J.H. OKURA, K. DARBHA, S. SHETTY, A. DASGUPTA, J.F.J.M. CAERS, "Guidelines to select underfills for flip chip on board assemblies", Proceedings of the 49th Electronic Components and Technology Conference, 1999, pp. 589-594.

J.H. OKURA, K. DARBHA, S. SHETTY, A. DASGUPTA, J.F.J.M. CAERS, "Guidelines to select underfills for flip chip on board assemblies", Proceedings of the 49th Electronic Components and Technology Conference, 1999, pp. 589-594. Copyright - [Précédente] [Première page] [Suivante] - Home

Article : [ART495]

Info : REPONSE 283, le 29/03/2004.

Titre : J.H. OKURA, K. DARBHA, S. SHETTY, A. DASGUPTA, J.F.J.M. CAERS, Guidelines to select underfills for flip chip on board assemblies, Proceedings of the 49th Electronic Components and Technology Conference, 1999, pp. 589-594.

Cité dans : [DATA035] Recherche sur les mots clés thermal + fatigue + semiconductor et reliability + thermal + cycle, mars 2004.
Cité dans : [DIV463]  Recherche sur les mots clés FLIP CHIP, juillet 2005.

Auteur : Okura, J.H.
Auteur : Darbha, K.
Auteur : Shetty, S.
Auteur : Dasgupta, A. (CALCE Center for Electron. Packaging, Maryland Univ., College Park, MD, USA)
Auteur : Caers, J.F.J.M.

Source : 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299) Piscataway, NJ, USA: IEEE, 1999.
Pages : 589 - 594 of xxxii+1289 pp.
Références : 11 refs.
Conference : San Diego, CA, USA,
Date : 1-4 June 1999
Price : CCCC 0 7803 5231 9/99/$10.00
ISBN : 0-7803-5231-9
Document_Type : Conference Article
Treatment_Code : Theoretical
Info : Country of Publication : United States
Language : English
Stockage :
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Abstract :
The effect of thermo-mechanical properties of underfill materials, such as coefficient of thermal expansion (CTE) and Young's modulus, on reliability of Flip Chip on Board (FCOB) under thermal cycling stresses is investigated in this study. Quasi two-dimensional finite element modeling (FEM) viscoplastic stress analysis is combined with an energy partitioning (EP) model for creep-fatigue damage accumulation, to predict the fatigue durability of the flip chip assembly for the given accelerated thermal cycle. Parametric FEM simulations are performed for five different CTEs and five different stiffnesses of the underfill material. The results show that the stiffness of the underfill material plays a crucial role in influencing the fatigue life of FCOB assemblies. The CTE does not have a significant effect on the fatigue life. The eventual goal is to define the optimum design and process parameters of the flip-chip-on-board assemblies in order to maximize the fatigue endurance of the solder joints under cyclic thermal loading environments.

Accession_Number : 2000:6482615 INSPEC

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