M. CIAPPA, P. MALBERTI, W. FICHTNER, P. COVA, L. CATTANI, F. FANTINI, "Lifetime Extrapolation for IGBT Modules under Realistic Operation Conditions", Volume 39, Issues 6-7, June

M. CIAPPA, P. MALBERTI, W. FICHTNER, P. COVA, L. CATTANI, F. FANTINI, "Lifetime Extrapolation for IGBT Modules under Realistic Operation Conditions", Volume 39, Issues 6-7, June - July 1999, pp. 1131-1136. Copyright - [Précédente] [Première page] [Suivante] - Home

Article : [PAP409]

Titre : M. CIAPPA, P. MALBERTI, W. FICHTNER, P. COVA, L. CATTANI, F. FANTINI, Lifetime Extrapolation for IGBT Modules under Realistic Operation Conditions, Volume 39, Issues 6-7, June - July 1999, pp. 1131-1136.

Cité dans :[REVUE172] Elsevier Science, Microelectronics Reliability, Volume 39, Issues 6-7, Pages 721-1170, June - July 1999.
Cité dans : [DATA196] ESREF'99, Proceedings of the 10th European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis.
Cité dans : [DIV334]  Recherche sur les mots clés power cycling of power device, mai 2002.

Auteur : M. Ciappa (a)
Auteur : P. Malberti (a)
Auteur : W. Fichtner (a)
Auteur : P. Cova (b)
Auteur : L. Cattani (b)
Auteur : F. Fantini (c)

Adresse : (a) Swiss Federal Institute of Technology ( ETH), Integrated System Laboratory, Zurich, Switzerland
Adresse : (b) University of Parma, Information Engineering Department, Italy
Adresse : (c) University of Modena and Reggio Emilia, Engineering Department and JNFM, Jtaly

Vers : Bibliographie
Pages : 1131-1136
Volume : 39
Issues : 6-7
Date : June - July 1999
Switches : IGBT
Lien : private/CIAPPA.pdf - 6 pages, 315 Ko.

Abstract :
In this paper a systematic approach is presented for extrapolating the lifetime due to bond wire lift-off in IGBT modules submitted to cyclic loading.
Application profiles of the device are considered, as they are usually encountered in real current converters for railway traction systems.
The proposed lifetime prediction scheme is based on the principle of the linear accumulation of the fatigue damage and takes into account the redundancy of the bond wires.

Bibliographie

Références : 7
[1] : P. Cova. M. Ciappa. G. Franceschini, P. Malbeni, F. Fantini, Thermal characterization of IGBT power modules Microel. Reliab. 37(1997)1731-1734
[2] : H. Berg, E. Wolfgang, Advanced IGBT modules for railway traction applications; reliabilily testing, Microel. Reliab. 38(1998)1319-1323
[3] : P. Cova, F. Fantini, On the effect of power cycling stress on IGBT modules, Microel. Reliab. 38(1998)1347-1352
[4] : S. Dewar, G. Debled. E. Herr, A 1200 A, 3300 V IGBT power module for traction applications, PCIM, Nümberg 1998
[5] : A. Hamidi. G. Coquery, R. Lallemand, P. Vales, Temperature measurements and thermal modeling of high-Power IGBT modules, Microel. Reliab. 38(1998),1354-1359
[6] : P. Joerg, Messung von Lokfahrten zur Ermittlung von realistischen Lostspielen, ABB Technical Note 11/97,1997
[7] : M. Ciappa, P. Malbeni, Plastic Strain of Aluminum Bond Wires in IGBT Multichip Modules under Thermal Cycling, Quality and Reliab. Engin. Int. 12(1996)297-303

  [1] :  [ART218]  P. COVA, M. CIAPPA, G. FRANCESCHINI, P. MALBERTI, F. FANTINI, Thermal characterization of IGBT power modules, Microelectronics Reliability, Vol. 37, Issues 10-11, October 1997, pp. 1731-1734.
  [2] :  [PAP401]  H. BERG, E. WOLFGANG, Advanced IGBT modules for railway traction applications: Reliability testing, Microelectronics Reliability, Volume 38, Issues 6-8, 8 June 1998, pp. 1319-1323.
  [3] :  [PAP404]  P. COVA, F. FANTINI, On the effect of power cycling stress on IGBT modules, Microelectronics Reliability, Volume 38, Issues 6-8, 8 June 1998, pp. 1347-1352.
  [4] :  [PAP158]  -------
  [5] : [SHEET140] A. HAMIDI, G. COQUERY, R. LALLEMAND, P. VALES, J.M. DORKEL, Temperature measurements and thermal modeling of high power IGBT multichip modules for reliability investigations in traction applications, Microelectronics and Reliability, vol. 38, no. 6-8, J
  [6] :  [PAP158]  -------
  [7] :  [ART219]  M. CIAPPA, P. MALBERTI, Plastic Strain of Aluminum Bond Wires in IGBT Multichip Modules under Thermal Cycling, Quality and Reliab. Engin. Int., Vol. 12, 1996, pp. 297-303

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