING THE JOINTS IN SURFACE-MOUNTED ASSEMBLIES.
83 DESIGN GUIDELINES FOR SURFACE MOUNT ASSEMBLIES.
84 THERMOMECHANICAL BEHAVIOR OF SOLDERED INTERCONNECTS FOR SURFACE MOUNTING: A COMPARISON OF THEORY AND EXPERIMENT.
85 RELIABILITY OF SURFACE MOUNTED SOLDER JOINTS UNDER PWB CYCLIC MECHANICAL STRESSES.
86 POWER CYCLING OF CERAMIC CHIP CARRIERS ON CERAMIC SUBSTRATES (AN ANALYSIS OF TEST RESULTS).
87 DESIGN OPTIMIZATION AND RELIABILITY TESTING OF SURFACE MOUNTED SOLDER JOINTS.
88 THERMOMECHANICAL ANALYSIS AND TESTING OF LEADLESS CERAMIC CHIP CARRIERS FOR VLSI PACKAGING.
89 LOW COST MULTIPORT MICROWAVE PACKAGE FOR GAAS ICS.
90 LOW COST MULTIPORT MICROWAVE PACKAGE FOR GAAS ICS.
91 MODULES WITH SOLDER CONTACT FOR HIGH POWER APPLICATIONS.
92 EFFECTS OF POWER CYCLING ON LEADLESS CHIP CARRIER MOUNTING RELIABILITY AND TECHNOLOGY.
93 EFFECT OF HIGH-DISSIPATION COMPONENTS ON THE SOLDER JOINTS OF CERAMIC CHIP CARRIERS ATTACHED TO THICK-FILM ALUMINA SUBSTRATES.
94 THERMAL CYCLING AND COOLING EFFECTIVENESS TESTS OF LEADLESS CHIP CARRIER ASSEMBLIES FOR MILITARY AVIONICS.
95 HOT SPOTS CAUSED BY VOIDS AND CRACKS IN THE CHIP MOUNTDOWN MEDIUM IN POWER SEMICONDUCTOR PACKAGING.
96 EFFECT OF HIGH DISSIPATION COMPONENTS ON THE SOLDER JOINTS OF CERAMIC CHIP CARRIERS ATTACHED TO THICK FILM ALUMINA SUBSTRATES.
97 FATIGUE LIFE OF LEADLESS CHIP CARRIER SOLDER JOINTS DURING POWER CYCLING.
98 EFFECT OF HIGH DISSIPATION COMPONENTS ON THE SOLDER JOINTS OF CERAMIC CHIP CARRIERS ATTACHED TO THICK FILM ALUMINA SUBSTRATES.
99 SURFACE-MOUNT SUBSTRATES: THE KEY IN GOING LEADLESS.
100 EFFECTS OF POWER CYCLING ON LEADLESS CHIP CARRIER MOUNTING RELIABILITY AND TECHNOLOGY.

101 PROPERTIES OF DIE BOND ALLOYS RELATING TO THERMAL FATIGUE.
102 THERMAL FATIGUE FAILURE OF SOFT-SOLDERED CONTACTS TO SILICON POWER TRANSISTORS.
103 RELIABILITY AND THERMAL IMPEDANCE STUDIES IN SOFT SOLDERED POWER TRANSISTORS.
104 DISSOLUTION RATES AND RELIABILITY EFFECTS OF Au, Ag, Ni AND Cu IN LEAD BASE SOLDERS.
105 Thermal fatigue in silicon power transistors.

Titres dans Banque de données INSPEC

106 Effect of solder creep on the reliability of large area die attachment.
107 Stress and strain simulation of power MOSFET solder attachment on different substrates.
108 Lead-free reflow soldering for electronics assembly.
109 C4 joints with and without an underfill and CBGA fatigue dependence on thermal cycle frequency.
110 Reliability design technology for power semiconductor modules.
111 Reliability of power cycling for IGBT power semiconductor modules.
112 Void induced thermal impedance in power semiconductor modules: some transient temperature effects.
113 Ceramic grid array technologies for ACPI applications.
114 Thermomechanical behavior of 96Sn-4Ag and Castin alloy.
115 Predicting solder joint reliability for thermal, power, and bend cycle within 25% accuracy.
116 D2BGA chip-scale IGBT package.
117 The effect of power cycling on the reliability of lead-free surface mount assemblies.
118 Rapid power cycling of flip-chip and CSP components on ceramic substrates.
119 Microstructure and intermetallic growth effects on shear and fatigue strength of solder joints subjected to thermal cycling aging.
120 Reliability studies of two flip-chip BGA packages using power cycling test.
121 Thermal analysis of power cycling effects on high power IGBT modules by the boundary element method.
122 Solder joint failure analysis using FEM techniques of a silicon based system-in-package.
123 Accelerated reliability evaluation of flip-chip joints on ceramic substrates by power cycling.
124 Reliability of PbSnAg solder layer of power modules under thermal cycling in electronic packaging.
125 Reliability assessment of PBGA solder joints using the new creep constitutive relationship and modified energy-based life prediction model.

126 Thermal deformations of CSP assembly during temperature cycling and power cycling.
127 Reliability improvement of the soldering thermal fatigue with AlSiC technology on traction high power IGBT modules.
128 High power IGBT modules: thermal fatigue resistance evaluation of the solder joints.
129 Challenges and solutions on design and assembly for CCGA.
130 Thermal-cycle tests: help!.
131 2nd level reliability investigation of a memory package using power cycling test.
132 Thermal analysis of high power IGBT modules.
133 Reliability testing of SnAgCu solder surface mount assembly.
134 Reliability and crack propagation of 9.25Pb5Sn2.5Ag solder joint under thermal cycling.
135 Time-dependent material modeling for finite element analyses of flip chips.
136 The effect of pulse width modulation (PWM) frequency on the reliability of thermoelectric modules.
137 Directionally bent alumina DBC substrates.
138 Thermomechanical fatigue testing and analysis of solder alloys.
139 Design factors in optimisation of IGBT power module heatsinks.
140 Solder joint reliability in alternator power diode assemblies.
141 Solder joint reliability of high I/O ceramic-ball-grid arrays and ceramic quad-flat-packs in computer environments: the PowerPC 603TM and PowerPC 604TM microprocessors.
142 Reliability of AlN substrates and their solder joints in IGBT power modules.
143 Long term reliability testing of HV-IGBT modules in worst case traction operation.
144 A high power IGBT module for severe operating environments.
145 Integrated flow-thermo-mechanical analysis of solder joints fatigue in a low air flow C4/CBGA package.
146 Integrated flow-thermomechanical analysis of solder joints fatigue in a low air flow C4/CBGA package.
147 Deformation behavior of two lead-free solders: Indalloy 227 and Castin alloy.
148 Characterization of thermal loading in electronic distribution boxes.
149 Reliability assessment of flip chip on board connections.
150 Reliability of high power IGBT modules testing on thermal fatigue effects due to traction cycles.

151 Thermo-mechanical analysis of solder-sealed electronic modules during power cycling.
152 Finite element modeling of solder joint reliability of ball grid array packages.
153 Anisothermal fatigue analysis of solder joints in a convective CBGA package under power cycling.
154 Deformation mechanisms in Sn-based solder materials.
155 The reliability assessment of flip chip type solder joints based on the damage integral approach.
156 Thermal fatigue damages in SMC solder joints: SEM/EDS fractography observations.
157 The effects of interfaces on C-4 solder bump reliability.
158 Reliability of direct copper bonded (DBC) substrates [power packaging].
159 Evaluation of polymeric adhesives for solder replacement in power hybrids.
160 Vibrational fatigue of surface mount solder joints.
161 Hybrid power modules using a metal matrix composite baseplate: An evaluation.
162 Semi analytic model for thermal fatigue failure of die attach in power electronic building blocks.
163 Integrated flow-thermomechanical and reliability analysis of a low air cooled flip chip-PBGA package.
164 Processing and reliability of flip-chip on board connections.
165 Electrically conductive adhesives at microwave frequencies.
166 Solder joint reliability of a lead-less RF-transistor.
167 Packaging factors affecting the fatigue life of power transistor die bonds.
168 Al/SiC baseplate hybrid power modules: evaluation of the thermomechanical performances.
169 Technical progress on printed wired assembly using Nortel's no-lead solder assemble process.
170 Heat spreader characteristics of multilayer diamond films for high frequency power devices.
171 Effect of component heterogeneity on global CTE mismatch displacement in areal-array solder interconnects.
172 Experimental studies of SMT solder joint reliability.
173 Innovative reliability tests as a means to shorten the product development cycle.
174 Wire interconnect technology, a new flip-chip technique.
175 Power cycling reliability of IGBT power modules.

176 Substrate-to-base solder joint reliability in high power IGBT modules.
177 Fatigue properties of BGA solder joints: a comparison of thermal and power cycle tests.
178 Reliability of copper baseplate high current power modules.
179 Investigation of heat sink attach methodologies and the effects on package structural integrity and interconnect reliability of the 119-lead plastic ball grid array.
180 Development of reflowable Sn-Pb alloy bump for Al pad.
181 Stress simulation of solder joints subjected to thermal cycling and the effect of materials properties and joint geometry on package reliability.
182 Creep/plastic deformation of components during power cycling of a multichip module.
183 Reliability of copper baseplate high current power modules.
184 Evaluation of lead-free solder and no-clean flux for attachment of packaged high power components to direct bond copper.
185 Thermal fatigue modeling of solder interlayer in power electronics.
186 Wire interconnect technology: a new flip chip to substrate connection method.
187 Effects of multiple ceramics on reliability in high current power modules.
188 Fatigue properties of BGA solder joints: a comparison of thermal and power cycle tests.
189 Fatigue and cyclic deformation behavior of high temperature solder alloys.
190 Reliability studies of leadless chip carrier assemblies using the integrated matrix creep method.
191 Thermal reliability of power insulated gate bipolar transistor (IGBT) modules.
192 Thermal and power cycling limits of plastic ball grid array (PBGA) assemblies.
193 Properties of thin layers of Sn62Pb36Ag2.
194 Reliability testing of solder joints in surface mounted assembly using real-time holographic interferometry.
195 Solder wire die bond process characterisation study.
196 Reliability of die bond joint for power IC devices.
197 Power cycling and stress variation in a multichip module.
198 Reliability issues of replacing solder with conductive adhesives in power modules.
199 Solder joint crack initiation and crack propagation in a TSOP using strain energy partitioning.
200 Direct-bond copper substrate shrinks 1500 W frequency converter.

201 Study of the thermomechanical problems in hybrid assemblies satisfying the automotive electronics conditions.
202 Finite element analysis for solder ball connect (SBC) structural design optimization.
203 Influence of substrate deformations on the thermal fatigue life of SMT solder joints.
204 Development of a cost-effective and flexible bumping method for flip-chip interconnections.
205 Solder joint reliability of leaded and leadless components mounted on multiple substrate materials.
206 Predicting thermal fatigue lifetimes for SMT solder joints.
207 A fracture mechanics approach to thermal fatigue life prediction of solder joints.
208 Plastic deformation kinetics of eutectic Pb-Sn solder joints in monotonic loading and low-cycle fatigue.
209 Fatigue analysis of flip chip assemblies using thermal stress simulations and a Coffin-Manson relation.
210 Thermal cycling reliability of interconnections to low temperature fired/cofired ceramics.
211 Thermal fatigue failures of large scale package type power transistor modules.
212 The reliability of AlN power hybrids using Cu thick film conductive.
213 Silicon interconnect-a critical factor in device thermal management.
214 Silicon interconnect-a critical factor in device thermal management.
215 Modelling of thermal fatigue failure in soft-soldered semiconductor devices using the internal variable method.
216 Solder joint reliability-design implications from finite element modeling and experimental testing.
217 Combined vibrational and thermal solder joint fatigue-a generalized strain versus life approach.
218 Can power cycling life of solder joint interconnections be assessed on the basis of temperature cycling tests?.
219 Multichip packaging technology with laser-patterned interconnects.
220 Multichip packaging technology with laser-patterned interconnects.
221 Power cycling of Kevlar and copper-invar-copper printed wiring assemblies.
222 Fatigue life in temperature cycling environments.
223 Surface-mount attachment reliability of clip-leaded ceramic chip carriers on FR-4 circuit boards.
224 Are SMT solder joints reliable?.
225 Creep and tensile behavior of lead-rich lead-tin solder alloys.

226 The effect of pretinning on the strength of a chip carrier solder joint.
227 Advanced polymer materials and new manufacturing methods to create high density circuits for microelectronics.
228 Creep and stress relaxation in solder joints in surface-mounted chip carriers.
229 Modules using solder contact technology with high power cycling fatigue stability for high power applications.
230 The effect of microstructure and impurities on fatigue resistance of soft solders.
231 Design guidelines for surface mount assemblies.
232 Surface mounting reliability.
233 A layer damage model for calculating thermal fatigue lifetime of power devices.
234 Rapidly solidified soft solder die-attach technology.
235 Design optimization and reliability testing of surface mounted solder joints.
236 The reliability of surface mounted solder joints under PWB cyclic mechanical stresses.
237 Assessing the joints in surface-mounted assemblies.
238 The reliability of surface mounted solder joints under PWB cyclic mechanical stresses.
239 Thermomechanical behavior of soldered interconnects for surface mounting: a comparison of theory and experiment.
240 Thermomechanical analysis and testing of leadless ceramic chip carriers for VLSI packaging.
241 A low cost multiport microwave package for GaAs ICs.
242 SMT, shielding needs drive changes in chemicals and materials.
243 Power cycling of ceramic chip carriers on ceramic substrates (an analysis of test results).
244 Modules with solder contacts for high power applications.
245 Effect of high-dissipation components on the solder joints of ceramic chip carriers attached to thick-film alumina substrates.
246 The effect of high dissipation components on the solder joints of ceramic chip carriers attached to thick film alumina substrates.
247 Fatigue life of leadless chip carrier solder joints during power cycling.
248 Voids, cracks, and hot spots in die attach (power semiconductor packages).
249 Hot spots caused by voids and cracks in die attach.
250 The effect of high dissipation components on the solder joints of ceramic chip carriers attached to thick film alumina substrates.

251 Thermal deformations observed in leadless ceramic chip carriers surface mounted to printed wiring boards.
252 Use of high I/O chip carriers on PWBs.
253 Effects of power cycling on leadless chip carrier mounting reliability and technology.
254 Properties of die bond alloys relating to thermal fatigue.
255 Thermal fatigue failure of soft-soldered contacts to silicon power transistors.
256 Plastic power reliability.
257 Dissolution rates and reliability effects of Au, Ag, Ni and Cu in lead base solders (power transistor die bonding).

  [1] :  [ART188]  W.D. ZHUANG, P.C. CHANG, F.Y. CHOU, R.K. SHIUE, Effect of solder creep on the reliability of large area die attachment, Microelectronics Reliability, Vol. 41, No 12, December 2001, pp. 2011-2021
  [2] :  [ART189]  Reliability of power cycling for IGBT power semiconductor modules, 2001.
  [3] :  [ART190]  Thermal analysis of power cycling effects on high power IGBT modules by the boundary element method, 2001.
  [4] : [SHEET355] Z. KHATIR, S. LEFEBVRE, Thermal analysis of high power IGBT modules, ISPSD'2000, Toulouse, France, May 22-25, 2000, pp. 271-274.
  [5] :  [ART192]  V.A. SANKARAN, C. CHEN, C.S. AVANT, X. XU, Power cycling reliability of IGBT power modules, IAS Annual Meeting, 1997.
  [6] :  [ART193]  Deformation measurements of surface mount assembly under power cycling using optical interferometry, 1996.
  [7] :  [ART194]  CREEP AND STRESS RELAXATION IN SOLDER JOINTS OF SURFACE-MOUNTED CHIP CARRIERS, 1987.

  [8] :  [ART195]  Reliability design technology for power semiconductor modules, 2001.
  [9] :  [ART196]  Void induced thermal impedance in power semiconductor modules: some transient temperature effects, 2001.
 [10] :  [ART197]  Predicting solder joint reliability for thermal, power, and bend cycle within 25% accuracy, 2001.
 [11] :  [ART198]  J.-M. THEBAUD, E. WOIRGARD, C. ZARDINI, K.-H. SOMMER, High power IGBT modules: thermal fatigue resistance evaluation of the solder joints, 2000.
 [12] :  [ART199]  Thermal-cycle tests: help !, 2000.
 [13] :  [ART200]  Design factors in optimisation of IGBT power module heatsinks, 1999.
 [14] :  [ART201]  Solder joint reliability in alternator power diode assemblies, 1999.
 [15] : [SHEET336] Y.H. PAO, W. JUNG, R. COOPER, V.A. SANKARAN, X. XU, Thermal Fatigue Modeling of Solder Interlayer in Power Electronics, Advances in Electronic Packaging, 1995, vol. 10, pp. 1059-1068.
 [16] :  [ART203]  Modelling of thermal fatigue failure in soft-soldered semiconductor devices using the internal variable method, 1990.
 [17] :  [ART204]  Can power cycling life of solder joint interconnections be assessed on the basis of temperature cycling tests?, 1989.
 [18] :  [ART205]  Creep and tensile behavior of lead-rich lead-tin solder alloys, 1988.
 [19] :  [ART206]  Modules with solder contacts for high power applications, 1984.
 [20] :  [ART207]  Plastic power reliability, 1976.
 [21] :  [ART208]  Dissolution rates and reliability effects of Au, Ag, Ni and Cu in lead base solders (power transistor die bonding), 1973.

Question : power cycling and electronic device

Titres dans Banque de données INSPEC
5 How to extend a thermal-RC-network model (derived from experimental data) to respond to an arbitrarily fast input.
6 Interfacial integrity in electronic packaging.
7 Almost everything the designer wants to know about batteries but doesn't know who to ask.
8 A powerful NMR field-cycling device using GTOs and MOSFETs for relaxation dispersion and zero-field studies.

  [1] :  [ART209]  THERMAL AND THERMOMECHANICAL ANALYSIS AND TESTING OF ELECTRONIC PACKAGING SYSTEMS, 1986.

Question : power cycling and electronic

Réponses : 77 dans COMPENDEX
Réponses : 92 dans INSPEC
Titres dans Banque de données COMPENDEX
1 Power module lifetime estimation from chip temperature direct measurement in an automotive traction inverter.
2 Lead-free reflow soldering for electronics assembly.
3 Model and applications for harmonic analysis of AC/DC power systems coupled by power electronic converters in high-power industrial drives.
4 Microstructure and intermetallic growth effects on shear and fatigue strength of solder joints subjected to thermal cycling aging.
5 Simulating package behavior under power dissipation using uniform thermal loading.
6 Solder joint reliability in alternator power diode assemblies.
7 Reducing MOSFET 1/f noise and power consumption by switched biasing.
8 Method of isothermalization for passive elements in an electronics system.
9 Assessment of selected CERES electronic component survivability under simulated overvoltage conditions.
10 New developments in separators for valve-regulated lead-acid batteries.
11 Mathematical modeling of electrochemical capacitors.
12 Meeting the challenges of the distributed power environment.
13 Integrating chip carrier packaging technology into avionic systems.
14 HASS from concept to completion.
15 Bi-directional power control for flywheel energy storage system with vector-controlled induction machine drive.
16 Thermal characterization and heat transfer analysis of a wire bond chip-on-board package.
17 Vibrational fatigue of surface mount solder joints.
18 Smart ice detection systems based on resonant piezoelectric transducers.
19 Technical progress on printed wired assembly using Nortel's no-lead solder assembly process.
20 How to extend a thermal-RC-network model (derived from experimental data) to respond to an arbitrarily fast input.
21 Effect of component heterogeneity on global CTE mismatch displacement in areal-array solder interconnects.
22 Rare earth based metal hydrides and NiMH rechargeable batteries.
23 Power-cycling-stability of IGBT-modules.
24 Reliability studies of leadless chip carrier assemblies using the integrated matrix creep method.
25 Space-qualified superconductive digital instantaneous frequency-measurement subsystem.

26 Innovative reliability tests as a means to shorten the product development cycle.
27 Method of reliability improvement using accelerated testing methodologies.
28 Reliability testing of solder joints in surface mounted assembly using real-time holographic interferometry.
29 Cycle-life improvement of Li/LiCoO2 batteries.
30 Defeating power-on intermittent failures.
31 Thermal fatigue modeling of solder interlayer in power electronics.
32 Application & use of power operated relief valves capable of hundreds of operating cycles without overhaul.
33 Experimental analysis of thermal cycling fatigue of four-layered FR4 printed wiring boards.
34 Power-temperature cycle accelerated testing.
35 Test results of superconducting AC magnets for magnetic refrigeration experiment.
36 New thin-layer solid state lithium polymer batteries.
37 Mechanical analysis process for electronic packaging.
38 Transient thermal behaviour of a board-mounted 160-lead plastic quad flat pack.
39 Solder joint crack initiation and crack propagation in a TSOP using strain energy partitioning.
40 Experimental analysis of thermal cycling fatigue of four-layered FR4 printed wiring boards.
41 Effect of solder thickness on mechanical reliability of die-bonded chip package during chip encapsulation and accelerated thermal cycling.
42 Failure analysis of power modules: A look at the packaging and reliability of large IGBT's.
43 Solder joint reliability of TSOPs-an overview.
44 Magnetoresistive sensors.
45 Analysis and simulation of thermal transients and resultant stresses and strains in TAB packaging.
46 A fracture mechanics approach to thermal fatigue life prediction of solder joints.
47 A study and evaluation of power electronic based adjustable speed motor drives for air conditioners and heat pumps with an example utility case study of the Florida Power and Light Company.
48 Transient analysis of the AGS-booster ring dipole and quadrupole magnet system.
49 Switchable 10 Hz/1 Hz LEB magnet power supply system.
50 Thermal cycling reliability of electronic interconnections for automotive under the hood applications.

51 Analysis and simulation of thermal transients and resultant stresses and strains in tab packaging.
52 Electron trapping for mass data storage memory.
53 What is wrong with the existing reliability prediction methods?.
54 Tuning magnet power supply.
55 Combined vibrational and thermal solder joint fatigue.A generalized strain versus life approach.
56 Creep and tensile behavior of lead-rich lead-tin solder alloys.
57 Thermal stress screening enhances automotive electronics.
58 BIN VIBRATORS OFFER COST EFFECTIVE ALTERNATIVE TO BIN ACTIVATOR.
59 THERMAL CYCLING STRESS SCREEN - A MAGIC BULLET.
60 VALIDITY OF CYCLIC TESTS FOR ASSESSING THE JOINTS IN SURFACE-MOUNTED ASSEMBLIES.
61 SOLDER FATIGUE DEPENDENCIES IN HYBRID ELECTRONIC PACKAGES.
62 BURN-IN - NON SEQUITUR OF THE 1980.
63 METALLURGICAL BONDING TECHNOLOGY FOR POWER HYBRIDS.
64 COMPARATIVE STUDY OF ADJUSTABLE-SPEED DRIVES FOR HEAT PUMPS.
65 THERMAL AND THERMOMECHANICAL ANALYSIS AND TESTING OF ELECTRONIC PACKAGING SYSTEMS.
66 CHIP CARRIER ON CERAMIC THICK FILM MULTILAYER BOARDS IN HIGH RELIABILITY APPLICATIONS.
67 POWER CYCLING BURN-IN.
68 STORAGE RELIABILITY WITH PERIODIC TEST.
69 LOW LEVEL ENVIRONMENTAL STRESS SCREENING.
70 SHAKE AND BAKE - SHAPE YOUR FUTURE.
71 TEMPERATURE-CYCLED OPERATIONAL SCREEN FOR AUTOMOTIVE ELECTRONIC CONTROL UNITS.
72 THREE-TERMINAL VOLTAGE REGULATORS.
73 MICROWAVE COMPATIBLE MIC TEMPERATURE ELECTRODE FOR USE IN BIOLOGICAL DIELECTRICS.
74 VACUUM DEPOSITED TED'S FOR ELECTRONIC DEVICE CHIP COOLING.
75 RELIABILITY AND THERMAL IMPEDANCE STUDIES IN SOFT SOLDERED POWER TRANSISTORS.

76 PULSED CURRENT SOURCE WITH ENERGY RECUPERATION.
77 Safety considerations in the selections of switches and relays.

Titres dans Banque de données INSPEC

78 Model and applications for harmonic analysis of AC/DC power systems coupled by power electronic converters in high-power industrial drives.
79 Thermomechanical behavior of 96Sn-4Ag and Castin alloy.
80 Predicting solder joint reliability for thermal, power, and bend cycle within 25% accuracy.
81 The effect of power cycling on the reliability of lead-free surface mount assemblies.
82 New method of harmonic analysis of power electronic converter and cycloconverter for high-power industrial drives.
83 Microstructure and intermetallic growth effects on shear and fatigue strength of solder joints subjected to thermal cycling aging.
84 Reliability of PbSnAg solder layer of power modules under thermal cycling in electronic packaging.
85 Simulating package behavior under power dissipation using uniform thermal loading.
86 Novel thermal interface material with aligned conductive fibers.
87 Reliability and crack propagation of 9.25Pb5Sn2.5Ag solder joint under thermal cycling.
88 Time-dependent material modeling for finite element analyses of flip chips.
89 Reducing MOSFET 1/f noise and power consumption by switched biasing.
90 Method of isothermalization for passive elements in an electronics system.
91 Mathematical modeling of electrochemical capacitors.
92 3-layered 3D flex based MCM: electrical characterization and reliability issues.
93 Solder joint reliability in alternator power diode assemblies.
94 Meeting the challenges of the distributed power environment.
95 New developments in separators for valve-regulated lead-acid batteries.
96 Characterization of thermal loading in electronic distribution boxes.
97 Comparison of electronic modules in SMT on a thick film substrate and on a printed circuit board.
98 Thermo-mechanical analysis of solder-sealed electronic modules during power cycling.
99 Mathematical modeling of electrochemical capacitors.
100 Let HALT improve your product.

101 Deformation mechanisms in Sn-based solder materials.
102 Characterization, modeling and thermal cycle life testing of large value ceramic capacitors for high temperature (to 500 degrees C) applications.
103 Thermal fatigue damages in SMC solder joints: SEM/EDS fractography observations.
104 Materials selection issues for high operating temperature (HOT) electronic packaging.
105 Reliability of direct copper bonded (DBC) substrates [power packaging].
106 HASS from concept to completion [Highly Accelerated Stress Screening].
107 Vibrational fatigue of surface mount solder joints.
108 Semi analytic model for thermal fatigue failure of die attach in power electronic building blocks.
109 Thermal characterisation and heat transfer analysis of a wire bond chip-on-board package.
110 Bi-directional power control for flywheel energy storage system with vector-controlled induction machine drive.
111 Technical progress on printed wired assembly using Nortel's no-lead solder assemble process.
112 Smart ice detection systems based on resonant piezoelectric transducers.
113 How to extend a thermal-RC-network model (derived from experimental data) to respond to an arbitrarily fast input.
114 Power-gated spectral holeburning in MgS:Eu2+, Eu3+: A case for high-density persistent spectral holeburning.
115 Effect of component heterogeneity on global CTE mismatch displacement in areal-array solder interconnects.
116 Rare earth based metal hydrides and NiMH rechargeable batteries.
117 Innovative reliability tests as a means to shorten the product development cycle.
118 Composite carbon electrodes for high capacitance supercapacitors (3 volts, 300 to 1000 farads).
119 A mathematical model of an electrochemical capacitor with porous electrodes.
120 Interface degradation in metal-matrix composites under cyclic thermo-mechanical loading.
121 Stress simulation of solder joints subjected to thermal cycling and the effect of materials properties and joint geometry on package reliability.
122 Electronic structure and dynamics of muonium in semiconductors.
123 Spectral hole burning study of electron-phonon coupling in polymers.
124 Thermal fatigue modeling of solder interlayer in power electronics.
125 Reliability studies of leadless chip carrier assemblies using the integrated matrix creep method.

126 Interfacial integrity in electronic packaging.
127 Space-qualified superconductive digital instantaneous frequency-measurement subsystem.
128 An innovation in thermoplastic, reworkable adhesive pastes.
129 Stress can make or break a business (circuit board testing).
130 Silicon carbide reinforced aluminium composites for thermal management of surface mounted components.
131 Cycle-life improvement of Li/LiCoO2 batteries.
132 Solder joint crack initiation and crack propagation in a TSOP using strain energy partitioning.
133 Mechanical analysis process for electronic packaging.
134 Power-temperature cycle accelerated testing.
135 Transient thermal behaviour of a board-mounted 160-lead plastic quad flat pack.
136 Study of the thermomechanical problems in hybrid assemblies satisfying the automotive electronics conditions.
137 New thin-layer solid state lithium polymer batteries.
138 Experimental analysis of thermal cycling fatigue of four-layered FR4 printed wiring boards.
139 Burn-in apparatus for electronic stress screening of electronic power supplies.
140 Almost everything the designer wants to know about batteries but doesn't know who to ask.
141 Electronic fuses protect cable, network transformers.
142 Analysis and simulation of thermal transients and resultant stresses and strains in TAB packaging.
143 Applying transient voltage surge suppression devices.
144 Solder joint reliability of leaded and leadless components mounted on multiple substrate materials.
145 A fracture mechanics approach to thermal fatigue life prediction of solder joints.
146 A study and evaluation of power electronic based adjustable speed motor drives for air conditioners and heat pumps with an example utility case study of the Florida Power and Light Company.
147 Thermal cycling reliability of interconnections to low temperature fired/cofired ceramics.
148 What is wrong with the existing reliability prediction methods?.
149 Combined vibrational and thermal solder joint fatigue-a generalized strain versus life approach.
150 Continuous-flow ESS minimizes defects.

151 Can power cycling life of solder joint interconnections be assessed on the basis of temperature cycling tests?.
152 The 'new' approach to environmental test. I.
153 Fatigue life in temperature cycling environments.
154 Environmental stress screening. The quest for quality.
155 The aging of resonators and oscillators under various test conditions.
156 Reliability of an electronic assembly: a case history.
157 A powerful NMR field-cycling device using GTOs and MOSFETs for relaxation dispersion and zero-field studies.
158 Nuclear quadrupole resonance: the present state and further development.
159 Aging/seismic correlation research: phase 2 results.
160 Microsystem reliability testing.
161 Thermal deformations observed in leadless ceramic chip carriers surface mounted to printed wiring boards.
162 Test methods (for electronic components).
163 A microwave compatible MIC temperature electrode for use in biological dielectrics.
164 Acid copper plating on PCBs.
165 Solid state electronic control (for water distribution valves).
166 High pulse power failure of discrete resistors.
167 To cycle or not to cycle-the trade-off is the question.
168 Wet electronic developments.
169 Safety considerations in the selections of switches and relays.

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  [2] :  [ART211]  Thermal cycling reliability of electronic interconnections for automotive under the hood applications, 1991.
  [3] :  [ART212]  POWER CYCLING BURN-IN, 1982.
  [4] :  [ART213]  Model and applications for harmonic analysis of AC/DC power systems coupled by power electronic converters in high-power industrial drives, 2001.
  [5] :  [ART214]  Characterization of thermal loading in electronic distribution boxes, 1997.
  [6] :  [ART215]  Materials selection issues for high operating temperature (HOT) electronic packaging, 1998.
  [7] : [SHEET321] R. SUNDARARAJAN, P. McCLUSKEY, S. AZARM, Semi analytic model for thermal fatigue failure of die attach in power electronic building blocks, 4th High Temperature Electronics Conference, 1998, pp.99-102.
  [8] : [SHEET336] Y.H. PAO, W. JUNG, R. COOPER, V.A. SANKARAN, X. XU, Thermal Fatigue Modeling of Solder Interlayer in Power Electronics, Advances in Electronic Packaging, 1995, vol. 10, pp. 1059-1068.
  [9] :  [ART216]  Burn-in apparatus for electronic stress screening of electronic power supplies, 1994.
 [10] :  [ART217]  Reliability of an electronic assembly: a case history, 1987.
 [11] :  [ART202]  Test methods (for electronic components), 1982.
 [12] :  [ART191]  High pulse power failure of discrete resistors, 1975.

Recherche LMP du 7 mai 2002

  [1] : [99ART139] KOGA T., YAMAZAKI K., WAKIMOTO H., TAKAHASHI Y., KIRIHATA H., SEKI Y., Ruggedness and reliability of the 2.5 kV-1.8 kA power pack IGBT with a novel multi-collector structure, ISPSD'98, pp. 437-440, 3-6 June 1998.

  [2] :  [PAP404]  P. COVA, F. FANTINI, On the effect of power cycling stress on IGBT modules, Microelectronics Reliability, Volume 38, Issues 6-8, 8 June 1998, pp. 1347-1352.
  [3] :  [PAP413]  P. COVA, G. NICOLETTO, A. PIRONDI, M. PORTESINE, M. PASQUALETTI, Power cycling on press-pack IGBTs: measurements and thermomechanical simulation, Microelectronics Reliability, Volume 39, Issues 6-7, June - July 1999, pp. 1165-1170.
  [4] :  [PAP224]  P. REY, E. WOIRGARD, J.-M. THEBAUD, C. ZARDINI, Evaluation of the creep of the Sn62Pb36Ag2 solder alloy by the measurement of the stresses in a silicon die, IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, Vol. 21, Issue
  [5] :  [PAP429]  R.L. Shook, T.R. Conrad, Accelerated Life Performance Of Moisture Damaged Plastic Surface Mount Devices, 93227.
  [6] :  [PAP310]  R. BLISH, N. DURRANT, Semiconductor Device Reliability Failure Models, International SEMATECH, Technology Transfer # 00053955A-XFR, May 31, 2000, 34 pages.
  [7] :  [PAP360]  T. LEQUEU, Les tests en fiabilité, rapport interne LMP, novembre 2001.
  [8] :  [PAP371]  R. Schlegel, E. Herr, F. Richter, Reliability of non-hermetic pressure contact IGBT modules, ESREF'2001, pp. 1689-1694
  [9] :  [PAP372]  G. COQUERY, S. CARUBELLI, J.P. OUSTEN, R. LALLEMAND, F. LECOQ, D. LHOTELLIER, V. DE VIRY, PH. DUPUY, Power module lifetime estimation from chip temperature direct measurement in an automotive traction inverter, ESREF'2001, pp. 1695-1700

 [10] : [SHEET005] R. BARTHELMEß, M. BEUERMANN, N. WINTER, New Fast Diodes With Pressure Contact for GCT / IGBT Converters, PCIM-Conference 1999, Nuremberg.
 [11] : [SHEET119] G. COQUERY, R. LALLEMAND, D. WAGNER, M. PITON, H. BERG, K. SOMMER, Reliability improvement of the soldering thermal fatigue with AlSiC technology on traction high power IGBT modules, EPE'99, paper 904, 1999.
 [12] : [SHEET121] G. COQUERY, R. LALLEMAND, D. WAGNER, P. GIBARD, Reliability of the 400 A IGBT modules for traction converters. Contribution on the power thermal fatigue influence on life expancy, EPE'95, vol. 1, pp. 60-65.
 [13] : [SHEET122] A. HAMIDI, G. COQUERY, R. LALLEMAND, Reliability of high power IGBT modules. Testing on thermal fatigue effects due to traction cycles, Proc. of EPE Conf., Trondheim, September 1997, vol. 3, pp. 3.118-3.123.
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 [28] : [SHEET291] Y. TAKAHASHI, K. YOSHIKAWA, M. SOUTOME, T. FUJII, M. ICHIJYOU, M.Y. SEKI, 2.5 kV-1000 A power pack IGBT (high power flat-packaged RC-IGBT)
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 [30] : [SHEET316] Q. YAO, J. QU, S.X. WU, Solder fatigue life in two chip scale packages, 1999.
 [31] : [SHEET318] J. NADERMAN, R.T.H. ROGEN, Thermal resistance degradation of surface mounted power devices during thermal cycling, Microelectronics and Reliability, Vol. 39, No 1, January 1999, pp. 123-132.
 [32] : [SHEET321] R. SUNDARARAJAN, P. McCLUSKEY, S. AZARM, Semi analytic model for thermal fatigue failure of die attach in power electronic building blocks, 4th High Temperature Electronics Conference, 1998, pp.99-102.
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 [34] : [SHEET355] Z. KHATIR, S. LEFEBVRE, Thermal analysis of high power IGBT modules, ISPSD'2000, Toulouse, France, May 22-25, 2000, pp. 271-274.
 [35] : [SHEET357] G. COQUERY, Les modules IGBT de forte puissance. Leur essor dans les applications de traction ferroviaire, REE no. 9, pp. 52-59, Octobre 1998, Paris.
 [36] : [SHEET361] A. HAMIDI, N. BECK, K. THOMAS, E. HERR, Reliability and lifetime evaluation of different wire bonding technologies for high power IGBT modules, ESREF'99.
 [37] : [SHEET362] A. HAMIDI, G. COQUERY, R. LALLEMAND, Effects of current density and chip temperature distribution on lifetime of high power IGBT modules in traction working conditions, Microelectronics and Reliability, vol. 37, no. 10-11, Oct-Nov, 1997, pp. 1755-1758.
 [38] : [SHEET396] C. Hager, A. Stuck, Y. Tronel, R. Zehringer, W. Fichtner, Comparison between Finite-Element and Analytical Calculations for the Lifetime Estimation of Bond Wires in IGBT Modules, ISPSD'2000, pp. 291-294.

 [39] : [SHEET516] G. COQUERY, R. LALLEMAND, Failure criteria for long term Accelerated Power Cycling Test linked to electrical turn off SOA on IGBT module. A 4000 hours test on 1200A-3300V module with AlSiC base plate, ESREF'2000, pp. 1665-1670.
 [40] : [SHEET533] G. COQUERY, R. LALLEMAND, Durée de vie des modules IGBT pour la traction ferroviaire. Apport de la technologie AlSiC. Critères de défaillance, méthodologie, normalisation, EPF'2000, 4 pages.

 [41] : [REVUE134] PCIM Europe, Power Electronic - Components - Technology - Applications - Systems, no 05/2000.
 [42] : [REVUE172] Elsevier Science, Microelectronics Reliability, Volume 39, Issues 6-7, Pages 721-1170, June - July 1999.
 [43] : [REVUE190] Elsevier Science, Microelectronics Reliability, Vol. 40, Issue 8-10, pp. 1243-1770, august-october 2000.
 [44] : [REVUE218] Elsevier Science, Microelectronics Reliability, Volume 41, Issue 4, Pages 481-624, April 2001.
 [45] : [REVUE219] Elsevier Science, Microelectronics Reliability, Volume 41, Issue 5, Pages 625-777, May 2001.
 [46] : [REVUE233] Elsevier Science, Microelectronics Reliability, Volume 39, Issue 1, Pages 1-149, January 1999.
 [47] : [REVUE253] Elsevier Science, Microelectronics Reliability, Volume 38, Issues 6-8, Pages 851-1366, 8 June 1998.
 [48] : [REVUE279] Elsevier Science, Microelectronics Reliability, Volume 41, Issues 9-10, Pages 1273-1736, September - October 2001.

 [49] : [LIVRE137] T.I. BAJENESCU, M.I. BAZU, Reliability of electronics components - A practical guide to electronic systems manufacturing, Springer, 1999, 509 pages.

Ajout du 11 mai 2002

  [1] :  [PAP401]  H. BERG, E. WOLFGANG, Advanced IGBT modules for railway traction applications: Reliability testing, Microelectronics Reliability, Volume 38, Issues 6-8, 8 June 1998, pp. 1319-1323.
  [2] :  [ART218]  P. COVA, M. CIAPPA, G. FRANCESCHINI, P. MALBERTI, F. FANTINI, Thermal characterization of IGBT power modules, Microelectronics Reliability, Vol. 37, Issues 10-11, October 1997, pp. 1731-1734.
  [3] :  [ART219]  M. CIAPPA, P. MALBERTI, Plastic Strain of Aluminum Bond Wires in IGBT Multichip Modules under Thermal Cycling, Quality and Reliab. Engin. Int., Vol. 12, 1996, pp. 297-303
  [4] :  [ART220]  M. HIERHOLZER, Application of high-power IGBT modules, Proc. PCIM 96, 1996, 26.
  [5] :  [ART221]  K. SOMMER, J. GOTTERT, G. LEFRANC, R. SPANKE, Multi-chip high-power IGBT modules for traction and industrial application, Proc. EPE' 97, Trondheim, Norway, September 22-24, pp. 512-515.
  [6] :  [ART222]  G. Lefranc, G. et al AISiC improves re1iability of IGBT power modules, Int. conference composite materials, Proc. ICCM 12, Paris, 1999.
  [7] :  [ART223]  E. HERR, T. FREY, R. SCHLEGEL, A. STUCK, R. ZEHRINGER, Substrate to base solder joint reliability in high-power IGBT modules, Microelectron. Reliab. Vol. 37, 1997, pp. 1719-1722.
  [8] :  [ART224]  K. OHGA, Failure analysis of bonding wires in power transistor modules, Proc. ISTFA, 237-247, Los Angles, USA, 1991.
  [9] :  [ART225]  P. MALBERTI, M. CIAPPA, R. CATTOMIO, A power-cycling-induced failure mechanism of IGBT multichip modules, Proc. ISTFA, 163-168, Santa Clara, USA, 1995.
 [10] :  [ART226]  T. STOCKMEIER, R. BAYERER, D. SINERIUS, E. HERR, U. THIEMANN, Reliable 1200 A, 2500 V  IGBT Modules For Traction Applications, IEE Colloquium on IGBT Propulsion Drives, London, 1995.

 [11] :  [ART227]  M. CIAPPA, Selected failure mechanisms of modern power modules, Microelectronics Reliability, Volume 42, Issues 4-5, April-May 2002, pp. 653-667.
 [12] :  [ART228]  L. CIAMPOLINI, M. CIAPPA, P. MALBERTI, P. REGLI, W. FICHTNER, Modelling thermal effects of large contiguous voids in solder joints, Microelectronics Journal, Volume 30, Issue 11, November 1999, pp. 1115-1123.
 [13] :  [ART229]  T. ALANDER, S. NURMI, P. HEINO, E. RISTOLAINEN, Impact of component placement in solder joint reliability, Microelectronics Reliability, Volume 42, Issue 3, March 2002, pp. 399-406.
 [14] :  [ART230]  M. AMAGAI, Mechanical reliability in electronic packaging, Microelectronics Reliability , Volume 42, Issues 4-5, April-May 2002, pp. 607-627.
 [15] :  [ART231]  J.A. van der POL, H.J. Gerritsena, R.T.H. Rongena, P.P.M.C. Groenevelda, P.W. Ragaya, H.A. van den Hurk, Reliability issues in 650V high voltage bipolar-CMOS-DMOS integrated circuits, Microelectronics and Reliability, Volume 37, Issues 10-11, 11 October
 [16] :  [ART232]  Y.S. CHUNG,  B. BAIRD, Power capability limits of power MOSFET devices, Microelectronics Reliability, Volume 42 , Issues 2, February 2002, pp. 211-218.
 [17] :  [ART233]  H. YE, M. LIN, C. BASARAN, Failure modes and FEM analysis of power electronic packaging, Finite Elements in Analysis and Design, Volume 38 , Issues 7, May 2002, pp. 601-612.
 [18] :  [ART234]  B. K. JONES, Logarithmic distributions in reliability analysis, Microelectronics Reliability, Volume 42, Issues 4-5, April-May 2002, pp. 779-786.
 [19] :  [ART235]  F. S. LOMELI, A. CERDEIRA, Precise  macromodel applied to high-voltage power MOSFET, Microelectronics Reliability, Volume 42, Issues 1, January 2002, pp. 149-152.
 [20] :  [ART236]  R.D. PENDSE, P. ZHOUB, Methodology for predicting solder joint reliability in semiconductor packages, Microelectronics Reliability, Volume 42, Issues 2, February 2002, pp. 301-305.

 [21] :  [ART237]  R. QUINTERO, A. CERDEIRA, A. ORTIZ-CONDE, Quasi-three-dimensional spice-based simulation of the transient behavior, including plasma spread, of thyristors and over-voltage protectors, Microelectronics Reliability, Volume 42, Issues 1, January 2002, pp.
 [22] :  [ART238]  N. Y. A. SHAMMAS, M. P. RODRIGUEZ, F. MASANA, A simple method for evaluating the transient thermal response of semiconductor devices, Microelectronics Reliability, Volume 42, Issues 1, January 2002, pp. 109-117.
 [23] :  [ART239]  N. STOJADINOVIC, I. MANIC, S. DJORIC-VELJKOVIC, V. DAVIDOVIC, S. GOLUBOVIC, S. DIMITRIJEV, Effects of high electric field and elevated-temperature bias stressing on radiation response in power VDMOSFETs, Microelectronics Reliability, Volume 42, Issues 4
 [24] :  [ART240]  V. SZEKELY, Enhancing reliability with thermal transient testing, Microelectronics Reliability, Volume 42, Issues 4-5, April-May 2002, pp. 629-640.

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