Y.H. PAO, W. JUNG, R. COOPER, V.A. SANKARAN, X. XU, "Thermal Fatigue Modeling of Solder Interlayer in Power Electronics", Advances in Electronic Packaging, 1995, vol. 10, pp. 1059-1068.
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Titre : Y.H. PAO, W. JUNG, R. COOPER, V.A. SANKARAN, X. XU, Thermal Fatigue Modeling of Solder Interlayer in Power Electronics, Advances in Electronic Packaging, 1995, vol. 10, pp. 1059-1068.
Cité dans : [DATA035] Recherche sur les mots clés thermal + fatigue + semiconductor et reliability + thermal + cycle, mars 2004.
Cité dans : [DIV334] Recherche sur les mots clés power cycling of power device, mai 2002.
Cité dans :[SHEET321]
Cité dans :[ART223]
Auteur : Pao Y.H
Auteur : Jung W.
Auteur : Cooper R.
Auteur : Sankaran V.A.
Auteur : Xu X. (Sci. Res. Lab., Ford Motor Co., Dearborn, MI, USA)
Vers : Bibliographie
Lien : SHEET321.HTM#Bibliographie - référence [7].
Lien : ART223.HTM#Bibliographie - référence [2].
Stockage : Thierry LEQUEU (26 mai 2000)
Logiciel : ABAQUS
Source : Advances in Electronic Packaging
Date : 1995
Volume : 10-2
Pages : 1059 - 1068
Titre : Thermal fatigue modeling of solder interlayer in power electronics.
Source : Advances in Electronic Packaging 1995. Proceedings of the International Electronic Packaging Conference - INTERpack '95
Editors : Hsu, T.R.; Bar-Cohen, A.; Nakayama, W.
Infos : New York, NY, USA: ASME, 1995. p.1059-68 vol.2 of 2 vol. xvi+1320 pp. 17 refs.
Conference : Lahaina, HI, USA, 26-30 March 1995
Sponsor(s) : ASME; Japan Soc. Mech. Eng
ISBN : 0-7918-1303-7
Document_Type : Conference Article
Treatment_Code : Practical; Theoretical
Info : Country of Publication : United States
Language : English
Abstract :
Life prediction models have been developed for thermal fatigue
failure of 95Pb-5Sn and 63Sn-37Pb solder interlayers in power electronic
modules. The models are based upon crack growth in the solder interlayers,
characterized by the J-integral. Thermal cycling tests were performed on
two types of power modules to obtain crack growth data. Finite element
methods (FEM) were used to determine the J-integral as a function of crack
length. The critical crack length in the solder was also determined for
both modules using a 20% increase in thermal resistance as the failure
criterion. The current results show a power law type of correlation
between crack growth rate and J-integral.
ACKNOWLEDGEMENT :
The authors wish to thank W. L Winterbottom and P. Patil for their support and valuable discussions and M. Li and E. Jih for their technical assistance.
Accession_Number : 1997:5520701 INSPEC
Références : 17
[1] : ABAQUS User's Manual, Version 5.2, Hibbitt, Karlsson & Sorensen, Inc., 1992.
[2] : de Lambilly, H. and Keser, H. o., 1993, "Failure Analysis of Power Modules: A Look at the Packaging and Reliability of Large IGBT's, "IEEE Trans. On Components Hybrids, and Manufacturing Technology, Vol. 16, No.4, June, pp. 412-417.
[3] : Fudala, J. and Beke, M., 1990, "The Performance and Reliability of a New Plated Copper Technology on Ceramic," Proceedings of 40th ECTC, May 20-23, Las Vegas, pp. 1114-1121.
[4] : Glaser, J. C., 1990, "Thermal Stresses in Compliantly Joined Materials," J. Electronic Packaging, Trans. ASME, Vol. 112, March, pp. 24-29.
[5] : Guo, Z, Sprecher, A F., and Conrad, H., 1992, "Effect of Sn Content on Crack Growth Rate in Low-Cycle Fatigue of Pb-Sn Solder Joints," proceedings of the 7th Electronic Materials and Proceeding Congress, Cambridge, MA, August 24-27, pp. 209-216.
[6] : Jung, W.-J., Pao, Y.-H., Lin, J., and Minear, C., 1994, "Modeling Thermal Cyclic Behavior of Leadless Chip Capacitor Solder Joints in Automotive Electronic Packages," Proceedings of ABAQUS Users'Conference, Newport, RI, June 1-3 pp. 317-335.
[7] : Kanninen, M. F. and Popelar, C. H., 1985, Advanced Fracture Mechanics. Oxford University Press.
[8] : Kuo, A- Y., 1989, "Thermal Stresses at the Edge of a Bimetallic Thermostat," ASME Journal of Applied Mechanics, Vol. 56, pp. 585-589.
[9] : Lashway, R., 1994, "AIN Thermal Management," Advanced Packaging, May/June, pp. 22-24.
[10] : Lau, J. H., 1991, Solder Joint Reliability Theory and Applications, Van Nostrand Reinbold, New York.
[11] : Morgan, H. S., 1991, "Thermal Stresses in Layered Electrical Assemblies Bonded with Solders," J. Electronic Packaging, Trans. ASME, Vol. 113, December, pp. 350-354.
[12] : Neugebauer, C. A, Yerman, A F., Carlson, R. O., Burgess, J. F., Webster, H. F., and Glascock, H. H., 1986, The Packaging of Power Semiconductor Devices. Gordon and Breach Science Publisbers.
[13] : Pao, Y.-H., 1992, "A Fracture Mechanics Approach to Thermal Fatigue Life Prediction of Solder Joints," IEEE Trans. on Components Hybrids, and Manufacturing Technology, Vol. 15, No.4, August, pp. 559-570.
[14] : Pao, Y.-H., Jih, E., Artz, B. E., and Cathey, L. W., 1992, " A Note on the Implementation of Temperature Dependent Coefficient of Thermal Expansion (CTE) in ABAQUS," Transactions of ASME, Journal of Electronic Packaging, Vol. 114, Dec., pp. 470-472.
[15] : Schroeder, S. A and Mitchell, M. R., 1995, Fatigue of Electronic Materials, ASTM STP 1153, in print.
[16] : Subir, E., 1986, "Stresses in Bi-Metal Thermostats," ASME Journal of Applied Mechanics, Vol. 53, pp. 657-660.
[17] : Wong, B. and Helling, D. E., 1989, " A Mechanistic Model for Solder Joint Failure Prediction under Thermal Cycling," J. Electronic Packaging, Trans. ASME, Vol. 112, No.2, June, pp. 104-109.
[1] : [LIVRE193] C.A. NEUGEBAUER, A.F. YERMAN, R.O. CARLSON, J.F. BURGESS, The Packaging of Power Semiconductor Devices, Electrocomponent Science Monographs, Gordon and Breach Science Publishers, vol. 7, 1986.
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