Article : [SHEET316]

Info : COMPENDEX Answer Number 4, le 28/04/2000.

Titre : Q. YAO, J. QU, S.X. WU, Solder fatigue life in two chip scale packages, 1999.

Cité dans : [DATA062] Recherche sur les auteurs COFFIN et MANSON, octobre 2001.

Meeting : Proceedings of the 1999 International Symposium on Microelectronics.
Location : Chicago, IL, USA
Date : 26 Oct 1999-28 Oct 1999
Source : Proceedings of SPIE - The International Society for Optical Engineering v 3906 1999.
Pages : 563 - 570
CODEN : PSISDG
ISSN : 0277-786X
Année : 1999
Meeting_Number : 56143
Document_Type : Journal
Treatment_Code : Application; Experimental
Language : English
Stockage :
Logiciel : oui

Abstract :
In this paper, two dimensional and three dimensional finite element
models have been developed to numerically predict the stress, total
strain, plastic strain, and cumulative plastic strain of the solder
joints in an ATC 4.1 flip-chip test vehicle, a microBGA, and a Chip
Scale Package under temperature cycling.These stress and strain
values have been used to predict the solder joint lifetime through
either strain-based approaches such as Coffin-Manson and modified
Coffin-Manson equations, or stress-based approach (S-N Curve).
However, the modified C-M prediction is highly dependent on cycling
frequency. Numerical results obtained from the FE models also reveal
that both effective total strain and effective plastic strain
quickly stabilize after several temperature cycles, and cumulative
plastic strain in the outmost solder joint is a linear function of
the number of temperature cycling. Results from both strain and
stress based approaches show that solder joints in both microBGA and
CSP packages have very high fatigue life under prescribed thermal
loading. This assures excellent packaging reliability.(Author abstract)

References : 7 Refs.

Accession_Number : 2000(17):2872

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