Revue : [REVUE218]

Titre : Elsevier Science, Microelectronics Reliability, Volume 41, Issue 4, Pages 481-624, April 2001.

Cité dans : [DATA197] Les revues Microelectronics Reliability et Microelectronics Journal, ELSEVIER, décembre 2004.

Volume : 41
Issue : 4
Pages : 481 - 624
Date : April 2001

[1] : In memory of D. Stewart Peck, Page 481
Ninoslav D. Stojadinovic and Michael G. Pecht
SummaryPlus | Article | Journal Format-PDF (35 K)

[2] : Progress in device isolation technology, Pages 483-490
Udo Schwalke
SummaryPlus | Article | Journal Format-PDF (653 K)

[3] : A fritless copper conductor system for power electronic applications,
Pages : 491-498
Roland Reicher, Walter Smetana, Julius C. Schuster and Alexander Adlaßnig
SummaryPlus | Article | Journal Format-PDF (252 K)

[4] : Stress effects of epoxy adhesives on ceramic substrates and magnetics,
Pages : 499-510
Dale W. Swanson and Leonard R. Enlow
SummaryPlus | Article | Journal Format-PDF (230 K)

[5] : Investigation of stress in shallow trench isolation using UV micro-Raman
spectroscopy, Pages 511-515
K. F. Dombrowski, B. Dietrich, I. De Wolf, R. Rooyackers and G. Badenes
SummaryPlus | Article | Journal Format-PDF (290 K)

[6] : Finite element simulation of thermal fatigue in multilayer structures: thermal and mechanical approach
Pages : 517-523
M. P. Rodriguez and N. Y. A. Shammas

  [1] :  [PAP301]  M.P. RODRIGUEZ, N.Y.A. SHAMMAS, Finite element simulation of thermal fatigue in multilayer structures: thermal and mechanical approach, Elsevier Science, Microelectronics Reliability, Volume 41, Issue 4, April 2001, pp. 517-523.

[7] : Development of chip-on-flex using SBB flip-chip technology, Pages 525-530
Yutaka Kumano, Yoshihiro Tomura, Minehiro Itagaki and Yoshihiro Bessho
SummaryPlus | Article | Journal Format-PDF (193 K)

[8] : Low-frequency noise of thick-film resistors as quality and reliability indicator, Pages 531-542
Dubravka Rocak, Darko Belavic, Marko Hrovat, Josef Sikula, Pavel Koktavy, Jan Pavelka and Vlasta Sedlakova
SummaryPlus | Article | Journal Format-PDF (1095 K)

[9] : Soft breakdown and hard breakdown in ultra-thin oxides, Pages 543-551
T. Pompl, C. Engel, H. Wurzer and M. Kerber
SummaryPlus | Article | Journal Format-PDF (356 K)

[10] : Reliability studies of two flip-chip BGA packages using power cycling test, Pages 553-562
Quan Qi
SummaryPlus | Article | Journal Format-PDF (455 K)

[11] : Laser processing for microelectronics packaging applications, Pages 563-570
Zsolt Illyefalvi-Vitéz
SummaryPlus | Article | Journal Format-PDF (885 K)

[12] : Thermal modeling of single event burnout failure in semiconductor power devices, Pages 571-578
D. G. Walker, T. S. Fisher, J. Liu and R. D. Schrimpf

  [1] :  [PAP302]  D. G. Walker, T. S. Fisher, J. Liu and R. D. Schrimpf, Thermal modeling of single event burnout failure in semiconductor power devices, pp. 571-578

[13] : Low frequency noise in thin gate oxide MOSFETs, Pages 579-585
R. Kolarova, T. Skotnicki and J. A. Chroboczek
SummaryPlus | Article | Journal Format-PDF (275 K)

[14] : Effects of base layer thickness on reliability of CVD Si3N4 stack gate dielectrics, Pages 587-595
Koji Eriguchi, Yoshinao Harada and Masaaki Niwa
SummaryPlus | Article | Journal Format-PDF (613 K)

[15] : Study on the degradation induced by donor interface state in deep-sub-micron grooved-gate P-channel MOSFET's, Pages 597-604
Hongxia Ren and Yue Hao
SummaryPlus | Article | Journal Format-PDF (417 K)

[16] : Determination of trap cross-section in a-Si:H p-i-n diodes parameters using simulation and parameter extraction, Pages 605-610
Magali Estrada, Antonio Cerdeira, Adelmo Ortiz-Conde and Francisco García
SummaryPlus | Article | Journal Format-PDF (229 K)

[17] : New assembling technique for BGA packages without thermal processes, Pages 611-615
Valentin Videkov, Slavka Tzanova, Radosvet Arnaudov and Nikolai Iordanov
SummaryPlus | Article | Journal Format-PDF (223 K)

[18] : Reliability of k-out-of-n nonrepairable systems with nonindependent components subjected to common shocks, Pages 617-621
A. M. Sarhan and A. M. Abouammoh
Lien : vide.pdf - | Journal Format-PDF (99 K)

[19] : Optimal Reliability Design: Fundamentals and Applications; Way Kuo, Rajendra Prasad, Frank A. Tillman, Ching-Lai Mwang. Cambridge University Press, Cambridge, 2001, 389+XXI pp. ISBN: 0-521-78127-2 (hardbound), Pages 623-624
Milan Jevti

  [1] : [LIVRE262] W. KOU, R. PRASAD, F.A. TILLMAN, C.-L. HWAMG, Optimal Reliability Design: Fundamentals and Applications,Cambridge University Press, Cambridge, 2001, 389 pages.

[20] : Calendar, Pages I-VI
Lien : Calendar4.pdf - Journal Format-PDF (49 K)

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