V. SZEKELY, "Enhancing reliability with thermal transient testing", Microelectronics Reliability, Volume 42, Issues 4-5, April-May 2002, pp. 629-640.

V. SZEKELY, "Enhancing reliability with thermal transient testing", Microelectronics Reliability, Volume 42, Issues 4-5, April-May 2002, pp. 629-640. Copyright - [Précédente] [Première page] [Suivante] - Home

Article : [ART240]

Titre : V. SZEKELY, Enhancing reliability with thermal transient testing, Microelectronics Reliability, Volume 42, Issues 4-5, April-May 2002, pp. 629-640.

Cité dans :[REVUE296] Elsevier Science, Microelectronics Reliability, Volume 42, Issues 4-5, Pages 463-804, April - May 2002.
Cité dans : [DIV334]  Recherche sur les mots clés power cycling of power device, mai 2002.

Auteur : V. Székely

Vers : Bibliographie
Adresse : Department of Electron Devices, Budapest University of Technology and Economics, Goldmann Gy. ter 3, H-1521 Budapest XI, Hungary

Tel. : +36-1-463-2702
Fax. : +36-1-463-2973
Lien : mailto:szekely@eet.bme.hu
Source : Microelectronics Reliability
Volume : 42
Issues : 4-5
Date : April-May 2002
Pages : 629 - 640
DOI : 10.1016/S0026-2714(02)00028-8
PII : S0026-2714(02)00028-8
Lien : private/Szekely1.pdf - 263 Ko, 12 pages.
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Abstract :
Thermal transient measurement, the method for the characterisation of IC
packages is gaining increasing importance. The measurement of these transients
requires dedicated equipment. The paper discusses the methodology of thermal
transient measurements in details, including the compensation of second order
effects as non-linearity, non-constant powering etc. In the following part the
evaluation methods and algorithmic solutions are discussed. A typical example is
presented. Reliability issues are discussed in the last section of the paper,
including the problem of die attach testing. The contribution of the thermal
transient measurements to the analysis of thermo-mechanical strain is
demonstrated.

Article Outline
1. Introduction
2. Thermal transient measurement: the principle
3. The thermal transient measurement in practice
4. Some particular problems of the thermal transient measurement
4.1. Assuring constant dissipation
4.2. Non-linear effects
4.3. Pulse measurement
5. Evaluation of the heating/cooling curves
5.1. The Bayes iteration
5.2. Deconvolution in the Fourier domain
5.3. Calculation of the structure function
6. Identification of the different regions on the structure function
7. Benefits of thermal transient measurements in reliability investigations
7.1. Testing for die attach failure
7.2. Calculating temperature excursion for thermo-mechanical stress analysis
8. Conclusions
Acknowledgements

Bibliographie

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