Revue : [REVUE323]

Titre : Elsevier Science, Microelectronics Reliability, Volume 36, Issue 3, Pages 293-456 (March 1996.

Cité dans : [DATA197] Les revues Microelectronics Reliability et Microelectronics Journal, ELSEVIER, décembre 2004.

Volume : 36, Issue 3,
Pages : 293-456 (March 1996)
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[1] : Characterizations of the exponential distribution via mixing
distributions, Pages 293-305
M. Gharib
Lien : vide.pdf - | Journal Format-PDF (275 K)

[2] : Performance and dependability analysis of fault-tolerant networks, Pages
307-321
A. Brenner
Lien : vide.pdf - | Journal Format-PDF (636 K)

[3] : An experimental study of 1.5 keV X-ray radiation effects on CMOS devices,
Pages : 323-333
A. Srivastava, R. Nema and P. K. Bhattacharya
Lien : vide.pdf - | Journal Format-PDF (349 K)

[4] : A bound heuristic algorithm for solving reliability redundancy
optimization, Pages 335-339
Jianping Li
Lien : vide.pdf - | Journal Format-PDF (245 K)

[5] : Bounds for reliability of k-within two-dimensional consecutive-r-out-of-n
failure systems, Pages 341-345
F. S. Makri and Z. M. Psillakis
Lien : vide.pdf - | Journal Format-PDF (227 K)

[6] : Some estimators of finite population variance using information on two
auxiliary variables, Pages 347-351
R. K. Singh, S. M. H. Zaidi and S. A. H. Rizvi
Lien : vide.pdf - | Journal Format-PDF (157 K)

[7] : A maintenance inspection model for a single machine with general failure
distribution, Pages 353-358
M. A. Hariga
Lien : vide.pdf - | Journal Format-PDF (359 K)

[8] : Maximum likelihood estimation of the Burr XII parameters with censored and
uncensored data, Pages 359-362
K. Wang F. and J. B. KeatsWilliam J. Zimmer
Lien : vide.pdf - | Journal Format-PDF (154 K)

[9] : Terminal reliability using binary decision diagrams, Pages 363-365
H. Singh, S. Vaithilingam and R. K. AnneL. Anneberg
Lien : vide.pdf - | Journal Format-PDF (108 K)

[10] : Boolean neural network realization of an adder-subtractor cell, Pages
367-369
H. Singh and H. Singh BawaL. Anneberg
Lien : vide.pdf - | Journal Format-PDF (154 K)

[11] : BLUEs of location and scale parameters of laplace distribution based on
Type-II censored samples and associated inference, Pages 371-374
N. Balakrishnan and M. P. ChandramouleeswaranR. S. Ambagaspitiya
Lien : vide.pdf - | Journal Format-PDF (203 K)

[12] : Reliability estimation and tolerance limits for laplace distribution based
on censored samples, Pages 375-378
N. Balakrishnan and M. P. Chandramouleeswaran
Lien : vide.pdf - | Journal Format-PDF (214 K)

[13] : Reliability evaluation of k-out-of-n redundant system with partially
energized stand-by units, Pages 379-383
B. N. Sur
Lien : vide.pdf - | Journal Format-PDF (279 K)

[14] : Availability of K-out-of-N:G systems with M failure modes, Pages 385-388
Magdi S. Moustafa
Lien : vide.pdf - | Journal Format-PDF (208 K)

[15] : A system where the number of servers changes depending on the queue
length, Pages 389-391
Mitsuo Yamashiro
Lien : vide.pdf - | Journal Format-PDF (138 K)

[16] : Redundancy optimization in consideration of uncertainty, Pages 393-397
Zhijie Pan, Noburu Eguchi and Yasou Nonaka
Lien : vide.pdf - | Journal Format-PDF (269 K)

[17] : Estimating human error probabilities from paired ratios, Pages 399-401
Kyung S. Park and T. Jung Kwang
Lien : vide.pdf - | Journal Format-PDF (191 K)

[18] : Probability of first passage analysis of a two-stage transfer-line
production system with storage and rework, Pages 403-407
M. N. Gopalan and S. Kannan
Lien : vide.pdf - | Journal Format-PDF (288 K)

[19] : On the transient behaviour of an r-out-of-n:G system, Pages 409-413
M. N. GopalanU. Dinesh Kumar
Lien : vide.pdf - | Journal Format-PDF (289 K)

[20] : Evaluation of probability mass function of flow in a communication network
considering a multistate model of network links, Pages 415-421
S. Patra and R. B. Misra
Lien : vide.pdf - | Journal Format-PDF (354 K)

[21] : Reliability evaluation of multistage interconnection networks with
multi-state elements, Pages 423-428
C. R. Tripathy, S. Patra, R. B. Misra and R. N. Mahapatra
Lien : vide.pdf - | Journal Format-PDF (375 K)

[22] : Benefit analysis of a two-unit standby system subject to jerks with
installation time, Pages 429-434
Ashok Saini and Ashok Kumar
Lien : vide.pdf - | Journal Format-PDF (247 K)

[23] : Shrunken estimators for the scale parameter of classical pareto
distribution, Pages 435-439
D. C. Singh, P. Singh and P. R. Singh
Lien : vide.pdf - | Journal Format-PDF (174 K)

[24] : Review: likelihood method for fitting Weibull log-linear models to
accelerated life-test data., Page 441
Alan J. Watkins
Lien : vide.pdf - | Journal Format-PDF (77 K)

[25] : Computer vision for automatic inspection of a high density grid of pads on
multi-chip modules (MCM-D)., Page 441
Michael E. ScamanLaertis EconomikosJulius Lambright
Lien : vide.pdf - | Journal Format-PDF (77 K)

[26] : Development of an alternative wire bond test technique., Page 441
Michael PechtDonald BarkerPradeep Lall
Lien : vide.pdf - | Journal Format-PDF (77 K)

[27] : High temperature operation of GaAs based FETs., Page 441
C. D. WilsonA. G. O'Neill
Lien : vide.pdf - | Journal Format-PDF (77 K)

[28] : Diagnosing scan chain faults., Pages 441-442
Sandip Kundu
Lien : vide.pdf - | Journal Format-PDF (176 K)

[29] : Fracture properties of molding compound materials for IC plastic
packaging., Page 442
John SauberLidia LeeHsu ShihTrirat Hongsmatip
Lien : vide.pdf - | Journal Format-PDF (100 K)

[30] : A practical lifetime prediction method for inter-poly oxides., Page 442
Andreas MartinPaula O'SullivanAlan Mathewson
Lien : vide.pdf - | Journal Format-PDF (100 K)

[31] : Evaluation of the lifetime and failure probability for inter-poly oxides
from RVS measurements., Page 442
Andreas Martin
Lien : vide.pdf - | Journal Format-PDF (100 K)

[32] : A new reliability test for multilayer ceramic capacitors., Page 442
Mark W. Ingalls
Lien : vide.pdf - | Journal Format-PDF (100 K)

[33] : Reliability and micro-structural properties of GaAs Schottky diodes for
submillimeter-wave applications., Pages 442-443
A. GrubV. KrozerA. SimonH. L. Hartnagel
Lien : vide.pdf - | Journal Format-PDF (197 K)

[34] : Locating the faulty component in a malfunctioning repetitive operation.,
Page 443
Fahimeh Rezayat
Lien : vide.pdf - | Journal Format-PDF (98 K)

[35] : A fault-tolerant permutation network modulo arithmetic processor., Page
443
Lin Ming-BoA. Yavuz Oruc
Lien : vide.pdf - | Journal Format-PDF (98 K)

[36] : A structured testability approach for multi-chip modules based on BIST and
boundary-scan., Page 443
Yervant Zorian
Lien : vide.pdf - | Journal Format-PDF (98 K)

[37] : Fuzzy-set approach to select maintenance strategies for multistate
equipment., Page 443
P. V. SureshDipak ChaudhuriB. V. A. Rao
Lien : vide.pdf - | Journal Format-PDF (98 K)

[38] : Reliability of majority voting based VLSI fault-tolerant circuits., Pages
443-444
Charles E. Stroud
Lien : vide.pdf - | Journal Format-PDF (200 K)

[39] : Failure distributions for local vs global and replicate vs standby
redundancies., Page 444
William L. Kilmer
Lien : vide.pdf - | Journal Format-PDF (103 K)

[40] : Power-hierarchy of dependability-model types., Page 444
Manish MalhotraKishor S. Trivedi
Lien : vide.pdf - | Journal Format-PDF (103 K)

[41] : Why no additive hazards models?, Page 444
Martin Newby
Lien : vide.pdf - | Journal Format-PDF (103 K)

[42] : A maintenance strategy for systems subjected to deterioration governed by
random shocks., Page 444
M. A. WortmanGeorgia-Ann KlutkeHayriye Ayhan
Lien : vide.pdf - | Journal Format-PDF (103 K)

[43] : Load-capacity interference and the bathtub curve., Pages 444-445
E. E. LewisChen Hsin-Chieh
Lien : vide.pdf - | Journal Format-PDF (200 K)

[44] : Estimation in the 2-parameter exponential distribution with prior
information., Page 445
Stavros Kourouklis
Lien : vide.pdf - | Journal Format-PDF (99 K)

[45] : Fault analysis by touch. Quality control in PCB assembly., Page 445
Andrew Shepherd
Lien : vide.pdf - | Journal Format-PDF (99 K)

[46] : Bayes analysis for fault location in distributed systems., Page 445
Lo Cyrus Chang YuLeslie C. LanderLu Horng-ShingMartin T. Wells
Lien : vide.pdf - | Journal Format-PDF (99 K)

[47] : Estimation of Pr{X > Y} or Pr{X Y}., Page 445
Ze'ev PoratMeir HaimYaffa Markiewicz
Lien : vide.pdf - | Journal Format-PDF (99 K)

[48] : Comparison of type-I and type-II accelerated life tests for selecting the
most reliable product., Page 445
Tseng Sheng-TsaingHsu Chin-Hsiung
Lien : vide.pdf - | Journal Format-PDF (99 K)

[49] : A recursive approach for enumerating minimal cutsets in a network., Pages
445-446
Yan LiHamdy A. TahaThomas L. Landers
Lien : vide.pdf - | Journal Format-PDF (197 K)

[50] : Optimal replacement policies for systems with multiple standby
components., Page 446
Lee Hyo-SeongMandyam M. Srinivasan
Lien : vide.pdf - | Journal Format-PDF (99 K)

[51] : Software-reliability growth model: primary-failures generate
secondary-faults under imperfect debugging., Page 446
Z. ZeephongsekulG. XiaS. Kumar
Lien : vide.pdf - | Journal Format-PDF (99 K)

[52] : Optimal maintenance-policies for deteriorating systems under various
maintenance strategies., Page 446
C. Teresa LamR. H. Yeh
Lien : vide.pdf - | Journal Format-PDF (99 K)

[53] : Calculation of node-pair reliability in large networks with unreliable
nodes., Page 446
Don Torrieri
Lien : vide.pdf - | Journal Format-PDF (99 K)

[54] : Organic microelectronic packages: challenges for a PCB manufacturer., Page
446
T. Zur Nieden
Lien : vide.pdf - | Journal Format-PDF (99 K)

[55] : Some recent advances in silicon microtechnology and their dependence on
processing technique., Pages 446-447
R. E. HurleyH. S. Gamble
Lien : vide.pdf - | Journal Format-PDF (199 K)

[56] : The benefits of bonding. Silicon on insulator for bipolar ICs., Page 447
Peter Saul
Lien : vide.pdf - | Journal Format-PDF (101 K)

[57] : Automated synthesis of pseudo-exhaustive test generator in VLSI BIST
design., Page 447
Chien-in Henry ChenJoel T. Yuen
Lien : vide.pdf - | Journal Format-PDF (101 K)

[58] : Demountable TAB--a new path for TAB technology., Page 447
Rajendra D. PendseBahram AfshariBruce HeflingerFarid MattaVivek Rastogi
Lien : vide.pdf - | Journal Format-PDF (101 K)

[59] : The importance of material selection for flip chip on board assemblies.,
Page 447
Grace O'MalleyJan GieslerSteve Machuga
Lien : vide.pdf - | Journal Format-PDF (101 K)

[60] : Tutorial: failure-mechanisms models for conductive-filament formation.,
Pages : 447-448
Balu RudraDavid Jennings
Lien : vide.pdf - | Journal Format-PDF (200 K)

[61] : Optimal chip sizing for multi-chip modules., Page 448
P. SinghD. L. Landis
Lien : vide.pdf - | Journal Format-PDF (100 K)

[62] : Reliability investigations of different tape metallizations for TAB-Outer
lead bonding., Page 448
Elke ZakelGhassem AzdashtPeter KruppaHerbert Reichl
Lien : vide.pdf - | Journal Format-PDF (100 K)

[63] : Preencapsulation cleaning methods and control for microelectronics
packaging., Page 448
P. Wong C.R. McBride
Lien : vide.pdf - | Journal Format-PDF (100 K)

[64] : A contribution to the design of plastic packages for high voltage power
integrated circuits., Pages 448-449
M. AlbertiniR. BozzoR. Tiziani
Lien : vide.pdf - | Journal Format-PDF (195 K)

[65] : A simple test chip to assess chip and package design in the case of
plastic assembling., Page 449
P. AlpernV. WickerR. Tilgner
Lien : vide.pdf - | Journal Format-PDF (97 K)

[66] : Ultra-thin packaging versus the Known Good Die., Page 449
Keith Gurnett
Lien : vide.pdf - | Journal Format-PDF (97 K)

[67] : TBGA package technology., Page 449
Frank E. AndrosRichard B. Hammer
Lien : vide.pdf - | Journal Format-PDF (97 K)

[68] : Electrical packaging requirements for low-voltage ICs--3.3 V
high-performance CMOS devices as a case study., Page 449
Ramesh SenthinathanArun MehraMali MahalinghamYutaka DoiHector Astrain
Lien : vide.pdf - | Journal Format-PDF (97 K)

[69] : Flip chip on board connection technology: process characterization and
reliability., Pages 449-450
J. GieslerG. O'MalleyM. WilliamsS. Machuga
Lien : vide.pdf - | Journal Format-PDF (195 K)

[70] : Chip manufacturing: matching production plan with customer requirements.,
Page 450
J. -M. ProthN. Sauer
Lien : vide.pdf - | Journal Format-PDF (100 K)

[71] : Testing for functional defects in embedded digitial-to-analogue converters
using dynamic stimuli and transient response analysis., Page 450
D. TaylorP. S. A. EvansT. I. Pritchard
Lien : vide.pdf - | Journal Format-PDF (100 K)

[72] : Manufacturing ICs the neural way., Page 450
Gary S. May
Lien : vide.pdf - | Journal Format-PDF (100 K)

[73] : Innovations in organics circuit packaging technology., Page 450
J. M. BrauerT. Chen W.
Lien : vide.pdf - | Journal Format-PDF (100 K)

[74] : Packaging technologies for satellite equipment., Pages 450-451
A. Coello-Vera
Lien : vide.pdf - | Journal Format-PDF (198 K)

[75] : Ceramic multicomponent modules: a new approach to miniaturization., Page
451
Paul H. M. Keizer
Lien : vide.pdf - | Journal Format-PDF (100 K)

[76] : Minimal IC pretest requirements for multichip modules., Page 451
Wolfgang DaumWilliam E. Burdick Jr
Lien : vide.pdf - | Journal Format-PDF (100 K)

[77] : The linear statistical d.c. model of GaAs MESFET using factor analysis.,
Page 451
Lech Dobrzanski
Lien : vide.pdf - | Journal Format-PDF (100 K)

[78] : High frequency characteristics of MESFETs., Pages 451-452
Ali Afzali-KushaaGeorge I. Haddad
Lien : vide.pdf - | Journal Format-PDF (197 K)

[79] : Lead inductance of tape carrier package for high-speed LSI's., Page 452
Mitsuyuki Takada
Lien : vide.pdf - | Journal Format-PDF (98 K)

[80] : Reliability modelling and performance evaluation of variable link-capacity
networks., Page 452
Pramod K. VarshneyAbhay R. JoshiChang Pei-Liang
Lien : vide.pdf - | Journal Format-PDF (98 K)

[81] : A new contactless S-polarized reflectance technique for determining the Si
film and buried oxide thickness in silicon-on-insulator materials., Page
452
Chang Yun-ShanS. Li Sheng
Lien : vide.pdf - | Journal Format-PDF (98 K)

[82] : Investigation of multilayered Ge/Si structures with varying thicknesses.,
Page 452
N. A. KiselevO. I. LebedevA. L. VasilievM. V. AntipovA. a. OrlikovskyK. A.
ValievA. G. Vasiliev
Lien : vide.pdf - | Journal Format-PDF (98 K)

[83] : Active doping instability in n+ -p silicon surface avalanche diodes., Page
452
S. Manzini
Lien : vide.pdf - | Journal Format-PDF (98 K)

[84] : The effects of impurity bands on the electrical characteristics of
metal-semiconductor ohmic contacts., Pages 452-453
Lou Yung-SongWu Ching-Yuan
Lien : vide.pdf - | Journal Format-PDF (195 K)

[85] : Resistivity curves for subsurface diffused layers in silicon., Page 453
Constantin Bulucea
Lien : vide.pdf - | Journal Format-PDF (98 K)

[86] : Plasma-grown oxides on silicon with extremely low interface state
densities., Page 453
G. P. KennedyS. TaylorW. EcclestonM. J. Uren
Lien : vide.pdf - | Journal Format-PDF (98 K)

[87] : MOSFET degradation during substrate hot electron stress., Page 453
P. Zhao S.S. TaylorA. McPhie
Lien : vide.pdf - | Journal Format-PDF (98 K)

[88] : A novel hot carrier reliability monitor for LDD p-MOSFETs., Page 453
Pan Y.K. Ng K.Kwong W.
Lien : vide.pdf - | Journal Format-PDF (98 K)

[89] : Application of lead-free eutectic Sn-Ag solder in no-clean thick film
electronic modules., Page 453
Shangguan DongkaiAchyuta AchariWells Green
Lien : vide.pdf - | Journal Format-PDF (98 K)

[90] : Fracture mechanics for thin-film adhesion., Page 453
M. D. Thouless
Lien : vide.pdf - | Journal Format-PDF (98 K)

[91] : A vertical submicron SiC thin film transistor., Pages 453-454
D. Hwang J.K. Fang Y.Y. Tsai T.
Lien : vide.pdf - | Journal Format-PDF (192 K)

[92] : Performance of thin-film chip resistors., Page 454
Larry Bos
Lien : vide.pdf - | Journal Format-PDF (96 K)

[93] : Effect of inorganic binders on the properties of thick film copper
conductor., Page 454
Toshio Ogawa
Lien : vide.pdf - | Journal Format-PDF (96 K)

[94] : Metal capping of MCM thin film features using a laser., Page 454
R. S. PatelT. A. WassickC. Y. Ralston
Lien : vide.pdf - | Journal Format-PDF (96 K)

[95] : Gold-to-gold TAB ILB with a laser., Page 454
Phil Spletter
Lien : vide.pdf - | Journal Format-PDF (96 K)

[96] : Mass production of laser diodes by MBE., Page 454
Hiroshi MatakiHaruo Tanaka
Lien : vide.pdf - | Journal Format-PDF (96 K)

[97] : Selection of IR detectors for a fast laser soldering process with
simultaneous solder joint qualification., Pages 454-455
Johann NicolicsDieter SchrottmayerLaszlo Musiejovsky
Lien : vide.pdf - | Journal Format-PDF (191 K)

[98] : Thin film bonding using ion beam techniques--a review., Page 455
J. E. E. Baglin
Lien : vide.pdf - | Journal Format-PDF (97 K)

[99] : Deposition of III-N thin films by molecular beam epitaxy., Page 455
Robert F. Davis
Lien : vide.pdf - | Journal Format-PDF (97 K)

[100] : Recrystallization characteristics of polycrystalline silicon films
amorphized by germanium ion implantation., Page 455
Kang Myeon-Koo
Lien : vide.pdf - | Journal Format-PDF (97 K)

[101] : Analysis of low energy boron implants in silicon through SiO2 films:
implantation damage and anomalous diffusion., Pages 455-456
L. KaabiC. GontrandB. RemakiF. SeigneurB. Balland
Lien : vide.pdf - | Journal Format-PDF (109 K)

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