Revue : [REVUE388]

Titre : Elsevier Science, Microelectronics Reliability, Volume 43, Issue 3, Pages 343-515, March 2003.

Cité dans : [DATA197] Les revues Microelectronics Reliability et Microelectronics Journal, ELSEVIER, décembre 2004.

Volume : 43
Issue : 3
Pages : 343 - 515
Date : March 2003

[1] : Special Section on IMAPS-Europe 2002, Page 343
Andrzej Dziedzic
Lien : vide.pdf - | Full Text + Links | PDF (33 K)

[2] : Design optimization of an eddy current sensor using the finite-elements method, Pages 345-349
Jürgen Wilde and Yuqing Lai
Lien : vide.pdf - | Full Text + Links | PDF (340 K)

[3] : The influence of packaging materials on RF performance, Pages 351-357
Arun Chandrasekhar, Steven Brebels, Serguei Stoukatch, Eric Beyne, Walter De Raedt and Bart Nauwelaers
Lien : vide.pdf - | Full Text + Links | PDF (462 K)

[4] : Advantages and new development of direct bonded copper substrates, Pages 359-365
Jürgen Schulz-Harder
Lien : vide.pdf - | Full Text + Links | PDF (644 K)

[5] : RF inductors and capacitors integrated on silicon chip by CMOS compatible Cu interconnect technology, Pages 367-370
Guo Lihui, Yu Mingbin and Foo Pang Dow
Lien : vide.pdf - | Full Text + Links | PDF (215 K)

[6] : In-process verification of MLC substrates, Pages 371-375
J. Müller, J. Klein and J. Rayho
Lien : vide.pdf - | Full Text + Links | PDF (415 K)

[7] : Fodel microresistors––processing and basic electrical properties, Pages 377-383
A. Dziedzic, L. Rebenklau, L. J. Golonka and K. -J. Wolter
Lien : vide.pdf - | Full Text + Links | PDF (190 K)

[8] : Integration technology for ferroelectric memory devices, Pages 385-398
Kinam Kim and Yoon J. Song
Lien : vide.pdf - | Full Text + Links | PDF (699 K)

[9] : Practical compact modeling approaches and options for sub-0.1 m CMOS technologies, Pages 399-404
Mansun Chan, Xuemei Xi, Jin He, Kanyu M. Cao, Mohan V. Dunga, Ali M. Niknejad, Ping K. Ko and Chenming Hu
Lien : vide.pdf - | Full Text + Links | PDF (251 K)

[10] : Channel-carrier mobility parameters for 4H SiC MOSFETs, Pages 405-411
Handoko Linewih, Sima Dimitrijev and Kuan Yew Cheong
Lien : vide.pdf - | Full Text + Links | PDF (190 K)

[11] : Passivation and packaging of positive bevelled edge termination and related electrical stability, Pages 413-420
S. Hidalgo, D. Flores, I. Obieta and I. Mazarredo
Lien : vide.pdf - | Full Text + Links | PDF (469 K)

[12] : Design of multi-finger HBTs with a thermal–electrical model, Pages 421-426
Yang-Hua Chang, Chen-Chun Chang-Chiang, Yueh-Cheng Lee and Chi-Chung Liu
Lien : vide.pdf - | Full Text + Links | PDF (362 K)

[13] : Quasi-3D simulation approach for comparative evaluation of triggering ESD protection structures, Pages 427-437
V. A. Vashchenko, A. Concannon, M. ter Beek and P. Hopper
Lien : vide.pdf - | Full Text + Links | PDF (665 K)

[14] : Thermal laser stimulation and NB-OBIC techniques applied to ESD defect localization, Pages 439-444
T. Beauchêne, D. Lewis, F. Beaudoin, V. Pouget, R. Desplats, P. Fouillat, P. Perdu, M. Bafleur and D. Tremouilles
Lien : vide.pdf - | Full Text + Links | PDF (335 K)

[15] : Comparison of different flex materials in high density flip chip on flex applications, Pages 445-451
Petteri Palm, Jarmo Määttänen, Yannick De Maquillé, Alain Picault, Jan Vanfleteren and Björn Vandecasteele
Lien : vide.pdf - | Full Text + Links | PDF (237 K)

[16] : The reliability study of selected Sn–Zn based lead-free solders on Au/Ni–P/Cu substrate, Pages 453-463
R. K. Shiue, L. W. Tsay, C. L. Lin and J. L. Ou
Lien : vide.pdf - | Full Text + Links | PDF (803 K)

[17] : Study of package warp behavior for high-performance flip-chip BGA, Pages 465-471
Yuko Sawada, Kozo Harada and Hirofumi Fujioka
Lien : vide.pdf - | Full Text + Links | PDF (467 K)

[18] : Polymer film deposition with fine pitch openings by stencil printing,
Pages : 473-479
Hirokazu Ezawa, Masaharu Seto, Masahiro Miyata and Hiroshi Tazawa
Lien : vide.pdf - | Full Text + Links | PDF (303 K)

[19] : Behaviour of anisotropic conductive joints under mechanical loading, Pages 481-486
C. W. Tan, Y. C. Chan and N. H. Yeung
Lien : vide.pdf - | Full Text + Links | PDF (289 K)

[20] : A simple and fundamental design rule for resisting delamination in bimaterial structures, Pages 487-494
Thomas D. Moore and John L. Jarvis
Lien : vide.pdf - | Full Text + Links | PDF (182 K)

[21] : An algorithm for calculating the lower confidence bounds of CPU and CPL with application to low-drop-out linear regulators, Pages 495-502
W. L. Pearn and Ming-Hung Shu
Lien : vide.pdf - | Full Text + Links | PDF (113 K)

[22] : The stability of the CuInSe2 solar mini-module I–V characteristics under continuous and light/dark irradiation cycle tests, Pages 503-507
Takeshi Yanagisawa and Takeshi Kojima
Lien : vide.pdf - | Full Text + Links | PDF (300 K)

[23] : Integrated thin film heater-thermocouple systems, Pages 509-512
G. Golan, A. Axelevitch, B. Sigalov and B. Gorenstein
Lien : vide.pdf - | Full Text + Links | PDF (143 K)

[24] : Memory Design Techniques for Low Energy Embedded Systems; Alberto Macii,
Luca Benini, Massimo Poncino. Kluwer Academic Publishers, Boston, USA,

[2002] : Mile Stojcev
Lien : vide.pdf - | Full Text + Links | PDF (38 K)

[25] : A designer's guide to built-in self-test; Charles E. Stround. Kluwer Academic Publishers, Boston, 2002. Hardcover, pp. 319, plus XVI, $ 125, ISBN 1-4020-7050-0, Pages 514-515
Mile Stojcev
Lien : vide.pdf - | Full Text + Links | PDF (42 K)

[26] : Semiconductor Memories: Technologies, Testing and Reliability; Ashok K. Sharma. IEEE Press and Wiley Interscience, New York, 1997. Hardcover, pp. 462, plus XII, ISBN 0-7803-1000-4, Page 515
Mile Stojcev
Lien : vide.pdf - | Full Text + Links | PDF (32 K)

[27] : Calendar of forthcoming events, Pages I-IX
PDF (42 K)

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