Fiche : [DIV333]

Titre : Recherche sur les mots clés thermal + shock + liquid , février 2002.

Cité dans : [DIV096]  Recherches bibliographiques diverses, janvier 2019.
Cité dans : [DATA035] Recherche sur les mots clés thermal + fatigue + semiconductor et reliability + thermal + cycle, mars 2004.
Cité dans : [DIV334]  Recherche sur les mots clés power cycling of power device, mai 2002.

Site : http://stneasy.fiz-karlsruhe.de/html/french/login1.html

Vers : Recherche STN Easy choc liquide liquide du 5 février 2002

Recherche STN Easy choc liquide liquide du 5 février 2002

  [1] : [TRIAC081] K. KANAJI, K. MIZUIKE, T. NISHIGUCHI, High performance liquid epoxy encapsulant for advanced semiconductor package, Proceedings of the 1997 1st Electronic Packaging Technology Conference, EPTC'97, pp. 215-218.
  [2] : [TRIAC082] Three-dimensional finite element analysis of thermal shock in a premolar with a composite resin MOD restoration.
  [3] : [TRIAC083] Elasticity, thermal properties, and molecular dynamics using non-empirical tight-binding.
  [4] : [TRIAC084] Evaluation of fatigue strength of plate-fin heat exchanger under thermal loading.
  [5] : [TRIAC085] N. YONEMURA, M. FUKUDA, T. SHIGI, Thermal shock reliability analysis of insulated metal substrates (IMS), IEEE/CPMT 20th IEMT, Apr 1997, pp. 303-307.
  [6] : [TRIAC086] W.C. ZHENG, S.V. HARREN, A.F. SKIPOR, Thermomechanical analysis of flip-chip-on-board electronic packaging assembly, Proceedings of the 1994 International Mechanical Engineering Congress & Exhibition, pp. 1-5.
  [7] : [TRIAC087] Evaluation of thermal shock resistance of ceramics - temperature dependence of so-called heat transfer coefficient of quenching liquid.
  [8] : [TRIAC088] Au-In bonding below the eutectic temperature.
  [9] : [TRIAC089] Surface destroying of brittle materials by thermoshock.
 [10] : [TRIAC090] Advances in bonding technology for electronic packaging.

 [11] : [TRIAC091] Estimation of thermal shock resistance of ceramics (5th Report, probabilistic estimation of thermal shock resistance).
 [12] : [TRIAC092] Method for combining printed circuit board assembly functional test with liquid thermal shock.
 [13] : [TRIAC093] Evaluation of thermal shock resistance of ceramics.(1st Report, a novel quench test technique).
 [14] : [TRIAC094] Thermal shock resistance of plastic IC package.
 [15] : [TRIAC095] Evaluation method of thermal shock resistance of epoxy resin based on fracture mechanics.
 [16] : [TRIAC096] NUMERICAL PREDICTION OF THE FRACTURE OF A THICK PRESSURIZED SHELL SUBJECTED TO A LIQUID NITROGEN SHOCK.
 [17] : [TRIAC097] COMPARISON OF THEORETICAL ESTIMATES AND EXPERIMENTAL MEASUREMENTS OF FATIGUE CRACK GROWTH UNDER SEVERE THERMAL SHOCK CONDITIONS - PART II: THEORETICAL ASSESSMENT AND COMPARISON WITH EXPERIMENT.
 [18] : [TRIAC098] NON-DESTRUCTIVE CONTROL IN THERMAL-SHOCK RESISTANCE TESTING OF STRUCTURAL CERAMICS.
 [19] : [TRIAC099] EROSION AND THERMAL SHOCK TESTS ON CERAMIC MATERIALS.
 [20] : [TRIAC100] COMPARISON OF THEORETICAL ESTIMATES AND EXPERIMENTAL MEASUREMENTS OF FATIGUE CRACK GROWTH UNDER SEVERE THERMAL SHOCK CONDITIONS (PART TWO - THEORETICAL ASSESSMENT AND COMPARISON WITH EXPERIMENT).

 [21] : [TRIAC101] COMPARISON OF THEORETICAL ESTIMATES AND EXPERIMENTAL MEASUREMENTS OF FATIGUE CRACK GROWTH UNDER SEVERE THERMAL SHOCK CONDITIONS (PART ONE - EXPERIMENTAL OBSERVATIONS).
 [22] : [TRIAC102] LIQUID THERMAL SHOCK TESTING.
 [23] : [TRIAC103] TEMPERATURE CYCLING AND THERMAL SHOCK TESTING/TEST PARAMETERS.
 [24] : [TRIAC104] Thermal Methods for Detecting Defective Soldered Joints.
 [25] : [TRIAC105] TEMPERATURE CONTROL IN THE DIE CASTING PROCESS THROUGH THE USE OF A HEAT TRANSFER SYSTEM.
 [26] : [TRIAC106] Method for the Detection of Defective Soldered Connections. METODA WYKRYWANIA WADLIWYCH POLACZEN LUTOWANYCH.
 [27] : [TRIAC107] EPOXY ENCAPSULATION COMPOUNDS WITH IMPROVED COMBINATIONS OF THERMAL SHOCK, HEAT AND REVERSION RESISTANCE.
 [28] : [TRIAC108] WHO WANTS RELIABLE PLASTIC SEMICONDUCTORS?.
 [29] : [TRIAC109] Thermal shock environment.

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