Revue : [REVUE482]

Titre : Elsevier Science, Microelectronics Reliability, Volume 44, Issue 4, Pages 549-708, April 2004.

Cité dans : [DATA197] Les revues Microelectronics Reliability et Microelectronics Journal, ELSEVIER, décembre 2004.

Volume : 44
Issue : 4
Pages : 549 - 708
Date : April 2004

[1] : Latchup in voltage tolerant circuits: a new phenomenon, Pages 549-562
Jorge Salcedo-Suñer , Charvaka Duvvury , Roger Cline and Alfonso
Cadena-Hernandez
Lien : vide.pdf - | Full Text + Links | PDF (831 K)

[2] : Effects of radiation and charge trapping on the reliability of high- gate
dielectrics, Pages 563-575
J. A. Felix , J. R. Schwank , D. M. Fleetwood , M. R. Shaneyfelt and E. P.
Gusev
Lien : vide.pdf - | Full Text + Links | PDF (371 K)

[3] : Interfacial properties and reliability of SiO2 grown on 6H-SiC in dry O2
plus trichloroethylene, Pages 577-580
P. T. Lai , J. P. Xu , H. P. Wu and C. L. Chan
Lien : vide.pdf - | Full Text + Links | PDF (328 K)

[4] : Integrating thick copper/Black Diamond™ layer in CMOS interconnect process
for RF passive components, Pages 581-585
Guo Lihui , Zhang Yibin and Su Yong Jie Jeffrey
Lien : vide.pdf - | Full Text + Links | PDF (328 K)

[5] : Metallization of microvias by sputter-deposition, Pages 587-593
Teija Uusluoto , Paavo Jalonen , Harri Laaksonen and Aulis Tuominen
Lien : vide.pdf - | Full Text + Links | PDF (502 K)

[6] : Bias-HAST on tape ball grid array (TBGA) test pattern, Pages 595-602
N. H. Yeung , Victor Lau and Y. C. Chan
Lien : vide.pdf - | PDF (629 K)

[7] : The impact of moisture in mold compound preforms on the warpage of PBGA
packages, Pages 603-609
T. Y. Lin , B. Njoman , D. Crouthamel , K. H. Chua , S. Y. Teo and Y. Y.
Ma
Lien : vide.pdf - | Full Text + Links | PDF (295 K)

[8] : Thermo-mechanical finite element analysis in a multichip build up
substrate based package design, Pages 611-619
Xiaowu Zhang , E. H. Wong , Charles Lee , Tai-Chong Chai , Yiyi Ma ,
Poi-Siong Teo , D. Pinjala and Srinivasamurthy Sampath
Lien : vide.pdf - | Full Text + Links | PDF (833 K)

[9] : Numerical analysis of the warpage problem in TSOP, Pages 621-626
Kyoungsoon Cho and Insu Jeon
Lien : vide.pdf - | Full Text + Links | PDF (505 K)

[10] : Time and temperature-dependent mechanical behavior of underfill materials
in electronic packaging application, Pages 627-638
Chia-Tai Kuo , Ming-Chuen Yip and Kuo-Ning Chiang
Lien : vide.pdf - | Full Text + Links | PDF (881 K)

[11] : Study of adhesive flip chip bonding process and failure mechanisms of ACA
joints, Pages 639-648
A. Seppälä and E. Ristolainen
Lien : vide.pdf - | Full Text + Links | PDF (489 K)

[12] : , Page 649
Juan Santana , Magali Estrada and Ofelia Martinez
Lien : vide.pdf - | Full Text + Links | PDF (190 K)

[13] : Evaluation of MUMPS polysilicon structures for thermal flow sensors, Pages
651-655
I. León , R. Amador and K. Kohlhof
Lien : vide.pdf - | Full Text + Links | PDF (308 K)

[14] : Analysis and design of amplifiers and comparators in CMOS 0.35 m
technology, Pages 657-664
Fernando Paixão Cortes , Eric Fabris and Sergio Bampi
Lien : vide.pdf - | Full Text + Links | PDF (537 K)

[15] : AC analysis of an inverter amplifier using minimum-length trapezoidal
association of transistors, Pages 665-671
Alessandro Girardi and Sergio Bampi
Lien : vide.pdf - | Full Text + Links | PDF (299 K)

[16] : A frequency-domain approach to interconnect crosstalk simulation and
minimization, Pages 673-681
José Ernesto Rayas-Sánchez
Lien : vide.pdf - | Full Text + Links | PDF (347 K)

[17] : Architectural design of a programmable cell for the implementation of a
filter bank on FPGA, Pages 683-695
J. Louzao , S. Paz , D. Tejera , G. Bellora and G. Langwagen
Lien : vide.pdf - | Full Text + Links | PDF (794 K)

[18] : Parallel color space converters for JPEG image compression, Pages 697-703
Luciano Volcan Agostini , Ivan Saraiva Silva and Sergio Bampi
Lien : vide.pdf - | Full Text + Links | PDF (277 K)

[19] : Book review: Intellectual property protection in VLSI designs: Theory and
practice, Hardcover, pp. 183, plus XIX, 106 euro, Kluwer Academic
Publishers, Boston, 2003, ISBN 1-4020-7320-8, Pages 705-706
Gang Qu , Miodrag Potkonjak and Mile Stojcev
Lien : vide.pdf - | Full Text + Links | PDF (199 K)

[20] : Power estimation and optimization for VLIW-based embedded systems;
Vittorio Zaccaria, Mariagiovanna Sami, Donatella Sciuto, Cristina Silvano.
Hardcover, pp. 203, plus XXIV, 107 euro. Kluwer Academic Publishers,
Boston, 2003. ISBN 1-4020-7377-1, Pages 707-708
Mile Stojcev
Lien : vide.pdf - | Full Text + Links | PDF (199 K)
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