H. BERG, E. WOLFGANG, "Advanced IGBT modules for railway traction applications: Reliability testing", Microelectronics Reliability, Volume 38, Issues 6-8, 8 June 1998, pp. 1319-1323.

H. BERG, E. WOLFGANG, "Advanced IGBT modules for railway traction applications: Reliability testing", Microelectronics Reliability, Volume 38, Issues 6-8, 8 June 1998, pp. 1319-1323. Copyright - [Précédente] [Première page] [Suivante] - Home

Article : [PAP401]

Titre : H. BERG, E. WOLFGANG, Advanced IGBT modules for railway traction applications: Reliability testing, Microelectronics Reliability, Volume 38, Issues 6-8, 8 June 1998, pp. 1319-1323.

Cité dans :[REVUE253] Elsevier Science, Microelectronics Reliability, Volume 38, Issues 6-8, Pages 851-1366, 8 June 1998.
Cité dans : [DATA233] ESREF'98, Proceedings of the 9th European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis, 5-9 October 1998.
Cité dans : [DIV334]  Recherche sur les mots clés power cycling of power device, mai 2002.
Cité dans :[SHEET465]
Cité dans :[PAP413]
Cité dans :[PAP409]
Cité dans :[ART185]
Cité dans :[ART183]

Auteur : H. Berg - eupec GmbH, Max-Planck-Straße 5 D-59582 Warstein Germany
Auteur : E. Wolfgang - Siemens AG, Corporate Technology, Otto-Hahn-Ring 6 D-81730 Munich Germany

Vers : Bibliographie
Lien : SHEET465.HTM#Bibliographie - référence [2].
Lien : PAP413.HTM#Bibliographie - référence [1].
Lien : PAP409.HTM#Bibliographie - référence [2].
Lien : ART185.HTM#Bibliographie - référence [3].
Lien : ART183.HTM#Bibliographie - référence [3].

Pages : 1319 - 1323
Volume : 38
Issues : 6-8
Date : 8 June 1998
Lien : private/BERG1.pdf - 336 Ko, 5 pages.
Source : Microelectronics and Reliability
PII : S0026-2714(98)00150-4

Abstract :
IGBT modules for railway traction applications have to be more intensively tested then those for industrial application. The paper describes the state of the art of already existing reliability test as well as a proposal for accelerated power cycling and temperature cycling tests. These tests are a result of the Brite EuRam research project RAPSDRA (reliability of advanced power semiconductor devices for railway traction application).

Acknowledgements :
We would like to express our gratitude for the extremely good and constructive cooperation in the RAPSDRA working group on Task 3, accelerated reliability testing. In particular, we wish to thank J. Coquery, INRETS, Prof. F. Fantini, Univ. Parma, D. Newcombe, Mitel Semiconductor, Dr. R. Zehringer, ABB, G.P. Sanguinetti, Ansaldo.

  [1] :  [DIV339]  BE 95-2105, RAPSDRA: Reliability of Advanced Power Semiconductors for Railway Traction Applications.

Bibliographie

References : 16
[1] : LESIT (Leistungelektronik; Systemtechnik, Infonnationstechnologie) : Swiss Federal Research Project (1993- 1995)
[2] : Brite EuRam BE 95-2105 RAPSDRA: Reliability of Advanced Power Semiconductors for Railway Traction Applications
[3] : Zehringer, R.; Struck, A.; Lange, T .: Material Requirements for High Voltage, High Power IGBT devices, MRS Symposium Proceedings No 1.483, (1998), pp. 369- 380
[4] : Jacob, P.; Held, M.; Scacco, P.; Wu, W.: Reliability Testing and Analysis of IGBT Power Semiconductor Modules, Proc. 20st ISTFA, (1994)
[5] : Malberti, P .; Ciappa, M.; Cattomjo, R.: A Power-Cycling-Induced Failure Mechanism of IGBT Multichip Modules
[6] : Wu, W .; Held, M.; Jacob, P .; Scacco, P .; Birolini, A.: Investigation on the Long Term Reliability of Power IGBT Modules, Proc. ISPSD 95 (1995), pp. 443 -448
[7] : Poech, M.-H..; Dittmer, KJ.; Gäbisch, D.: Investigations on the Damage Mechanism of Aluminium Wire Bonds Used for High Power Applications, Proc. EUPAC 96 (1996), pp. 128 -131
[8] : Held, M.; Jacob, P .; Nicoletti, G.; Scacco, P .; Poech, M.-H.: Fast Power Cycling Test for IGBT Modules in Traction Application, Proc. PEDS 97 (1997), pp. 425- 430
[9] : Auerbach, F.: Power-Cycling-Stability of IGBT -Modules. Proc. IEEE IAS, New Orleans, October 5-9 (1997)
[10] : Sommer, K.H.; Spanke, R.; Lefranc, G.; Gottert, J .: Multichip High Power IGBT Modules for Traction and Industrial Application, Proc. EPE' 97, Trondheim, Norway, September 22-24, pp. 512-515
[11] : Hamidi, A.; Coquery, G.; Lallemand, R.: Reliability of High Power IGBT- Modules Testing on Thermal Fatigue Effects due to Traction Cycles: Proc. EPE '97, Trondheim
[12] : Hamidi, A.; Coquery, G.; Lallemand, R.; Vales, P.; Dorkel, J.M.: Temperature Measurements and Thermal Modeling of High Power IGBT Multichip Modules for Reliability Investigations in Traction Applications (this proceedings)
[13] : Cova, P .; Fnntini, F.: On the Effect of Power Cycling Stress on IGBT Modules (this proceedings)
[14] : Ramminger, S.; Türkes, P.; Wachuta, G.; Crack Mechanism in Wire Bonding Joints (this proceedings)
[15] : Herr , E.; Frey, T .; Schlegel, R.; Stuck, A.; Zehringer, R.: Substrate- To-Base Solder Joint Reliability in High Power IGBT Modules, Microelectronics and Reliability, Special Issue ESREF 97 (1997), pp. 1719- 1722
[16] : Crook, D.L.: Evolution of VLSI Reliability Engineering. Proc. of IRPS 1990, pp. 2-11 Brite EuRam BE 95-2105 RAPSDRA: Reliability of Advanced Power Semiconductors for Railway Traction Applications.

  [1] :  [PAP158]  -------
  [2] :  [DIV339]  BE 95-2105, RAPSDRA: Reliability of Advanced Power Semiconductors for Railway Traction Applications.
  [3] :  [PAP158]  -------
  [4] : [SHEET359] P. JACOB, M. HELD, P. SCACCO, W. WU, Reliability testing and analysis of IGBT power semiconductor modules, Proceeding of the 20th International Symposium for Testing and Failure Analysis, 1994, pp. 319-325.
  [5] :  [ART225]  P. MALBERTI, M. CIAPPA, R. CATTOMIO, A power-cycling-induced failure mechanism of IGBT multichip modules, Proc. ISTFA, 163-168, Santa Clara, USA, 1995.
  [6] :  [ART261]  W. WU, M. HELD, P. JACOB, P. SCACCO, A. BIROLINI, Investigation on the Long Term Reliability of Power IGBT Modules, Proc. ISPSD 95, pp. 443-448.
  [7] :  [ART257]  M.-H. POECH, J. DITTMER, D. GABISCH, Investigations on the damage mechanism of aluminium wire bonds used for high-power applications, Eupac Conf, Essen, 1996, pp. 128-131.
  [8] :  [ART258]  M. HELD, P. JACOB, G. NICOLETTI, P. SCACCO, M.-H. POECH, Fast Power Cycling Test for IGBT Modules in Traction Application, Proc. PEDS 97, 1997 , pp. 425-430.
  [9] :  [PAP158]  -------

 [10] :  [ART221]  K. SOMMER, J. GOTTERT, G. LEFRANC, R. SPANKE, Multi-chip high-power IGBT modules for traction and industrial application, Proc. EPE' 97, Trondheim, Norway, September 22-24, pp. 512-515.
 [11] : [SHEET122] A. HAMIDI, G. COQUERY, R. LALLEMAND, Reliability of high power IGBT modules. Testing on thermal fatigue effects due to traction cycles, Proc. of EPE Conf., Trondheim, September 1997, vol. 3, pp. 3.118-3.123.
 [12] : [SHEET140] A. HAMIDI, G. COQUERY, R. LALLEMAND, P. VALES, J.M. DORKEL, Temperature measurements and thermal modeling of high power IGBT multichip modules for reliability investigations in traction applications, Microelectronics and Reliability, vol. 38, no. 6-8, J
 [13] :  [PAP404]  P. COVA, F. FANTINI, On the effect of power cycling stress on IGBT modules, Microelectronics Reliability, Volume 38, Issues 6-8, 8 June 1998, pp. 1347-1352.
 [14] :  [PAP400]  S. RAMMINGER, P. TURKES, G. WACHUTKA, Crack Mechanism in Wire Bonding Joints, Microelectronics Reliability, Volume 38, Issues 6-8, 8 June 1998, pp. 1301-1305.
 [15] :  [ART262]  E. HERR, T. FREY, R. SCHLEGEL, A. STUCK, R. ZEHRINGER, Substrate to base solder joint reliability in high-power IGBT modules, ESREF'97, 1997, pp. 1719-1722.
 [16] :  [PAP158]  -------

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