Article : [ART194]

Info : REPONSE 69, le 06/05/2002.

Titre : CREEP AND STRESS RELAXATION IN SOLDER JOINTS OF SURFACE-MOUNTED CHIP CARRIERS, 1987.

Cité dans : [DIV334]  Recherche sur les mots clés power cycling of power device, mai 2002.

Source : IEEE Trans Compon Hybrids Manuf Technol v CHMT-10 n 4 Dec 1987, Contrib from the 37th Electr Compon Conf, Boston, MA, USA, May 1987 p 556-565
CODEN : ITTEDR
ISSN : 0148-6411
Année : 1987
Document_Type : Journal
Treatment_Code : Theoretical; Experimental
Language : English
Stockage :

Abstract :
When a surface-mounted ceramic chip carrier is subjected to thermal
cycling, complex stresses and strains are generated in the solder
joints.At any temperature, the solder simultaneously undergoes creep and
stress relaxation in a process called stress reduction. The rate of stress
reduction is controlled by the conventional constitutive relation in which
the rate of change of shear strain at a given temperature is proportional
to the shear stress raised to a constant power.The constitutive relation
is used to develop an equation for stress as a function of time during
isothermal stress reduction.Experiments confirm this equation over the
range of -28 degree C to 97 degree C.The measured time to half-stress
depends on the initial stress.

References : 15 refs.

Accession_Number : 1988(5):71078 COMPENDEX
Réponse obtenue dans Banque de données INSPEC

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