G. COQUERY, R. LALLEMAND, D. WAGNER, M. PITON, H. BERG, K. SOMMER, "Reliability improvement of the soldering thermal fatigue with AlSiC technology on traction high power IGBT modules", EPE'99, paper 904, 1999.

G. COQUERY, R. LALLEMAND, D. WAGNER, M. PITON, H. BERG, K. SOMMER, "Reliability improvement of the soldering thermal fatigue with AlSiC technology on traction high power IGBT modules", EPE'99, paper 904, 1999. Copyright - [Précédente] [Première page] [Suivante] - Home

Article : [SHEET119]

Titre : G. COQUERY, R. LALLEMAND, D. WAGNER, M. PITON, H. BERG, K. SOMMER, Reliability improvement of the soldering thermal fatigue with AlSiC technology on traction high power IGBT modules, EPE'99, paper 904, 1999.

Cité dans : [DATA146] LTN, Laboratoire des Technologies Nouvelles, INRETS, Arcueil, France.
Cité dans : [DATA035] Recherche sur les mots clés thermal + fatigue + semiconductor et reliability + thermal + cycle, mars 2004.
Cité dans :[99DIV076] EPE'99, European Conference on Power Electronics and Applications, Lausanne, Suisse, 7-9 septembre 1999.
Cité dans :[DATA042]
Cité dans :[DATA049]
Cité dans :[ART185]

Auteur : G. Coquery
Auteur : R. Lallemand
INRETS LTN F-94114 Arcueil, France, tel : +33-1 4740 7342, fax: +33-1 4547 5606
Lien : mailto:gerard.coquery@inrets.fr
Lien : mailto:richard.lallemand@inrets.fr

Auteur : D. Wagner
Auteur : M. Piton
ALSTOM F-65600 Séméac, France, tel: +33-5-6253 4863, fax: +33-5-6253 4805
Lien : mailto:michel.piton@transport.alstom.com
Lien : mailto:diane.wagner@transport.alstom.com

Auteur : H. Berg,
Auteur : K. Sommer
EUPEC D-59581 Warstein, Germany, Tel : +49-2902 764 400, Fax : +49-2902 764 256
Lien : mailto:hermann.berg@eupec.com
Lien : mailto:karlheinz.sommer@eupec.com

Stockage : Thierry LEQUEU
Lien : private/PP904.pdf - 754 Ko, 10 pages.
Date : 7-9 septembre 1999
Pages : 1 - 10
Keywords : IGBT module, high power, reliability soldering layer, thermal resistance, AlSiC
Lien : ART185.HTM#Bibliographie - référence [7].

Abstract :
Since 1994, the technology of the high power IGBT modules for traction inverter was improved a lot.
The first technology weakness identified was the bonding attach reliability. The second failure mode
is the cracking of the solder layer between base plate material and ceramic plate. The topic proposed
concerns the power cycling behaviour of the packaging technology using new base plate material named
AlSiC, to replace the usual copper base plate The results of the first accelerated tests show a high
improvement, the lifetime before critical solder layer delamination is increased by a factor of six
to ten, according to our test results Tests conditions, methodology of measurement mainly considering
thermal resistance interpretation, thermal simulation, and failures analysis are discussed.

Bibliographie

References : 13
[1] : Piccone D.E., Eriksson L.O., Urbanek J., Tobin W.H., Somos I.L., "A thermal analogue of higher accuracy and factory test method for predicting and supporting thyristor fault suppression ratings", Conference record of IASAM (IEEE), Vol. 1, p. 678-686, 1988.
[2] : Hamidi A., Coquery G., Lallemand R, "Effects of current density and chip temperature distribution on lifetime of high power IGBT modules in traction working conditions", European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, ESREF'97, Bordeaux, October 1997.
[3] : Hamidi A., Coquery G., Lallemand R., Vales. P., Dorkel J.M., "Temperature measurements and thermal modeling of high power IGBT multichip modules for reliability investigations in traction applications", ESREF'98, Reliability of Power Devices, Copenhague, 9th October 1998.
[4] : Sommer K., Göttert J., Lefranc G., Spanke R., "Multichip high power IGBT Modules for traction and industrial application", Proc. of EPE Conf., Trondheim, September 1997.
[5] : Coquery G., "Les modules IGBT de forte puissance. Leur essor dans les applications de traction ferroviaire", REE no. 9, pp. 52-59, Octobre 1998, Paris.
[6] : Franke T., Honsberg-Riedl M., Simon P., Otto J., Ramminger S., Soelker G., Wolfgang E., "On chip reliability investigation on power modules actually working in inverter systems", ESREF 98, Reliability of Power Devices, Copenhague, 9th October 1998.
[7] : Berg H., Wolfgang E., "Advanced IGBT module for railway traction applications : reliability testing", ESREF 98, Reliability of Power Devices, Copenhague, 9th October 1998.
[8] : Ramminger S., Türkes P., Wachutra G., "Crack mechanism in wire bonding joints", ESREF 98, Reliability of Power Devices, Copenhague, 9th October 1998.
[9] : Hamidi A., Coquery G., Lallemand R., "Reliability of high power IGBT modules. Testing on thermal fatigue effects due to traction cycles", Proc. of EPE Conf., Trondheim, September 1997.
[10] : Fratelli L., Giannini G., "Power traction converter with 3,3kV IGBT modules", Proc. of EPE Conf., Trondheim, September 1997.
[11] : Herr E., Frey T., Schlegel R., Stuck A., Zehringer R., "Substrate-to-base solder joint reliability in high power IGBT modules"; ESREF 97, Reliability of Power Devices, pp. 1719-1722, Bordeaux, 9th October 1998.
[12] : Jacob P., Held M., Scacco P., Wu W., "Reliability testing and analysis of IGBT power semiconductor modules", IEE proc. IGBT propulsion drives, London, pp. 4.1-4.5, 1995.
[13] : Schütze T., Berg H., Hierholzer M., "Further improvements in the reliability of IGBT Modules", Proc. of IAS, 1998.

  [1] : [SHEET200] D.E. PICCONE, L.O. ERIKSSON, J. URBANEK, W.H. TOBIN, I.L. SOMOS, A thermal analogue of higher accuracy and factory test method for predicting and supporting thyristor fault suppression ratings, IAS 1988, vol. 14, pp. 678-686.
  [2] : [SHEET356] A. HAMIDI, G. COQUERY, R. LALLEMAND, Effects of current density and chip temperature distribution on lifetime of high power IGBT modules in traction working conditions, European Symposium on Reliability of Electron Devices, Failure Physics and Analysis,
  [3] : [SHEET120] A. HAMIDI, G. COQUERY, R. LALLEMAND, P. VALES, J.M. DORKEL, Temperature measurements and thermal modeling of high power IGBT multichip modules for reliability investigations in traction applications, ESREF'98, Reliability of Power Devices, Copenhague, 9
  [4] :  [ART221]  K. SOMMER, J. GOTTERT, G. LEFRANC, R. SPANKE, Multi-chip high-power IGBT modules for traction and industrial application, Proc. EPE' 97, Trondheim, Norway, September 22-24, pp. 512-515.
  [5] : [SHEET357] G. COQUERY, Les modules IGBT de forte puissance. Leur essor dans les applications de traction ferroviaire, REE no. 9, pp. 52-59, Octobre 1998, Paris.
  [6] :  [PAP405]  T. FRANKE, M. HONSBERG-RIEDL, P. SIMON, J. OTTO, S. RAMMINGER, G. SOELKNER, E. WOLFGANG, On-Chip Reliability Investigations on Power Modules Actually Working in Inverter Systems, Microelectronics Reliability, Volume 38, Issues 6-8, 8 June 1998, pp. 1361
  [7] :  [PAP158]  -------
  [8] :  [PAP158]  -------
  [9] : [SHEET122] A. HAMIDI, G. COQUERY, R. LALLEMAND, Reliability of high power IGBT modules. Testing on thermal fatigue effects due to traction cycles, Proc. of EPE Conf., Trondheim, September 1997, vol. 3, pp. 3.118-3.123.
 [10] :  [PAP158]  -------
 [11] :  [ART223]  E. HERR, T. FREY, R. SCHLEGEL, A. STUCK, R. ZEHRINGER, Substrate to base solder joint reliability in high-power IGBT modules, Microelectron. Reliab. Vol. 37, 1997, pp. 1719-1722.
 [12] : [SHEET354] P. JACOB, M. HELD, P. SCACCO, W. WU, Reliability testing and analysis of IGBT power semiconductor modules, IEE proc. IGBT propulsion drives, London, pp. 4.1-4.5, 1995.
 [13] : [SHEET358] T. SCHUTZE, H. BERG, M. HIERHOLZER, Further improvements in the reliability of IGBT Modules, Proc. of IAS, 1998.

Mise à jour le lundi 10 avril 2023 à 18 h 59 - E-mail : thierry.lequeu@gmail.com
Cette page a été produite par le programme TXT2HTM.EXE, version 10.7.3 du 27 décembre 2018.

Les informations contenues dans cette page sont à usage strict de Thierry LEQUEU et ne doivent être utilisées ou copiées par un tiers.
Powered by www.google.fr, www.e-kart.fr, l'atelier d'Aurélie - Coiffure mixte et barbier, La Boutique Kit Elec Shop and www.lequeu.fr.