Revue : [REVUE324]

Titre : Elsevier Science, Microelectronics Reliability, Volume 36, Issue 4, Pages 457-562 (April 1996.

Cité dans : [DATA197] Les revues Microelectronics Reliability et Microelectronics Journal, ELSEVIER, décembre 2004.

Volume : 36, Issue 4,
Pages : 457-562 (April 1996)
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[1] : Properties of the akaike information criterion, Pages 457-464
Adnan M. Awad
Lien : vide.pdf - | Journal Format-PDF (401 K)

[2] : Some new reliability problems and results for one-unit repairable system,
Pages : 465-468
Tang Ying Hui
Lien : vide.pdf - | Journal Format-PDF (151 K)

[3] : On modification of the relative complexity metric, Pages 469-475
Thomas Meitzler and Grant GerhartHarpreet Singh
Lien : vide.pdf - | Journal Format-PDF (258 K)

[4] : Behavioural analysis of a shell gasification and carbon recovery process
in a urea fertilizer plant, Pages 477-480
S. KumarD. KumarN. P. Mehta
Lien : vide.pdf - | Journal Format-PDF (164 K)

[5] : Gert analysis of a two-unit warm standby system with repair, Pages 481-484
G. Shankar and V. Sahani
Lien : vide.pdf - | Journal Format-PDF (191 K)

[6] : Software reliability growth supermodels, Pages 485-491
Fl. Popeniu and D. N. Boro
Lien : vide.pdf - | Journal Format-PDF (237 K)

[7] : Hot carrier effect--model, mechanism and effects on C-V and I-V
characteristics in MOS structures, Pages 493-496
Cezhou Zhao, Desheng Zhang and Baohua Shi
Lien : vide.pdf - | Journal Format-PDF (227 K)

[8] : Some characteristics of a two-dissimilar-unit cold standby redundant
system with three modes, Pages 497-503
G. S. Mokaddis and M. L. Tawfek
Lien : vide.pdf - | Journal Format-PDF (295 K)

[9] : Approximate analysis of n-unit cold-standby systems, Pages 505-509
M. N. Gopalan and U. Dinesh Kumar
Lien : vide.pdf - | Journal Format-PDF (280 K)

[10] : Reliability and performance evaluation of four tree multistage
interconnection network, Pages 511-515
Savina Bansal and R. K. Bansal
Lien : vide.pdf - | Journal Format-PDF (248 K)

[11] : A two-unit duplicating standby system with correlated
failure-repair/replacement times, Pages 517-523
L. R. Goel, S. Z. Mumtaz and Rakesh Gupta
Lien : vide.pdf - | Journal Format-PDF (300 K)

[12] : On the transient behaviour of a repairable system with a warm standby,
Pages : 525-532
M. N. GopalanU. Dinesh Kumar
Lien : vide.pdf - | Journal Format-PDF (280 K)

[13] : Simultaneous development and qualification in the fast-changing 3.5''
hard-disk-drive technology., Page 533
X. Kembo Zunzanyika
Lien : vide.pdf - | Journal Format-PDF (77 K)

[14] : Vibration fatigue of surface mount technology (SMT) solder joints., Page
533
Salvatore LiguoreDavid Followell
Lien : vide.pdf - | Journal Format-PDF (77 K)

[15] : An investigation of solder joint fatigue using electrical resistance
spectroscopy., Pages 534-535
James H. ConstableChristine Lizzul
Lien : vide.pdf - | Journal Format-PDF (196 K)

[16] : Consideration of component failure mechanisms in the reliability
assessment of electronic equipment-Addressing the constant failure rate
assumption., Page 534
David E. MortinJane G. KrolewskiMichael J. Cushing
Lien : vide.pdf - | Journal Format-PDF (99 K)

[17] : Reliability comparisons for plastic-encapsulated microcircuits., Page 534
Brett BakerSteve Martin
Lien : vide.pdf - | Journal Format-PDF (99 K)

[18] : Reliability issues of replacing solder with conductive adhesives in power
modules., Page 534
Outi RusanenJaako Kenkkeri
Lien : vide.pdf - | Journal Format-PDF (99 K)

[19] : Open repair technologies for MCM-D., Page 534
Thomas A. WassickLaertis Economikos
Lien : vide.pdf - | Journal Format-PDF (99 K)

[20] : A modified bathtub curve with latent failures., Page 534
John R. EnglishYan LiThomas L. Landers
Lien : vide.pdf - | Journal Format-PDF (99 K)

[21] : Performance and reliability of optical fibre connectors in the outside
plant environment., Page 535
Arun K. AgarwalLynn D. Hutcheson
Lien : vide.pdf - | Journal Format-PDF (99 K)

[22] : Reliability study of aluminum electrolytic capacitors for space use., Page
535
Muneaki Nakai
Lien : vide.pdf - | Journal Format-PDF (99 K)

[23] : High reliability internal capacitor of LTCC., Page 535
Yasuyuki BabaHorishi OchiShigetoshi Segawa
Lien : vide.pdf - | Journal Format-PDF (99 K)

[24] : Reliability test on chip type of high capacitance multilayer ceramic
capacitors., Page 535
Kenji MurataToshimi Kawakami
Lien : vide.pdf - | Journal Format-PDF (99 K)

[25] : Demonstrated reliability of plastic-encapsulated microcircuits for missile
applications., Page 535
Tam Sun Man
Lien : vide.pdf - | Journal Format-PDF (99 K)

[26] : A generalized geometric de-eutrophication software-reliability model.,
Page 536
Oliver GaudoinChristian LavergneJean-Louis Soler
Lien : vide.pdf - | Journal Format-PDF (100 K)

[27] : Fault-tolerant routing algorithms using estimator discretized learnign
automata for high-speed packet-switched networks., Page 536
Athanosios V. VasilakosConstantinos T. Paximadis
Lien : vide.pdf - | Journal Format-PDF (100 K)

[28] : Testing constant failure rate against NBAFR alternatives with randomly
right-censored data., Page 536
Ram C. TiwariJyoti N. Zalkikar
Lien : vide.pdf - | Journal Format-PDF (100 K)

[29] : Process optimization for polysilicon-thermal oxide-polysilicon
capacitors., Page 536
Tomasz BrozekRobert Wisniewski
Lien : vide.pdf - | Journal Format-PDF (100 K)

[30] : An O(n·(log2(n))2) algorithm for computing the reliability of k-out-of-n:G
and k-to-l-out-of-n:G systems., Pages 537-538
Lee A. Belfore
Lien : vide.pdf - | Journal Format-PDF (194 K)

[31] : Efficient algorithms for k-out-of-n and consecutive weighted-k-out-of-n:F
system., Page 537
Wu Jer-ShyanChen Rong-Jaye
Lien : vide.pdf - | Journal Format-PDF (96 K)

[32] : Latent design faults in the development of the multiflow TRACE/200., Page
537
Robert P. ColwellRichard A. Lethin
Lien : vide.pdf - | Journal Format-PDF (96 K)

[33] : Analysis of TAB inner lead fatigue in thermal cycle environments., Page
537
Kevin D. Cluff
Lien : vide.pdf - | Journal Format-PDF (96 K)

[34] : Characterization of distributions by relationships between failure rate
and mean residual life., Page 537
Jose M. RuizJorge Navarro
Lien : vide.pdf - | Journal Format-PDF (96 K)

[35] : Environmental stress testing experiment using the Taguchi method., Page
537
Dennis E. Pachucki
Lien : vide.pdf - | Journal Format-PDF (96 K)

[36] : Fault-tree analysis: a knowledge-engineering approach., Pages 538-539
Jose AntonioBogarin GeymayrNelson FranciscoFavilla Ebecken
Lien : vide.pdf - | Journal Format-PDF (194 K)

[37] : Detection of multiple faults using SSFTS in CMOS logic circuits., Page 538
Carol Q. TongDing Lu
Lien : vide.pdf - | Journal Format-PDF (99 K)

[38] : Reliability prediction and estimation of Prolog programmes., Page 538
Alireza AzemFevzi BelliPiotr Jedrzejowicz
Lien : vide.pdf - | Journal Format-PDF (99 K)

[39] : An exact recursion relation solution for the steady-state surface
temperature of a general multilayer structure., Page 538
John Albers
Lien : vide.pdf - | Journal Format-PDF (99 K)

[40] : An O(k3·log(n/k)) algorithm for the consecutive-k-out-of-n:F system., Page
538
Frank K. HwangPaul E. Wright
Lien : vide.pdf - | Journal Format-PDF (99 K)

[41] : Latent open defect detection using phase-sensitive nonlinearity detection
technique., Page 539
Arnold HalperinThomas H. DistefanoChiang Shinwu
Lien : vide.pdf - | Journal Format-PDF (96 K)

[42] : Power cycling and stress variation in a multichip module., Page 539
Biswajit SurIwona Turlik
Lien : vide.pdf - | Journal Format-PDF (96 K)

[43] : Optimal preventive-replacement intervals for the Weibull life
distribution: solutions and applications., Page 539
J. HuangC. R. MillerO. G. Okogbaa
Lien : vide.pdf - | Journal Format-PDF (96 K)

[44] : Cumulative balance testing of logic circuits., Page 539
Krishendu ChakrabartyJohn P. Hayes
Lien : vide.pdf - | Journal Format-PDF (96 K)

[45] : Rationalizing scheduled-maintenance requirements using reliability
centered maintenance--A Canadian Air Force perspective., Page 539
Lugwig J. HollickGreg N. Nelson
Lien : vide.pdf - | Journal Format-PDF (96 K)

[46] : Optimum constant-stress accelerated life-test plans., Pages 540-541
Guang-Bin Yang
Lien : vide.pdf - | Journal Format-PDF (198 K)

[47] : A simple lower bound for reliability of k-out-of-n:G systems., Page 540
Myron Lipow
Lien : vide.pdf - | Journal Format-PDF (102 K)

[48] : Reliability of mobile phones., Page 540
U. Daya Perera
Lien : vide.pdf - | Journal Format-PDF (102 K)

[49] : Application of fuzzy theory to reliability prediction., Page 540
Takeshi Koyama
Lien : vide.pdf - | Journal Format-PDF (102 K)

[50] : Time-varying failure rates in the availability and reliability analysis of
repairable systems., Page 540
Thomas F. HassettDuane L. DietrichFerenz Szidarovszky
Lien : vide.pdf - | Journal Format-PDF (102 K)

[51] : On reliability growth testing., Page 541
Edward Demko
Lien : vide.pdf - | Journal Format-PDF (98 K)

[52] : Dependent-failures in spacecraft: root causes, coupling, factors, defenses
and design implications., Page 541
Peter J. RutledgeAli Mosleh
Lien : vide.pdf - | Journal Format-PDF (98 K)

[53] : Infinite-failure models for a finite world: a simulation study of fault
discovery., Page 541
Wendell JonesDavid Gregory
Lien : vide.pdf - | Journal Format-PDF (98 K)

[54] : Reliability-centred test., Page 541
Nelson O. Wood
Lien : vide.pdf - | Journal Format-PDF (98 K)

[55] : System reliability analysis of an N-Version programming application., Page
541
Joanne Bechta DuganMichael R. Lyu
Lien : vide.pdf - | Journal Format-PDF (98 K)

[56] : Environmental stress screening strategies for multi-component systems with
Weibull failure-times and imperfect failure detection., Page 542
Edward A. PohlDuane L. Dietrich
Lien : vide.pdf - | Journal Format-PDF (99 K)

[57] : An approach to quantifying reliability-growth effectiveness., Page 542
Kenneth J. FarquharAli Mosleh
Lien : vide.pdf - | Journal Format-PDF (99 K)

[58] : Analysis technique for real-time, fault-tolerant, VLSI processing arrays.,
Page 542
Andrew J. SchwabBarry W. JohnsonJoanne Bechta Dugan
Lien : vide.pdf - | Journal Format-PDF (99 K)

[59] : Application of boundary-tracking gradient-method for optimizing spares
cost for k-out-of-n:G systems., Page 542
V. K. SrivastavaA. Fahim
Lien : vide.pdf - | Journal Format-PDF (99 K)

[60] : Technology CAD at AT&T., Pages 543-544
Peter Lloyd
Lien : vide.pdf - | Journal Format-PDF (199 K)

[61] : CMOS scaling into the 21st century: 0.1 m and beyond., Page 543
Y. Taur
Lien : vide.pdf - | Journal Format-PDF (101 K)

[62] : The benefits of stress testing., Page 543
H. Anthony Chan
Lien : vide.pdf - | Journal Format-PDF (101 K)

[63] : A coverage analysis tool for the effectiveness of software testing., Page
543
Michael R. LyuJ. R. HorganSaul London
Lien : vide.pdf - | Journal Format-PDF (101 K)

[64] : Determining the duration of a demonstration life-test before all units
fail., Page 543
Necip Doganaksoy
Lien : vide.pdf - | Journal Format-PDF (101 K)

[65] : 320 Gb/s high-speed ATM switching system hardware technologies based on
copper-polyimide MCM., Pages 544-545
Naoki Yamanaka
Lien : vide.pdf - | Journal Format-PDF (197 K)

[66] : Reliability comparison of two metallurgies for ceramic ball grid array.,
Page 544
Donald R. BanksTerry E. BurnetteR. David GerkeEmphraim MannoShyam Mattay
Lien : vide.pdf - | Journal Format-PDF (99 K)

[67] : The evolution of IBM CMOS DRAM technology., Page 544
E. Adler
Lien : vide.pdf - | Journal Format-PDF (99 K)

[68] : Simulating transient-state system effectiveness for human-machine
systems., Page 544
Lin Fen-HuiKuo Way
Lien : vide.pdf - | Journal Format-PDF (99 K)

[69] : Integrated cost and productivity learning in CMOS semiconductor
manufacturing., Page 544
G. A. LeonovichA. P. FranchinoW. J. MillerU. E. Tsou
Lien : vide.pdf - | Journal Format-PDF (99 K)

[70] : Integrated flex: rigid-flex capability in a high performance MCM., Pages
545-546
David N. LightJohn S. KresgeCharles R. Davis
Lien : vide.pdf - | Journal Format-PDF (200 K)

[71] : Simulation of high speed interconnects using a convolution-based
hierarchical packaging simulator., Page 545
Mark S. BaselMichael B. SteerPaul D. Franzon
Lien : vide.pdf - | Journal Format-PDF (99 K)

[72] : A micromachined array probe card--fabrication process., Page 545
Mark BeileyJustin LeungS. Simon Wong
Lien : vide.pdf - | Journal Format-PDF (99 K)

[73] : Cracking failures in lead-on-chip packages induced by chip backside
contamination., Page 545
Masazumi AmagaiHideo SenoKazuyoshi Ebe
Lien : vide.pdf - | Journal Format-PDF (99 K)

[74] : MCM-L product development process for low-cost MCM's., Page 545
Patrick Thompson
Lien : vide.pdf - | Journal Format-PDF (99 K)

[75] : A novel active area bumped flip chip technology for convergent heat
transfer from gallium arsenide power devices., Pages 546-547
Debabrata Gupta
Lien : vide.pdf - | Journal Format-PDF (201 K)

[76] : Concurrent packaging architecture design., Page 546
Cao LipengJ. Peter Krusius
Lien : vide.pdf - | Journal Format-PDF (102 K)

[77] : A low temperature co-fired ceramic land grid array for high speed digital
applications., Page 546
Thomas W. GoodmanHiroyuki FujitaYoshikazu MurakamiArthur T. Murphy
Lien : vide.pdf - | Journal Format-PDF (102 K)

[78] : Example of a mixed-signal global positioning system (GPS) receiver using
MCM-L packaging., Page 546
Patrick J. Zabinski
Lien : vide.pdf - | Journal Format-PDF (102 K)

[79] : Large area fine line patterning by scanning projection lithography., Pages
547-548
Heinrich G. MullerYuan YanrongRonald E. Sheets
Lien : vide.pdf - | Journal Format-PDF (198 K)

[80] : To cut or not to cut: a thermomechanical stress analysis of polyimide
thin-film on ceramic structures., Page 547
Michael PechtWu XinW. Paik KyungS. Navin Bhandarkar
Lien : vide.pdf - | Journal Format-PDF (100 K)

[81] : Thermal enhancement of plastic IC packages., Page 547
Darvin R. EdwardsHwang MingBill Stearns
Lien : vide.pdf - | Journal Format-PDF (100 K)

[82] : Effects of die coatings, mold compounds, and test conditions on
temperature cycling failures., Page 547
T. Nguyen LuuSteven A. GeeMartin R. JohnsonHerb E. GrimmHector
BerardiRandy L. Walberg
Lien : vide.pdf - | Journal Format-PDF (100 K)

[83] : Fine line circuit manufacturing technology with electroless copper
plating., Page 547
Haruo Akahoshi
Lien : vide.pdf - | Journal Format-PDF (100 K)

[84] : Development of a plastic encapsulated multichip technology for high
volume, low cost commercial electronics., Pages 548-549
Raymond A. Fillion
Lien : vide.pdf - | Journal Format-PDF (202 K)

[85] : Substrate thickness optimization for liquid immersion cooled silicon
multichip modules., Page 548
Mehdi AzimiRichard C. Jaeger

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