C. Hager, A. Stuck, Y. Tronel, R. Zehringer, W. Fichtner, "Comparison between Finite-Element and Analytical Calculations for the Lifetime Estimation of Bond Wires in IGBT Modules", ISPSD'2000, pp. 291-294.
Copyright - [Précédente] [Première page] [Suivante] - Home
Article : [SHEET396]
Titre : C. Hager, A. Stuck, Y. Tronel, R. Zehringer, W. Fichtner, Comparison between Finite-Element and Analytical Calculations for the Lifetime Estimation of Bond Wires in IGBT Modules, ISPSD'2000, pp. 291-294.
Cité dans : [DATA125] ISPSD'2000, 12th Internationnal Symposium on Power Semiconductor Devices & Integrated Circuits, May 22-25 2000, Toulouse, France.
Auteur : C. Hager
Auteur : A. Stuck
Auteur : Y. Tronel
Auteur : R. Zehringer
Auteur : W. Fichtner
Vers : Bibliographie
Stockage :
Lien : private/HAGER.pdf - 982 Ko, 4 pages.
Source : ISPSD'2000, Toulouse, France
Pages : 291 - 294
Date : May 22-25, 2000
Abstract :
Coffin-Manson fatigue law based lifetime estimations of aluminum bond wires in IGBT modules under
field conditions were performed. The models were calibrated with fatigue data obtained from
accelerated lifetime tests and plastic strain computations corresponding to test conditions.
The calibrated laws were then used to predict the bond wire lifetime under field conditions.
To evaluate the influence of the plastic strain calculations finite-element and analytical
computations were performed and the resulting lifetimes compared.
Référence : 14
[1] : H. de Lambilly, and H.O. Keser, "Failure analysis of power modules: a look at the packaging and reliability of large IGBTs", IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 16, no. 4; June 1993; pp. 412-417
[2] : P. Jacob, M. Held, P. Scacco, and W. Wu, "Reliability Testing and Analysis of IGBT Power Semiconductor Modules", ISTFA'94, Proc. 20th Int. Symposium for Testing and F;ulure Analysis, pp. 319-325
[3] : K.J. Dittmer, M.H. Poech, F.W. Wulff, andM. Krumm, "Failure analysis of Aluminium wire bonds in high power IGBT Modules", Mat. Res. Sec. Symp. Proc., Vol. 390, 1995, pp. 251-256
[4] : J. Onuki, and M. Koizumi, "Reliability of thick Al wire bonds in IGBT modules for traction motor drives", Proc. 1995 Int. Symposium on Power Sermconductor Devices and ICs, Yokohama, Japan, pp. 428-433
[5] : W. Wu, M. Held, P. Jacob, P. Scacco, and A. Birolini, "Investigation on the Long Term Reliability of Power IGBT Modules", Proc. 1995 Int. Symposium on Power Semiconductor Devices and ICs, Yokohama, Japan, pp. 443-448
[6] : P. Jacob, M. Held, and P. Scacco, "IGBT Power Semiconductor Reliability Analysis for Traction Application", IPFA'95, Singapore, pp. 169-175
[7] : P. Malberti, M. Ciappa, and R. Cattomio, "A Power Cycling-Induced Failure Mechanism of IGBT Multichip Modules", ISTFA'95, Proc. 21th Int. Symposium for Testing and Failure Analysis, 6-10 November, 1995, Santa Clara, California, pp. 163-168
[8] : M. Ciappa, and P. Malberti, "Plastic-strain of aluminium interconnections during pulsed operation of IGBT multichip modules", Quality and Reliability Engineering International, vol. 12, no. 4; July-Aug. 1996; pp. 297-303
[9] : ISE Integrated Systems Engineenng AG, "TED-ISE user manual", ISE TCAD Release 6.0 Manual Part 28, ISE AG (1999)
[10] : ISE Integrated Systems Engineering AG, "SOLIDIS ISE user manual", ISE TCAD Release 6.0 Manual part 25, ISE AG (1999)
[11] : J.F. Haag, and A. Kolbeck, "Stand und Entwicklung der Drahtbondtechnik", Frauenhofer-Institut für Festköpertechnologie, München 1990
[12] : S. Ramminger, P. Türkes, and G. Wachutka, "Crack Mechanism in Wire Bonding Joints", ESREF'98, Copenhagen, Denmark; in Microelectronics and Reliability, vol. 38, no. 6-8; june-august 1998; pp. 1301-1305
[13] : C. Hager, Y. Tronel, and W. Fichtner, "Electro Thermo-Mechanical Simulations of Aluminum Bond Wires in IGBT-Packages", Proceedings of the 1st International Conference on Modeling and Simulation of Microsystems, Semiconductors, Sensors and Actuators, (MSM 98), April 6-8, 1998, Santa Clara, California, USA; pp. 163-167.
[14] : C. Hager, Y. Tronel, A. Stuck, R. Zehringer, and W. Fichtner, "Influence of Model Parameters on the Lifetime Modeling of Aluminum Wire Bond Connections", to be published.
[1] : [PAP158] -------
[2] : [SHEET359] P. JACOB, M. HELD, P. SCACCO, W. WU, Reliability testing and analysis of IGBT power semiconductor modules, Proceeding of the 20th International Symposium for Testing and Failure Analysis, 1994, pp. 319-325.
[3] : [SHEET146] K.J. DITTMER, M.H. POECH, F.W. WULFF, M. KRUMM, Failure analysis of aluminum wire bonds in high power IGBT modules, Proceedings of the Spring Meeting on MRS, San Francisco, USA, April 1995, pp. 251-256.
[4] : [PAP158] -------
[5] : [ART261] W. WU, M. HELD, P. JACOB, P. SCACCO, A. BIROLINI, Investigation on the Long Term Reliability of Power IGBT Modules, Proc. ISPSD 95, pp. 443-448.
[6] : [SHEET535] P. JACOB, M. HELD, P. SCACCO, IGBT Power Semiconductor Reliability Analysis for Traction Application, IPFA'95, Singapore, pp. 169-175
[7] : [PAP158] -------
[8] : [PAP158] -------
[9] : [PAP158] -------
[10] : [PAP158] -------
[11] : [PAP158] -------
[12] : [PAP158] -------
[13] : [PAP158] -------
[14] : [PAP158] -------
Mise à jour le lundi 10 avril 2023 à 18 h 59 - E-mail : thierry.lequeu@gmail.com
Cette page a été produite par le programme TXT2HTM.EXE, version 10.7.3 du 27 décembre 2018.
Les informations contenues dans cette page sont à usage strict de Thierry LEQUEU et ne doivent être utilisées ou copiées par un tiers.
Powered by www.google.fr, www.e-kart.fr, l'atelier d'Aurélie - Coiffure mixte et barbier, La Boutique Kit Elec Shop and www.lequeu.fr.
