Article : [PAP429]

Titre : R.L. Shook, T.R. Conrad, Accelerated Life Performance Of Moisture Damaged Plastic Surface Mount Devices, 93227.

Cité dans : [CONF024] IRPS, International Reliability Physics Symposium, août 2004.
Cité dans :[PAP360]

Date : 1993
Site : http://www.irps.org
Lien : IRPS/SRI8597/term.pdf - 624 Ko, SECTION 2 - INDEX OF (EXTENDED) TERMS WITH PAPER TITLES - pp. 49-190

Autoclave testing
Ball bond lifting
Bond false healing
Contaminant ingression
Corrosion
Cracking, SMT package moisture-induced
De-capsulation
Delamination, SMT package moisture-induced
Die surface delamination
Failure Mode Analysis (FMA)
Flux activation
Humidity chamber
Infrared solder reflow (IR)
Lead frame delamination
Lead frame, Ag spot
Lead frame, Cu
Lead-to-lead leakage
Moisture ingression
Moisture preconditioning
Moisture sensitivity, plastic SMT packages
Moisture-induced cracking & delamination in plastic packages
PLCC, 32 pin, 44 pin
Plastic package FITs
Plastic surface mount packages, reliability performance
Polyimide die coat
Popcorn cracks
Power cycling
Pre-bake
Preconditioning, plastic SMT packages
RH, 85°C/60%, 85°C/85%
Reliability performance, with moisture-induced solder reflow damage
SOJ, 28 pin
Scanning acoustic microscopy, analysis of plastic packages
Static bias, 5V
Surface mount technology, corrosion induced performance degradation
Surface mount technology, moisture sensitivity of plastic SMT packages
Surface mount technology, moisture-induced cracking & delamination in plastic packages
Surface mount technology, preconditioning to simulate board assembly process
Surface mount technology, solder reflow damage in plastic packages
Temperature cycling
Temperature-Humidity-Bias test (THB)
Water solube flux
Weibull distribution

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