Revue : [REVUE464]

Titre : Elsevier Science, Microelectronics Reliability, Volume 43, Issue 12, Pages 1969-2119, December 2003.

Cité dans : [DATA197] Les revues Microelectronics Reliability et Microelectronics Journal, ELSEVIER, décembre 2004.

Volume : 43
Issue : 12
Pages : 1969 - 2119
Date : December 2003

[1] : Thermally driven reliability issues in microelectronic systems: status-quo and challenges, Pages 1969-1974
Clemens J. M. Lasance
Lien : vide.pdf - | Full Text + Links | PDF (236 K)

[2] : Issues in accelerated electromigration of solder bumps, Pages 1975-1980
Glenn A. Rinne
Lien : vide.pdf - | Full Text + Links | PDF (386 K)

[3] : The effect of small-signal AC voltages on C–V characterization and
parameter extraction of SiO2 thin films, Pages 1981-1985
Hongguo Zhang, Pant Gurang, Nihdi Sigh, Quvdo Manuel, Robert Wallace,
Bruce Gnade and Kevin Stokes
Lien : vide.pdf - | Full Text + Links | PDF (421 K)

[4] : Defect generation in InGaN/GaN light-emitting diodes under forward and
reverse electrical stresses, Pages 1987-1991
X. A. Cao, P. M. Sandvik, S. F. LeBoeuf and S. D. Arthur
Lien : vide.pdf - | Full Text + Links | PDF (333 K)

[5] : Experimental study and theoretical prediction of aging induced frequency
shift of crystal resonators and oscillators, Pages 1993-2000
Y. S. Roh, A. Asiz, W. P. Zhang and Y. Xi
Lien : vide.pdf - | Full Text + Links | PDF (324 K)

[6] : Reliable study of digital IC circuits with margin voltage among variable
DC power supply, electromagnetic interference and conducting wire antenna,
Pages : 2001-2009
Han-Chang Tsai
Lien : vide.pdf - | Full Text + Links | PDF (365 K)

[7] : An examination of the applicability of the DNP metric on first level
reliability assessments in underfilled electronic packages, Pages
2011-2020
W. Dauksher and W. S. Burton
Lien : vide.pdf - | Full Text + Links | PDF (399 K)

[8] : Measurement of high electrical current density effects in solder joints,
Pages : 2021-2029
Hua Ye, Douglas C. Hopkins and Cemal Basaran
Lien : vide.pdf - | Full Text + Links | PDF (695 K)

[9] : Comparative study of the dissolution kinetics of electrolytic Ni and
electroless Ni–P by the molten Sn3.5Ag0.5Cu solder alloy, Pages 2031-2037
M. N. Islam, Y. C. Chan, A. Sharif and M. O. Alam
Lien : vide.pdf - | Full Text + Links | PDF (504 K)

[10] : Improving the deflection of wire bonds in stacked chip scale package
(CSP), Pages 2039-2045
Y. F. Yao, T. Y. Lin and K. H. Chua
Lien : vide.pdf - | Full Text + Links | PDF (544 K)

[11] : The study on failure mechanisms of bond pad metal peeling: Part
A––Experimental investigation, Pages 2047-2054
Insu Jeon and Qwanho Chung
Lien : vide.pdf - | Full Text + Links | PDF (892 K)

[12] : The study on failure mechanisms of bond pad metal peeling: Part
B––Numerical analysis, Pages 2055-2064
Insu Jeon
Lien : vide.pdf - | Full Text + Links | PDF (693 K)

[13] : Reliability evaluation of ultra-thin CSP using new flip-chip bonding
technology––double-sided CSP and single-sided CSP, Pages 2065-2075
Kazuto Nishida, Kazumichi Shimizu, Michiro Yoshino, Hideo Koguchi and
Nipon Taweejun
Lien : vide.pdf - | Full Text + Links | PDF (739 K)

[14] : Effect of voids on the reliability of BGA/CSP solder joints, Pages
2077-2086
Mohammad Yunus, K. Srihari, J. M. Pitarresi and Anthony Primavera
Lien : vide.pdf - | Full Text + Links | PDF (751 K)

[15] : Moisture absorption and diffusion characterisation of packaging
materials––advanced treatment, Pages 2087-2096
E. H. Wong and R. Rajoo
Lien : vide.pdf - | Full Text + Links | PDF (394 K)

[16] : Author Index to Volume 42, Pages 2113-2119
PDF (209 K)

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