Revue : [REVUE481]

Titre : Elsevier Science, Microelectronics Reliability, Volume 44, Issue 3, Pages 365-548, March 2004.

Cité dans : [DATA197] Les revues Microelectronics Reliability et Microelectronics Journal, ELSEVIER, décembre 2004.

Volume : 44
Issue : 3
Pages : 365 - 548
Date : March 2004

[1] : Reliability challenges for copper interconnects, Pages 365-380
Baozhen Li , Timothy D. Sullivan , Tom C. Lee and Dinesh Badami
Lien : vide.pdf - | Full Text + Links | PDF (666 K)

[2] : Steady-state and dynamic thermal models for heat flow analysis of silicon-on-insulator MOSFETs, Pages 381-396
Ming-C. Cheng , Feixia Yu , Lin Jun , Min Shen and Goodarz Ahmadi
Lien : vide.pdf - | Full Text + Links | PDF (471 K)

[3] : Reliability and performance scaling of very high speed SiGe HBTs, Pages 397-410
Greg Freeman , Jae-Sung Rieh , Zhijian Yang and Fernando Guarin
Lien : vide.pdf - | Full Text + Links | PDF (397 K)

[4] : Prediction of dielectric reliability from I–V characteristics: Poole–Frenkel conduction mechanism leading to E model for silicon nitride MIM capacitor, Pages 411-423
K. -H. Allers
Lien : vide.pdf - | Full Text + Links | PDF (423 K)

[5] : A relation model of gate oxide yield and reliability, Pages 425-434
Kyungmee O. Kim , Way Kuo and Wen Luo
Lien : vide.pdf - | Full Text + Links | PDF (549 K)

[6] : Improving reliability of poly-Si TFTs with channel layer and gate oxide
passivated by NH3/N2O plasma, Pages 435-442
Xiangbin Zeng , X. W. Sun , Junfeng Li and Johnny K. O. Sin
Lien : vide.pdf - | Full Text + Links | PDF (334 K)

[7] : Study of front-side connected chemical field effect transistor for water
analysis, Pages 443-447
Pierre Temple-Boyer , J. Launay , I. Humenyuk , T. Do Conto , A. Martinez
, C. Bériet and A. Grisel
Lien : vide.pdf - | Full Text + Links | PDF (543 K)

[8] : Sample preparation techniques for physical analysis of VLSIs, Pages
449-458
S. Nakajima , S. Nakamura , T. Ueki and T. Sakai
Lien : vide.pdf - | Full Text + Links | PDF (1242 K)

[9] : A three-parameter Weibull-like fitting function for flip-chip die strength
data, Pages 459-470
Jie-Hua Zhao
Lien : vide.pdf - | Full Text + Links | PDF (658 K)

[10] : Interfacial delamination and fatigue life estimation of 3D solder bumps in
flip-chip packages, Pages 471-483
Yu Gu and Toshio Nakamura
Lien : vide.pdf - | Full Text + Links | PDF (761 K)

[11] : The effect of solder paste composition on the reliability of SnAgCu
joints, Pages 485-494
S. Nurmi , J. Sundelin , E. Ristolainen and T. Lepistö
Lien : vide.pdf - | Full Text + Links | PDF (565 K)

[12] : Thermal stability performance of anisotropic conductive film at different
bonding temperatures, Pages 495-503
S. C. Tan , Y. C. Chan , Y. W. Chiu and C. W. Tan
Lien : vide.pdf - | Full Text + Links | PDF (398 K)

[13] : Adhesion strength and contact resistance of flip chip on flex
packages––effect of curing degree of anisotropic conductive film, Pages
505-514
M. A. Uddin , M. O. Alam , Y. C. Chan and H. P. Chan
Lien : vide.pdf - | Full Text + Links | PDF (706 K)

[14] : High-performance FCBGA based on multi-layer thin-substrate packaging
technology, Pages 515-520
Tadanori Shimoto , Katsumi Kikuchi , Kazuhiro Baba , Koji Matsui ,
Hirokazu Honda and Keiichiro Kata
Lien : vide.pdf - | Full Text + Links | PDF (453 K)

[15] : WL-CSP reliability with various solder alloys and die thicknesses, Pages
521-531
Beth Keser , Li Wetz and Jerry White
Lien : vide.pdf - | Full Text + Links | PDF (747 K)

[16] : Numerical and experimental analysis of large passivation opening for
solder joint reliability improvement of micro SMD packages, Pages 533-541
Li Zhang , Vivek Arora , Luu Nguyen and Nikhil Kelkar
Lien : vide.pdf - | Full Text + Links | PDF (617 K)

[17] : Soft breakdown of MOS tunnel diodes with a spatially non-uniform oxide
thickness, Pages 543-546
R. Khlil , A. El Hdiy , A. F. Shulekin , S. E. Tyaginov and M. I. Vexler
Lien : vide.pdf - | Full Text + Links | PDF (272 K)

[18] : Power-Constrained Testing of VLSI Circuits. Nikola Nikolici, Bashir M.
Al-Hashimi. Kluwer Academic Publishers, Boston, 2003. Hardcover, pp. 178,
plus XI, ISBN 1-4020-7235-X, €107, Pages 547-548
Mile Stojcev
Lien : vide.pdf - | Full Text + Links | PDF (200 K)
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