Article : [SHEET144]

Info : COMPENDEX Answer Number 20 - 22/02/2000

Titre : C. BASARAN, R. CHANDAROY, Finite element simulation of the temperature cycling tests, 1997.

Cité dans : [DATA152] Recherche sur l'auteur M. PECHT, octobre 2002.
Cité dans : [DATA035] Recherche sur les mots clés thermal + fatigue + semiconductor et reliability + thermal + cycle, mars 2004.
Cité dans :[DIV194]

Source : IEEE Transactions on Components, Packaging, and Manufacturing Technology Part A v 20 n 4
Date : Dec 1997
Pages : 530 - 536
CODEN : IMTAEZ
ISSN : 1070-9886
Language : English
Stockage : Thierry LEQUEU
Logiciel : oui
Lien : private/BASARAN.pdf - 7 pages, 178 Ko

Abstract :
Temperature cycling tests are commonly used in the semiconductor
industry to determine the number of cycles to failure and to predict
reliability of the solder joints in the surface mount technology
packages.In this paper, the thermomechanical fatigue of Pb40/Sn60
solder joint in a leadless ceramic chip carrier package is studied
and temperature cycling test is simulated by using a finite element
procedure with the disturbed state concept (DSC) constitutive
models.The progress of disturbance (damage) and the energy
dissipated in the solder joint during thermal cycling are
predicted.It is shown that the disturbance criterion used follows a
similar path as the energy dissipation in the system.Moreover, the
comparisons between the test data and the finite element analysis
show that a finite element procedure using the DSC material models
can be instrumental in reliability analysis and to predict the
number of cycles to failure of a solder joint. Furthermore, the
analysis gives a good picture of the progress of the failure
mechanism and the disturbance in the solder joint. (Author abstract)

Accession_Number : 1998(12):2837

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Cemal Basaran received the M.S. degree from the Massachusetts Institute of Technology, Cambridge,
and the Ph.D. degree from the University of Arizona, Tucson.
He is an Assistant Professor in the Department of Civil, Structural, and Environmental Engineering,
State University of New York, Buffalo. His research interest is in experimental and computational
reliability study of interconnects and interfaces in electronic packaging under combined dynamic and
thermal loading.
Dr. Basaran received the DoD ONR Young Investigator Award for his research on damage mechanics of power electronic packaging interconnects
and interfaces in 1997.

Rumpa Chandaroy received the M.S. degree from the State University of New York, Buffalo, and is
currently pursuing the Ph.D. degree in thermomechanical response of solder joints under concurrent
dynamic and thermal cycling loading at the Department of Civil, Structural, and Environmental
Engineering.
Ms. Chandaroy received the India National Scholarship.

  [1] : [SHEET323] H.D. SOLOMON, Low cycle fatigue of 60/40 solder plastic strain limited vs. displacement limited testing, Electron. Packag.: Mater. Processes, pp. 29-47, 1989.
  [2] : [SHEET324] H.D. SOLOMON, E.D. TOLKSDORF, Energy approach to the fatigue of 60/40 solder: Part II-In uence of hold time and asymmetric loading, J. Electron. Packag., vol. 118, pp. 67-71, 1996.
  [3] : [LIVRE194] C.A. HARPER, Electronics Packaging and Interconnection Handbook, New York, McGraw-Hill, Inc. 1991, p.210.

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