Fiche : [DIV463]

Titre : Recherche sur les mots clés FLIP CHIP, juillet 2005.

Cité dans : [DIV096]  Recherches bibliographiques diverses, janvier 2019.

Date : juillet 2005

Ajout de juillet 2005

  [1] :  [ART229]  T. ALANDER, S. NURMI, P. HEINO, E. RISTOLAINEN, Impact of component placement in solder joint reliability, Microelectronics Reliability, Volume 42, Issue 3, March 2002, pp. 399-406.
  [2] :  [ART230]  M. AMAGAI, Mechanical reliability in electronic packaging, Microelectronics Reliability , Volume 42, Issues 4-5, April-May 2002, pp. 607-627.
  [3] :  [ART236]  R.D. PENDSE, P. ZHOUB, Methodology for predicting solder joint reliability in semiconductor packages, Microelectronics Reliability, Volume 42, Issues 2, February 2002, pp. 301-305.
  [4] :  [ART263]  P. LALL, M. PECHT, E.B. HAKIM, Characterization of functional relationship between temperature and  microelectronic reliability, Microelectronics Reliability, Volume 35, Issues 3, March 1995, pp. 377-402.
  [5] :  [ART495]  J.H. OKURA, K. DARBHA, S. SHETTY, A. DASGUPTA, J.F.J.M. CAERS, Guidelines to select underfills for flip chip on board assemblies, Proceedings of the 49th Electronic Components and Technology Conference, 1999, pp. 589-594.
  [6] :  [ART504]  S. HARADA, G. KAMOSHITA, T. FUKURAI, Reliability of interconnection for ultrasonic face down bonding, Proceedings of the 21st electronic components conference, 1971, pp. 303-309.
  [7] :  [ART527]  FAY HUA, Pb-free solder challenges in electronic packaging and assembly, Proceedings of the 53rd Electronic Components and Technology Conference, 2003, pp. 58-63.

  [8] :  [DATA035] Recherche sur les mots clés thermal + fatigue + semiconductor et reliability + thermal + cycle, mars 2004.
  [9] :  [DATA062] Recherche sur les auteurs COFFIN et MANSON, octobre 2001.
 [10] :  [DATA126] ESREF'2000, 11th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Dresden, Germany, 2-6 octobre 2000.
 [11] :  [DATA154] Recherche sur l'auteur W. WEIBULL, août 2000.
 [12] :  [DATA184] IRPS'1999, 1999 IEEE International Reliability Physics Symposium, San Diego.
 [13] :  [DATA213] S. FORSTER, Mécanisme de fracture dans les matériaux fragiles et théorie du choc thermique, rapport interne, 8 novembre 2000, 13 pages.

 [14] :  [DIV333]  Recherche sur les mots clés thermal + shock + liquid , février 2002.
 [15] :  [DIV334]  Recherche sur les mots clés power cycling of power device, mai 2002.
 [16] :  [DIV429]  Y. DANTO, C. PELLET, RTP Fiabilité STIC - 2èmes Journées du RTP Fiabilité des composants et packaging, CNRS-DSTIC, 15 et 16 mars 2004, Carry le Rouet, France.
 [17] :  [DIV442]  Recherche sur les mots clés THERMAL RESISTANCE, juillet 2004.

 [18] : [LIVRE057] J. LAU, C.P. WONG, J.L. PRINCE, W. NAKAYAMA, Electronic packaging : design, materials, process & reliability, McGraw-Hill, march 1998.
 [19] : [LIVRE194] C.A. HARPER, Electronics Packaging and Interconnection Handbook, New York, McGraw-Hill, Inc. 1991, p.210.
 [20] : [LIVRE236] W. MENZ, J. MOHR, O. PAUL, Microsystem technology, 01/2001, 500 pages.
 [21] : [LIVRE385] J.H. LAU, Ball grid array technologies, McGraw-Hill, New York (1995).
 [22] : [LIVRE386] J.H. LAU, Y. PAO, Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies, McGraw-Hill, New York (1997).

 [23] :  [PAP256]  W.W. LEE, L.T. NGUYEN, G.S. SELVADURAY, Solder joint fatigue models: review and applicability to chip scale packages, Microelectronics Reliability, Vol. 40, No. 2, 2000, pp. 231-244.
 [24] :  [PAP360]  T. LEQUEU, Les tests en fiabilité, rapport interne LMP, novembre 2001.
 [25] :  [PAP464]  M. AMAGAI, Chip Scale Package (CSP) solder joint reliability and modeling, Microelectronics and Reliability, Volume 39, Issue 4, April 1999, pp. 463-477.
 [26] :  [PAP554]  D.G. YANG, J.S. LIANG, Q.Y. LI, L.J. ERNST, G.Q. ZHANG, Parametric study on flip chip package with lead-free solder joints by using the probabilistic designing approach, Microelectronics Reliability, Volume 44, Issue 12, December 2004, pp.1947-1955.

 [27] : [REVUE163] Elsevier Science, Microelectronics Reliability, Vol. 40, Issue 7, pp. 1069-1241, July 2000.
 [28] : [REVUE164] Elsevier Science, Microelectronics Reliability, Vol. 40, Issue 6, pp. 897-1067, June 2000.
 [29] : [REVUE172] Elsevier Science, Microelectronics Reliability, Volume 39, Issues 6-7, Pages 721-1170, June - July 1999.
 [30] : [REVUE190] Elsevier Science, Microelectronics Reliability, Vol. 40, Issue 8-10, pp. 1243-1770, august-october 2000.
 [31] : [REVUE199] Elsevier Science, Microelectronics Reliability, Vol. 37, Issues 10-11, Pages 1421-1798, 11 October 1997.
 [32] : [REVUE218] Elsevier Science, Microelectronics Reliability, Volume 41, Issue 4, Pages 481-624, April 2001.
 [33] : [REVUE219] Elsevier Science, Microelectronics Reliability, Volume 41, Issue 5, Pages 625-777, May 2001.
 [34] : [REVUE233] Elsevier Science, Microelectronics Reliability, Volume 39, Issue 1, Pages 1-149, January 1999.
 [35] : [REVUE239] Elsevier Science, Microelectronics Reliability, Volume 39, Issue 9, Pages 1311-1421 (September 1999.
 [36] : [REVUE253] Elsevier Science, Microelectronics Reliability, Volume 38, Issues 6-8, Pages 851-1366, 8 June 1998.
 [37] : [REVUE280] Elsevier Science, Microelectronics Reliability, Volume 41, Issue 12, Pages 1915-2095, December 2001.
 [38] : [REVUE294] Elsevier Science, Microelectronics Reliability, Volume 42, Issue 2, Pages 157-305, February 2002.
 [39] : [REVUE295] Elsevier Science, Microelectronics Reliability, Volume 42, Issue 3, Pages 307-461, March 2002.
 [40] : [REVUE323] Elsevier Science, Microelectronics Reliability, Volume 36, Issue 3, Pages 293-456 (March 1996.
 [41] : [REVUE324] Elsevier Science, Microelectronics Reliability, Volume 36, Issue 4, Pages 457-562 (April 1996.
 [42] : [REVUE328] Elsevier Science, Microelectronics Reliability, Volume 36, Issues 11-12, Pages 1603-1946 (12 November 1996.
 [43] : [REVUE333] Elsevier Science, Microelectronics Reliability, Volume 37, Issue 3, Pages 381-547, March 1997.
 [44] : [REVUE334] Elsevier Science, Microelectronics Reliability, Volume 37, Issue 4, Pages 549-712 (April 1997.
 [45] : [REVUE354] Elsevier Science, Microelectronics Reliability, Volume 42, Issue 7, Pages 995-1151, July 2002.
 [46] : [REVUE355] Elsevier Science, Microelectronics Reliability, Volume 42, Issue 8, Pages 1153-1248, August 2002.
 [47] : [REVUE377] Elsevier Science, Microelectronics Reliability, Volume 42, Issues 9-11, Pages 1249-1822, September - November 2002.
 [48] : [REVUE378] Elsevier Science, Microelectronics Reliability, Volume 42, Issue 12, Pages 1823-2034, December 2002.
 [49] : [REVUE386] Elsevier Science, Microelectronics Reliability, Volume 43, Issue 1, Pages 1-177, January 2003.
 [50] : [REVUE388] Elsevier Science, Microelectronics Reliability, Volume 43, Issue 3, Pages 343-515, March 2003.
 [51] : [REVUE417] Elsevier Science, Microelectronics Reliability, Volume 43, Issue 4, Pages 517-684, April 2003.
 [52] : [REVUE435] Elsevier Science, Microelectronics Reliability, Volume 43, Issues 9-11, Pages 1351-1968, September-November 2003.
 [53] : [REVUE464] Elsevier Science, Microelectronics Reliability, Volume 43, Issue 12, Pages 1969-2119, December 2003.
 [54] : [REVUE465] Elsevier Science, Microelectronics Reliability, Volume 44, Issue 1, Pages 1-182, January 2004.
 [55] : [REVUE480] Elsevier Science, Microelectronics Reliability, Volume 44, Issue 2, Pages 183-364, February 2004.
 [56] : [REVUE481] Elsevier Science, Microelectronics Reliability, Volume 44, Issue 3, Pages 365-548, March 2004.
 [57] : [REVUE482] Elsevier Science, Microelectronics Reliability, Volume 44, Issue 4, Pages 549-708, April 2004.
 [58] : [REVUE514] IEEE Transactions on Power Electronics, Volume 19, Issue 2, March 2004.
 [59] : [REVUE519] Elsevier Science, Microelectronics Reliability, Volume 44, Issue 5, Pages 709-888, May 2004.
 [60] : [REVUE529] Elsevier Science, Microelectronics Reliability, Volume 44, Issue 7, Pages 1031-1206, July 2004.
 [61] : [REVUE538] Elsevier Science, Microelectronics Reliability, Volume 44, Issues 9-11, Pages 1281-1890, September-November 2004.
 [62] : [REVUE544] Elsevier Science, Microelectronics Reliability, Volume 44, Issue 12, Pages 1891-2054 , December 2004.

 [63] : [SHEET142] F.S. POPELAR, Parametric study of flip chip reliability based on solder fatigue modelling: Part II - flip chip on organic, 1998 International Symposium on Microelectronics,  Nov. 1998, pp. 497-504.
 [64] : [SHEET145] S.F. POPELAR, Parametric study of flip chip reliability based on solder fatigue modelling, 1997.
 [65] : [SHEET153] P. LIN, J. LEE, S. IM, Design considerations for a flip- chip joining technique, 1970.
 [66] : [SHEET166] A.T. ENGLISH, C.M. MELLIAR-SMITH, Reliability and failure mechanisms of electronic materials,Annual review of materials science, vol.8, 1978, pp. 459-495.
 [67] : [SHEET316] Q. YAO, J. QU, S.X. WU, Solder fatigue life in two chip scale packages, 1999.
 [68] : [SHEET320] V. SARIHAN, Energy based methodology for damage and life prediction of solder joints under thermal cycling, Proceedings of the 43rd Electronic Components and Technology Conference, 1993, pp. 32-38.
 [69] : [SHEET322] B. VANDEVELDE, E. BEYNE, Thermal fatigue reliability analysis of redistributed flip chip assemblies, 1998.
 [70] : [SHEET326] V. SARIHAN, Energy based methodology for damage and life prediction of solder joints under thermal cycling, IEEE Components and Manufacturing Technology, vol. 17, pp. 626-631, 1994.
 [71] : [SHEET344] R. SATOH, K. ARAKAWA, M. HARADA, K. MATSUI, Thermal fatigue life of Pb-Sn alloy interconnections, IEEE Transactions on Components, Hybrids, and Manufacturing Technology,  march 1991, vol. 14, no. 1, pp. 224-232.
 [72] : [SHEET393] H.J. SHAH, J.H. KELLY, Effect of Dwell Time on Thermal Cycling of the Flip-Chip Joint, Proceedings International Microelectronics Symposium, pp 341-346, 1970.
 [73] : [SHEET468] D.G. YANG, L.J. ERNST, C. VAN'T HOF, M.S. KIASAT, J. BISSCHOP, J. JANSSEN, F. KUPER, Z. N. LIANG, R. SCHRAVENDEEL, G.Q. ZHANG, Vertical die crack stresses of Flip Chip induced in major package assembly processes, ESREF'2000, pp. 1533-1538.

 [74] : [THESE090] S. MOREAU, Fiabilité environnementale des composants de puissance : le TRIAC, Thèse de Doctorat, soutenue le 17 mai 2005, 127 pages.

 [75] : [TRIAC081] K. KANAJI, K. MIZUIKE, T. NISHIGUCHI, High performance liquid epoxy encapsulant for advanced semiconductor package, Proceedings of the 1997 1st Electronic Packaging Technology Conference, EPTC'97, pp. 215-218.
 [76] : [TRIAC086] W.C. ZHENG, S.V. HARREN, A.F. SKIPOR, Thermomechanical analysis of flip-chip-on-board electronic packaging assembly, Proceedings of the 1994 International Mechanical Engineering Congress & Exhibition, pp. 1-5.

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