M. AMAGAI, "Mechanical reliability in electronic packaging", Microelectronics Reliability , Volume 42, Issues 4-5, April-May 2002, pp. 607-627.

M. AMAGAI, "Mechanical reliability in electronic packaging", Microelectronics Reliability , Volume 42, Issues 4-5, April-May 2002, pp. 607-627. Copyright - [Précédente] [Première page] [Suivante] - Home

Article : [ART230]

Titre : M. AMAGAI, Mechanical reliability in electronic packaging, Microelectronics Reliability , Volume 42, Issues 4-5, April-May 2002, pp. 607-627.

Cité dans :[REVUE296] Elsevier Science, Microelectronics Reliability, Volume 42, Issues 4-5, Pages 463-804, April - May 2002.

Auteur : Masazumi Amagai

Vers : Bibliographie
Adresse : SC Package Development Hiji, Texas Instruments, 4260 Kawasaki, Hiji-Machi, Hayami-Gun, Oita-Pref 879-1595, Japan
Tel. : +81-977-73-1729
Fax. : +81-977-73-1582
Lien : mailto:amai@ti.com
Source : Microelectronics Reliability
Volume : 42
Issues : 4-5
Date : April-May 2002
Pages : 607 - 627
DOI : 10.1016/S0026-2714(02)00037-9
PII : S0026-2714(02)00037-9
Lien : private/AMAGAI1.pdf - 1312 Ko, 21 pages
Switches : IGBT
Stockage : Thierry LEQUEU

Abstract :
The dramatic increase in the number of devices and functionality of the latest
ultra large scale integration designs have resulted in increasing chip size.
Concurrently, to achieve higher circuit board component densities, package
dimensions have been shrinking. These two competing trends are leading to ever
more rigorous requirements on the mechanical characteristics of the packaging
technology. The dominant issue in component level reliability is delamination
and cracks initiated at the interface between dissimilar materials. In board
level reliability, solder joint reliability is a primary issue. This paper
describes the methodology of prediction and the explanation for interfacial
delamination, cracks at the top of the interfaces and the edge of corner, and
also solder joint reliability. This paper furthermore presents the role of the
chip backside contamination affecting interfacial delamination, the surface
characterizations and an explanation of the interface chemistry, and the
strength of solders with a variety of plating materials for Sn-Ag-based lead
free solders.

Article Outline
1. Introduction
2. Interfacial cracks between dissimilar materials
3. Cracks at the edge of interface between dissimilar materials
4. Solder joint reliability
5. Wafer backside contamination-induced package interfacial delamination
6. Effect of polyimide surface chemistry and morphology on interfacial strength
7. Effect of solder intermetallic compound on solder joint strength
8. Conclusion

Bibliographie

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