Revue : [REVUE333]

Titre : Elsevier Science, Microelectronics Reliability, Volume 37, Issue 3, Pages 381-547, March 1997.

Cité dans : [DATA197] Les revues Microelectronics Reliability et Microelectronics Journal, ELSEVIER, décembre 2004.

Volume : 37
Issue : 3
Pages : 381 - 547
Date : March 1997

[1] : An inspection model with generally distributed restoration and repair times, Pages 381-389
James Fung and Viliam Makis
Lien : vide.pdf - | Journal Format-PDF (419 K)

[2] : Goal-seeking problem in discrete event systems simulation, Pages 391-395
H. Arsham
Lien : vide.pdf - | Journal Format-PDF (333 K)

[3] : A simple technique for obtaining the MTBF of complex systems through
numerical integration of the reliability function, Pages 397-401
R. J. Burns
Lien : vide.pdf - | Journal Format-PDF (256 K)

[4] : Advanced hand calculations for fault tree analysis and synthesis, Pages
403-415
Winfrid G. Schneeweiss
Lien : vide.pdf - | Journal Format-PDF (539 K)

[5] : The effect of minimal repairs on economic lot-sizing, Pages 417-419
J. S. Dagpunar
Lien : vide.pdf - | Journal Format-PDF (180 K)

[6] : Process capability analysis for non-normal relay test data, Pages 421-428
N. Pan J. and L. Wu S.
Lien : vide.pdf - | Journal Format-PDF (439 K)

[7] : A symbolic reliability of multiple path required system with three states,
Pages : 429-435
Choi In-Kyeong, Koh Jai-Sang and Lee So-Yeon
Lien : vide.pdf - | Journal Format-PDF (343 K)

[8] : The symmetric M/G/k loss system with heterogeneous servers, Pages 437-438
D. Fakinos
Lien : vide.pdf - | Journal Format-PDF (90 K)

[9] : Reliability prediction of imperfect switching systems subject to multiple
stresses, Pages 439-445
N. Pan J.
Lien : vide.pdf - | Journal Format-PDF (344 K)

[10] : Fuzzy multi-objective optimization decision-making of reliability of
series system, Pages 447-449
Huang H.-Z.
Lien : vide.pdf - | Journal Format-PDF (149 K)

[11] : Preservation of some partial orderings under non-homogeneous Poisson shock
model and Laplace transform, Pages 451-455
Kan Cheng and Wen Yi Wang
Lien : vide.pdf - | Journal Format-PDF (213 K)

[12] : A test for the BMRL-t0 class, Pages 457-459
Min Lee Seung and Ho Park Dong
Lien : vide.pdf - | Journal Format-PDF (175 K)

[13] : The methods of reduction in network reliability computing, Pages 461-465
Wang Wenyi and Zhang Hongfen
Lien : vide.pdf - | Journal Format-PDF (224 K)

[14] : Optimal replacement of an item subject to cumulative damage under periodic
inspections, Pages 467-472
Myung B. Kong and Kyung S. Park
Lien : vide.pdf - | Journal Format-PDF (316 K)

[15] : CAST: An electrical stress test to monitor single bit failures in
flash-eeprom structures, Pages 473-481
P. Cappelletti, R. Bez, D. Cantarelli, D. Nahmad and L. Ravazzi
Lien : vide.pdf - | Journal Format-PDF (375 K)

[16] : Enumeration of minimal cuts of modified networks, Pages 483-485
J. M. Nahman
Lien : vide.pdf - | Journal Format-PDF (131 K)

[17] : A design of experiment analysis of serial EEPROM endurance, Pages 487-491
D. Wilkie, R. Drwinga, E. Eichman, N. Kunnari, B. Negley and D. Richardson
Lien : vide.pdf - | Journal Format-PDF (295 K)

[18] : Some characteristics of a man-machine system operating subject to
different weather conditions, Pages 493-496
G. S. Mokaddis, M. L. Tawfek and S. A. M. Elhssia
Lien : vide.pdf - | Journal Format-PDF (175 K)

[19] : A maintenance model for two-unit redundant system, Pages 497-504
Lam Yeh
Lien : vide.pdf - | Journal Format-PDF (366 K)

[20] : Comparisons of block diagram and markov method system reliability and mean
time to failure results for constant and non-constant unit failure rates,
Pages : 505-509
B. S. Dhillon and N. Yang
Lien : vide.pdf - | Journal Format-PDF (198 K)

[21] : A new formula and an algorithm for reliability analysis of networks, Pages
511-518
Zhao Lian-Chang and Kong Fan-Jia
Lien : vide.pdf - | Journal Format-PDF (411 K)

[22] : Die attach failures related to wafer back metal processing--an aes study,
Pages : 519-523
M. K. Radhakrishnan
Lien : vide.pdf - | Journal Format-PDF (139 K)

[23] : Long-run availability of a repairable parallel system, Pages 525-527
E. J. Vanderperre, S. S. Makhanov and Sunthorn Suchatvejapoom
Lien : vide.pdf - | Journal Format-PDF (163 K)

[24] : Reliability and quality in design., Page 529
William A. Golomski
Lien : vide.pdf - | Journal Format-PDF (71 K)

[25] : A changing paradigm in quality., Page 529
Hilario L. Oh
Lien : vide.pdf - | Journal Format-PDF (71 K)

[26] : A combined fuzzy-logic and physics-of-failure approach to reliability
prediction., Page 529
Marius Bazu
Lien : vide.pdf - | Journal Format-PDF (71 K)

[27] : Tutorial: corrosion of metallic materials., Pages 529-530
Martin Tullmin and Pierre R. Roberge
Lien : vide.pdf - | Journal Format-PDF (166 K)

[28] : Reliability of printed wiring boards by thermal shock test., Page 530
Tanaka Hjirokazu, Yuuichi Aoki and Yamamoto Shigeharu
Lien : vide.pdf - | Journal Format-PDF (95 K)

[29] : Failure mechanisms in AlGaAs/GaAs HEMTs., Page 530
K. A. Christianson, C. Moglestue and W. T. Anderson
Lien : vide.pdf - | Journal Format-PDF (95 K)

[30] : Effective erosion rates for selected contact materials in low-voltage
contactors., Page 530
M. Bruce Schulman, Paul G. Slade and John A. Bindas
Lien : vide.pdf - | Journal Format-PDF (95 K)

[31] : Electrical characteristics of various contact contaminations., Page 530
Christian N. Neufeld and Werner F. Rieder
Lien : vide.pdf - | Journal Format-PDF (95 K)

[32] : Modelling intermediate tests for fault-tolerant multichip module systems.,
Pages : 530-531
Sungsoo Kim and Fabrizio Lombardi
Lien : vide.pdf - | Journal Format-PDF (189 K)

[33] : A test chip design for detecting thin-film cracking in integrated
circuits., Page 531
Stephen A. Gee, Martin R. Johnson and L. Chen Kuan
Lien : vide.pdf - | Journal Format-PDF (95 K)

[34] : Moisture sensitivity and reliability of plastic thermally enhanced QFP
packages., Page 531
Laurene Yip
Lien : vide.pdf - | Journal Format-PDF (95 K)

[35] : Microstructure of conductive anodic filaments formed during accelerated
testing of printed wiring boards., Page 531
W. J. Ready, S. R. Stock, G. B. Freeman, L. L. Dollar and L. J. Turbini
Lien : vide.pdf - | Journal Format-PDF (95 K)

[36] : Reliability of electrically conducting knife-edge bearings of switches.,
Page 531
Thomas J. Schopf and Werner F. Rieder
Lien : vide.pdf - | Journal Format-PDF (95 K)

[37] : Logic synthesis for reliability: an early start to controlling
electromigration and hot-carrier effects., Page 532
Kaushik Roy and Sharat Prasad
Lien : vide.pdf - | Journal Format-PDF (95 K)

[38] : A correlation study between different types of CDM testers and `real'
manufacturing in-line leakage failure., Page 532
Michael D. Chaine, Teck Liong Chen and Fock San Ho
Lien : vide.pdf - | Journal Format-PDF (95 K)

[39] : Solder joint reliability of large plastic ball grid array assemblies under
bending, twisting, and vibration conditions., Page 532
Lau J., K. Gratalo, E. Schneider, T. Marcotte and T. Baker
Lien : vide.pdf - | Journal Format-PDF (95 K)

[40] : Unreplicated experimental designs in reliability-growth programmes., Page
532
Claudio Benski and Emmanuel Cabau
Lien : vide.pdf - | Journal Format-PDF (95 K)

[41] : Stochastic modelling of aggregates and products of variable failure
rates., Page 532
N. Singh
Lien : vide.pdf - | Journal Format-PDF (95 K)

[42] : Reliability analysis of accelerated life-test data from a repairable
system., Pages 532-533
Maurizio Guida and Massimiliano Giorgio
Lien : vide.pdf - | Journal Format-PDF (189 K)

[43] : Optimal design of flexible and reliable process systems, Page 533
Thomas V. Thomaidis and Efstratios M. Pistikopoulos
Lien : vide.pdf - | Journal Format-PDF (94 K)

[44] : A device life cycle analysis of the WSI associative string processor, Page
533
Christopher Peacock, Hamid Bolouri and R. Mike Lea
Lien : vide.pdf - | Journal Format-PDF (94 K)

[45] : Defect and fault tolerant interconnection strategies for WASP devices,
Page 533
Mohammed B. A. Hussaini, Hamid Bolouri and R. Mike Lea
Lien : vide.pdf - | Journal Format-PDF (94 K)

[46] : Reliability of a linear connected-(r, s)-out-of-(m, n):F lattice system,
Page 533
H. Yamamoto and M. Miyakawa
Lien : vide.pdf - | Journal Format-PDF (94 K)

[47] : A system approach to reliability and life-cycle cost of process
safety-systems, Page 533
Lars Bodsberg and Per Hokstad
Lien : vide.pdf - | Journal Format-PDF (94 K)

[48] : Using statistically designed experiments to improve reliability and to
achieve robust reliability, Pages 533-534
Michael Hamada
Lien : vide.pdf - | Journal Format-PDF (188 K)

[49] : Cosmic ray induced failures in high power semiconductor devices, Page 534
H. R. Zeller
Lien : private/ZELLER2.pdf - | Journal Format-PDF (94 K)

  [1] :  [ART265]  H. R. ZELLER, Cosmic ray induced failures in high power semiconductor devices, Microelectronics and Reliability, Volume 37, Issues 3, March 1997, pp. 534.

[50] : Reliability-estimation and stopping-rules for software testing, based on
repeated appearance of bugs, Page 534
Mark C. K. Yang and Anne Chao
Lien : vide.pdf - | Journal Format-PDF (94 K)

[51] : Quality engineering (Taguchi Methods) for the development of electronic
circuit technology, Page 534
Genichi Taguchi
Lien : vide.pdf - | Journal Format-PDF (94 K)

[52] : Joint reliability-importance of components, Page 534
Michael J. Armstrong
Lien : vide.pdf - | Journal Format-PDF (94 K)

[53] : Best linear unbiased estimator of the Rayleigh scale parameter based on
fairly large censored samples, Page 535
A. Adatia
Lien : vide.pdf - | Journal Format-PDF (89 K)

[54] : A study of technical terms of failure and fuzzy set theory, Page 535
Tadashi Muratoa and Shinji Hatano
Lien : vide.pdf - | Journal Format-PDF (89 K)

[55] : Multiple fault diagnosis in combinational circuits, Page 535
Enrico Macii and Tara Wolf
Lien : vide.pdf - | Journal Format-PDF (89 K)

[56] : Analysis of screening data by using Weibull distribution, Page 535
Kazuhiro Tsurumaru and Hirokazu Yukawa
Lien : vide.pdf - | Journal Format-PDF (89 K)

[57] : A methodology and design tools to support system-level VLSI design, Page
535
Kayhan Kucukcakar and Alice C. Parker
Lien : vide.pdf - | Journal Format-PDF (89 K)

[58] : Compound Poisson approximation in reliability theory, Page 535
Andrew D. Barbour, Ourania Chryssaphinou and Malgorzata Roos
Lien : vide.pdf - | Journal Format-PDF (89 K)

[59] : Differential BiCMOS logic circuits: fault characterization and
design-for-testability, Pages 535-536
S. Hessabi, M. Y. Osman and M. I. Elmasry
Lien : vide.pdf - | Journal Format-PDF (185 K)

[60] : Bathtub failure rate and upside-down bathtub mean residual life, Page 536
Mi Jie
Lien : vide.pdf - | Journal Format-PDF (96 K)

[61] : Quick inspection of power plane short fault on multilayer substrate, Page
536
Chao Fang-Lin and Wu Ruey-Beei
Lien : vide.pdf - | Journal Format-PDF (96 K)

[62] : Nondestructive detection of defects in miniaturized multilayer ceramic
capacitors using digital speckle correlation techniques, Page 536
C. Chan Y.
Lien : vide.pdf - | Journal Format-PDF (96 K)

[63] : Electrochemical processes resulting in migrated short failures in
microcircuits, Page 536
Gabor Harsanyi
Lien : vide.pdf - | Journal Format-PDF (96 K)

[64] : Popcorning: a failure mechanism in plastic-encapsulated microcircuits,
Page 536
Anthony A. Gallo and Ramesh Munamarty
Lien : vide.pdf - | Journal Format-PDF (96 K)

[65] : Thermal fatigue behaviour of J-lead solder joints, Pages 536-537
Charles G. Schmidt, Jeffrey W. Simons, Christine H. Kanazawa and David C.
Erlich
Lien : vide.pdf - | Journal Format-PDF (190 K)

[66] : Unavailability analysis of periodically tested standby components., Page
537
J. K. Vaurio
Lien : vide.pdf - | Journal Format-PDF (95 K)

[67] : Genetic algorithms in optimization of system reliability., Page 537
Laura Painton and James Campbell
Lien : vide.pdf - | Journal Format-PDF (95 K)

[68] : Statistical tools for the rapid development and evaluation of
high-reliability products., Page 537
William Q. Meeker and Michael Hamada
Lien : vide.pdf - | Journal Format-PDF (95 K)

[69] : Intelligent materials in future electronics., Pages 537-538
Kiyoshi Tahahashi and Shinji Nozaki
Lien : vide.pdf - | Journal Format-PDF (189 K)

[70] : Chip scale package: `a lightly dressed LSI chip'., Page 538
Masatoshi Yasunaga
Lien : vide.pdf - | Journal Format-PDF (94 K)

[71] : Low-cost flip-chip bonding on FR-4 boards., Page 538
J. Kloeser, E. Zakel and H. Reichl
Lien : vide.pdf - | Journal Format-PDF (94 K)

[72] : 296 lead fine pitch (0.4 mm) thin plastic QFP package with TAB
interconnect., Page 538
Praveen Jain
Lien : vide.pdf - | Journal Format-PDF (94 K)

[73] : Ultra-clean processing for ULSI., Page 538
Tadahiro Ohmi
Lien : vide.pdf - | Journal Format-PDF (94 K)

[74] : Designing-in of quality through axiomatic design., Pages 538-539
Nam P. Suh
Lien : vide.pdf - | Journal Format-PDF (187 K)

[75] : Design of 0.35-mm pitch QFP lead and its assembly technology., Page 539
Makoto Totani
Lien : vide.pdf - | Journal Format-PDF (93 K)

[76] : A study of polyimide adhesion to epoxy resin in PFP using multivariate
analysis of XPS spectra., Page 539
Kohgichi Takeuchi, Naganori Tsutsui and Nobuhito Miura
Lien : vide.pdf - | Journal Format-PDF (93 K)

[77] : Studies on design of moisture proof packing for IC packages., Page 539
Hidetoshi Kusano and Kenji Sasaki
Lien : vide.pdf - | Journal Format-PDF (93 K)

[78] : A shear-based optimization of adhesive thickness for die bonding., Page
539
Karl E. Hokanson and Avram Bar-Cohen
Lien : vide.pdf - | Journal Format-PDF (93 K)

[79] : Low-temperature plasma deposition of silicon nitride to produce
ultra-reliable, high performance, low cost sealed chip-on-board (SCOB)
assemblies., Page 540
Ronald M. Kubacki
Lien : vide.pdf - | Journal Format-PDF (96 K)

[80] : Low-cost multichip modules., Page 540
Michael Dobers, Martin Seyffert, Frank D. Hauschild and Claus-Peter Czaya
Lien : vide.pdf - | Journal Format-PDF (96 K)

[81] : Advanced low-cost bare-DIE packaging technology for liquid crystal
displays., Page 540
Jackson C. Hwang
Lien : vide.pdf - | Journal Format-PDF (96 K)

[82] : Approaches to electronic miniaturization., Page 540
H. M. B. Bird
Lien : vide.pdf - | Journal Format-PDF (96 K)

[83] : Development of 0.45-mm thick ultra-thin small outline package., Pages
540-541
Susumo Omi
Lien : vide.pdf - | Journal Format-PDF (191 K)

[84] : Influence of process parameter variations on the signal distribution
behaviour of wafer scale integration devices., Page 541
Thomas Gneiting and Ian P. Jalowiecki
Lien : vide.pdf - | Journal Format-PDF (94 K)

[85] : Gas-assisted evaporative cooling of high density electronic modules., Page
541
Avram Bar-Cohen, Greg Sherwood, Marc Hodes and Gary Solbreken
Lien : vide.pdf - | Journal Format-PDF (94 K)

[86] : Thermal-mechanical enhanced high-performance silicone gels and elastomeric
encapsulants in microelectronic packaging, Page 541
P. Wong C.
Lien : vide.pdf - | Journal Format-PDF (94 K)

[87] : Behaviour of delaminated plastic IC packages subjected to encapsulation
cooling, moisture absorption and wave soldering., Pages 541-542
Liu Sheng and Mei Yuhai
Lien : vide.pdf - | Journal Format-PDF (188 K)

[88] : A VLSI priority packet queue with inheritance and overwrite., Page 542
Dan Picker and Ronald D. Fellman
Lien : vide.pdf - | Journal Format-PDF (94 K)

[89] : A wafer level testability approach based on an improved scan insertion
technique., Page 542
Cristiana Bolchini
Lien : vide.pdf - | Journal Format-PDF (94 K)

[90] : Test vehicle for a wafer-scale field programmable gate array., Page 542
Benoit Dufort and Glenn H. Chapman
Lien : vide.pdf - | Journal Format-PDF (94 K)

[91] : Efficient network folding techniques for routing permutations in VLSI.,
Page 542
Hussein M. Alnuweiri and Sadiq M. Sait
Lien : vide.pdf - | Journal Format-PDF (94 K)

[92] : Evaluation methods of ion migration by dew condensation cycle test., Pages
542-543
Yuuichi Oaki, Tanaka Hirokazu, Yamamoto Shigeharu and Obata Osamu
Lien : vide.pdf - | Journal Format-PDF (187 K)

[93] : An empirical model for early resistance changes due to electromigration.,
Page 543
J. Niehof, H. C. de Graaff, A. J. Mouthaan and J. F. Verwey
Lien : vide.pdf - | Journal Format-PDF (93 K)

[94] : Bulk micromachining of Si by lithography and reactive ion etching
(LIRIE)., Page 543
I. W. Rangelow, P. Hudek and F. Shi
Lien : vide.pdf - | Journal Format-PDF (93 K)

[95] : Failure mode analysis of AlGaAs/GaAs HBTs using electrostatic discharge
method., Page 543
Yorio Ota, Manabu Yanagihara and Morio Nakamura
Lien : vide.pdf - | Journal Format-PDF (93 K)

[96] : Surface related degradation of InP-based HEMTs during thermal stress.,
Page 543
Y. Ashizawa, C. Nozaki, T. Noda, A. Sasaki and S. Fujita
Lien : vide.pdf - | Journal Format-PDF (93 K)

[97] : Electrical characterisation of integrated circuit metal line thickness.,
Pages : 543-544
Santos Mayo and Harry A. Schafft
Lien : vide.pdf - | Journal Format-PDF (180 K)

[98] : The dependence of etch rate of photo-CVD silicon nitride films on NH4F
content in buffered HF., Page 544
V. K. Rathi, Manju Gupta and O. P. Agnihotri
Lien : vide.pdf - | Journal Format-PDF (87 K)

[99] : A new gate current measurement technique for the characterization of
hot-carrier induced degradation in MOSFETs., Page 544
E. Leang S., K. Chim W. and S. H. Chan D.
Lien : vide.pdf - | Journal Format-PDF (87 K)

[100] : Microcrystalline silicon thin films prepared by RF reactive magnetron
sputter deposition., Page 544
M. F. Cerqueria, M. Andritschky, L. Rebouta, J. A. Ferreira and M. F. Da
Silva
Lien : vide.pdf - | Journal Format-PDF (87 K)

[101] : Solder paste for fine line printing in hybrid microelectronics., Page 544
Dubravka Rocak, Vinko Stopar and Janeta Fajfar Plut
Lien : vide.pdf - | Journal Format-PDF (87 K)

[102] : Some fundamental aspects of UV laser direct imaging., Page 544
H. Choi J.
Lien : vide.pdf - | Journal Format-PDF (87 K)

[103] : A method for determining the fast neutral portion of ion beams., Page 544
M. Nedialkov, V. Zinenko and D. Karpuzov
Lien : vide.pdf - | Journal Format-PDF (87 K)

[104] : Selective reactive ion etching on PECVD silicon nitride over amorphous
silicon in CF4/H2 and nitrogen containing CF4/H2 plasma gas mixtures.,
Pages : 544-545
M. Jagadesh Kumar and Savvas G. Chamberlain
Lien : vide.pdf - | Journal Format-PDF (133 K)

[105] : Ionized dopant concentrations in silicon--an analytical approach., Page
545
H. Norde
Lien : vide.pdf - | Journal Format-PDF (46 K)

[106] : Deep-level trapping in ion-implanted InP JFETs., Page 545
W. Kruppa and J. B. Boos
Lien : vide.pdf - | Journal Format-PDF (46 K)

[107] : A study on a method of testing ion migration., Page 545
Yuko Kanai
Lien : vide.pdf - | Journal Format-PDF (46 K)

[108] : Book Review, Page 547
Lien : vide.pdf - Format-PDF (46 K)

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