L. CIAMPOLINI, M. CIAPPA, P. MALBERTI, P. REGLI, W. FICHTNER, "Modelling thermal effects of large contiguous voids in solder joints", Microelectronics Journal, Volume 30, Issue 11, November 1999, pp. 1115-1123.

L. CIAMPOLINI, M. CIAPPA, P. MALBERTI, P. REGLI, W. FICHTNER, "Modelling thermal effects of large contiguous voids in solder joints", Microelectronics Journal, Volume 30, Issue 11, November 1999, pp. 1115-1123. Copyright - [Précédente] [Première page] [Suivante] - Home

Article : [ART228]

Titre : L. CIAMPOLINI, M. CIAPPA, P. MALBERTI, P. REGLI, W. FICHTNER, Modelling thermal effects of large contiguous voids in solder joints, Microelectronics Journal, Volume 30, Issue 11, November 1999, pp. 1115-1123.

Cité dans : [DATA197] Les revues Microelectronics Reliability et Microelectronics Journal, ELSEVIER, décembre 2004.
Cité dans :[REVUE308] Elsevier Science, Microelectronics Journal, Volume 30, Issue 11, Pages 1083-1172, November 1999.

Auteur : L. Ciampolini
Auteur : M. Ciappa
Auteur : P. Malberti
Auteur : P. Regli
Auteur : W. Fichtner

Vers : Bibliographie
Lien : ART227.HTM#Bibliographie - référence [20].

Adresse : Integrated System Laboratory, Swiss Federal Institute of Technology, Gloriastrasse 35, ETH Zentrum, CH-8092, Zurich, Switzerland
Tel. : +41-1-632-75-98
Fax. : +41-1-632-11-94
Lien : mailto:ciampolini@iis.ee.ethz.ch
PII : S0026-2692(99)00073-7
Source : Microelectronics Journal
Volume : 30
Issue : 11
Date : November 1999
Pages : 1115 - 1123
Lien : private/CIAMPOLINI1.pdf - 861 Ko, 9 pages.
Switches : IGBT
Stockage : Thierry LEQUEU

Abstract :
The local distortion of the junction temperature due to large contiguous voids
in the die attach of real power devices is investigated and modeled. Temperature
fields obtained by thermal simulations are calibrated with experimental data
obtained by high-resolution infrared thermography. The junction temperature
distortion caused by a large single void is shown to be proportional to the void
area via a package-dependent coefficient (differential specific thermal
resistance). Further, correction factors which take into account the effects of
both aspect ratio and location of the void have been computed, thereby leading
to a procedure for an accurate estimation of the local junction temperature
distortion peaks.

Keywords : Thermal modelling; Thermal analysis; Solder voids; Infrared imaging; Hybrids

Article Outline
Nomenclature
1. Introduction
2. Numerical simulation
2.1. Simulation technique
2.2. Numerical results
2.2.1. Differential specific thermal resistance
2.2.2. Edge effects
2.2.3. Aspect ratio effects
3. Experimental
3.1. Equipment
3.2. Sample preparation
3.3. Emissivity of the coating layer
4. Discussion
5. Conclusion
Acknowledgements

Bibliographie

References : 18
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