P. COVA, G. NICOLETTO, A. PIRONDI, M. PORTESINE, M. PASQUALETTI, "Power cycling on press-pack IGBTs: measurements and thermomechanical simulation", Microelectronics Reliability, Volume 39, Issues 6-7, June

P. COVA, G. NICOLETTO, A. PIRONDI, M. PORTESINE, M. PASQUALETTI, "Power cycling on press-pack IGBTs: measurements and thermomechanical simulation", Microelectronics Reliability, Volume 39, Issues 6-7, June - July 1999, pp. 1165-1170. Copyright - [Précédente] [Première page] [Suivante] - Home

Article : [PAP413]

Titre : P. COVA, G. NICOLETTO, A. PIRONDI, M. PORTESINE, M. PASQUALETTI, Power cycling on press-pack IGBTs: measurements and thermomechanical simulation, Microelectronics Reliability, Volume 39, Issues 6-7, June - July 1999, pp. 1165-1170.

Cité dans :[REVUE172] Elsevier Science, Microelectronics Reliability, Volume 39, Issues 6-7, Pages 721-1170, June - July 1999.
Cité dans : [DATA196] ESREF'99, Proceedings of the 10th European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis.
Cité dans : [DIV334]  Recherche sur les mots clés power cycling of power device, mai 2002.

Auteur : Paolo Cova (a)
Auteur : Gianni Nicoletto (b)
Auteur : Alessandro Pirondi (b)
Auteur : Marco Portesine (c)
Auteur : Maurizio Pasqualetti (c)

Adresse : (a) University of Parma, Dipartimento di Ingegneria dell'Informazione, Parco Area delle Scienze 181/A 43100 Parma Italy
Adresse : (b University of Parma, Dipartimento di Ingegneria Industriale, Parco Area delle Scienze 181/A 43100 Parma Italy
Adresse : (c Ansaldo Trasporti, Unità Semiconducttori, via N. Lorenzi 8 16152 Genova Italy

Lien : private/COVA2.pdf - 6 pages, 426 Ko.
Source : Microelectronics Reliability
Pages : 1165 - 1170
Volume : 39
Issues : 6-7
Date : June - July 1999
Switches : IGBT

Abstract :
Press-pack IGBTs are increasing their market-share, especially for traction applications. As packaging performance is a key factor for a successful product, there is a great interest in defining optimal solutions in terms of geometry, materials and mechanical loading. To support IGBT reliability assessment we developed a testing rig for accelerated testing of a single chip under controlled pressure conditions. In parallel, we created a thermomechanical simulation of the chip/testing rig assembly for the determination of internal stresses and strains due to actual operation. Test results and preliminary failure analysis following power cycling show the possibility of predicting the degradation according to different mechanisms induced by the combined effect of pressure and temperature fluctuation.

Bibliographie

References : 6
[1] : Berg H and Wolfgang E. Advanced IGBT modules for railway traction applications: reliability testing. Micr. Reliab., 38 (1998) 1319-1323.
[2] : Hiyoshy M, Yanagisawa S, Nishitani K, Kotake K, Matsuda H, Teramae S, Baba Y. A 1000A 2500V pressure mount RC-IGBT. EPE 1995 Proc., pp. 1.051-1.054.
[3] : Nicoletto G, Pirondi A, Terzi M, Cova P, Fantini F, Camera A, Pasqualetti M, Portesine M, Zani PE. Thermo-mechanical structural analysis of a press-packed IGBT. InterPack 1997 Proc., pp. 1707-1713.
[4] : Pirondi A, Nicoletto G, Cova P, Pasqualetti M, Portesine M, Zani PE. Thermo-mechanical simulation of a multichip press-packed IGBT. Solid State Electronics, 42 (1998) 2303-2307.
[5] : Cova P and Fantini F. On the effect of power cycling stress on IGBT modules. Micr. Reliab., 38 (1998) 1347-1352.
[6] : Johnson KL. Contact mechanics. Cambridge Univ. Press, 1985.

  [1] :  [PAP401]  H. BERG, E. WOLFGANG, Advanced IGBT modules for railway traction applications: Reliability testing, Microelectronics Reliability, Volume 38, Issues 6-8, 8 June 1998, pp. 1319-1323.
  [2] :  [PAP158]  -------
  [3] :  [PAP158]  -------
  [4] :  [PAP158]  -------
  [5] :  [PAP404]  P. COVA, F. FANTINI, On the effect of power cycling stress on IGBT modules, Microelectronics Reliability, Volume 38, Issues 6-8, 8 June 1998, pp. 1347-1352.
  [6] :  [PAP158]  -------

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