Revue : [REVUE480]

Titre : Elsevier Science, Microelectronics Reliability, Volume 44, Issue 2, Pages 183-364, February 2004.

Cité dans : [DATA197] Les revues Microelectronics Reliability et Microelectronics Journal, ELSEVIER, décembre 2004.

Volume : 44
Issue : 2
Pages : 183 - 364
Date : February 2004

[1] : Reliability characteristics of high-k dielectrics, Pages 183-193
Young-Hee Kim and Jack C. Lee
Lien : vide.pdf - | Full Text + Links | PDF (636 K)

[2] : An introduction to Cu electromigration, Pages 195-205
Christine S. Hau-Riege
Lien : vide.pdf - | Full Text + Links | PDF (561 K)

[3] : Breakdown and reliability of p-MOS devices with stacked RPECVD
oxide/nitride gate dielectric under constant voltage stress, Pages 207-212
Yi-Mu Lee, Yider Wu and Gerald Lucovsky
Lien : vide.pdf - | Full Text + Links | PDF (660 K)

[4] : Design optimization of ESD protection and latchup prevention for a serial
I/O IC, Pages 213-221
Chih-Yao Huang, Wei-Fang Chen, Song-Yu Chuan, Fu-Chien Chiu, Jeng-Chou
Tseng, I-Cheng Lin, Chuan-Jane Chao, Len-Yi Leu and Ming-Dou Ker
Lien : vide.pdf - | Full Text + Links | PDF (442 K)

[5] : Modeling of the spectral response of PIN photodetectors Impact of exposed
zone thickness, surface recombination velocity and trap concentration,
Pages : 223-228
A. Bouhdada, R. Marrakh, F. Vigué and J. -P. Faurie
Lien : vide.pdf - | Full Text + Links | PDF (268 K)

[6] : Behavior of Cu(In,Ga)Se2 solar cells under light/damp heat over time,
Pages : 229-235
Takeshi Yanagisawa, Takeshi Kojima and Tadamasa Koyanagi
Lien : vide.pdf - | Full Text + Links | PDF (307 K)

[7] : Fabrication of suspended thin film resonator for application of RF
bandpass filter, Pages 237-243
Hyun Ho Kim, Byeong Kwon Ju, Yun Hi Lee,Si Hyung Lee, Jeon Kook Lee and
Soo Won Kim
Lien : vide.pdf - | Full Text + Links | PDF (536 K)

[8] : Reliability testing of flexible printed circuit-based RF MEMS capacitive
switches, Pages 245-250
Simone Lee, Ramesh Ramadoss, Michael Buck, V. M. Bright, K. C. Gupta and
Y. C. Lee
Lien : vide.pdf - | Full Text + Links | PDF (548 K)

[9] : Selective bonding and encapsulation for wafer-level vacuum packaging of
MEMS and related micro systems, Pages 251-258
Yi Tao, Ajay P. Malshe and William D. Brown
Lien : vide.pdf - | Full Text + Links | PDF (421 K)

[10] : Sub-pixel image correlation: an alternative to SAM and dye penetrant for
crack detection and mechanical stress localisation in semiconductor
packages, Pages 259-267
Jason Y. L. Goh, Mark C. Pitter, Chung W. See, Michael G. Somekh and
Daniel Vanderstraeten
Lien : vide.pdf - | Full Text + Links | PDF (943 K)

[11] : Solder joint reliability evaluation of chip scale package using a modified
Coffin–Manson equation, Pages 269-274
Ikuo Shohji, Hideo Mori and Yasumitsu Orii
Lien : vide.pdf - | Full Text + Links | PDF (404 K)

[12] : Materials characterization of the effect of mechanical bending on area
array package interconnects, Pages 275-285
Daniel T. Rooney, N. Todd Castello, Mike Cibulsky, Doug Abbott and Dongji
Xie
Lien : vide.pdf - | Full Text + Links | PDF (1025 K)

[13] : Wire bonding characteristics of gold conductors for low temperature
co-fired ceramic applications, Pages 287-294
Cristina Lopez, Liang Chai, Aziz Shaikh and Vern Stygar
Lien : vide.pdf - | Full Text + Links | PDF (416 K)

[14] : Dynamic strength of anisotropic conductive joints in flip chip on glass
and flip chip on flex packages, Pages 295-302
Y. P. Wu, M. O. Alam, Y. C. Chan and B. Y. Wu
Lien : vide.pdf - | Full Text + Links | PDF (802 K)

[15] : Thermal properties of diamond/copper composite material, Pages 303-308
Katsuhito Yoshida and Hideaki Morigami
Lien : vide.pdf - | Full Text + Links | PDF (350 K)

[16] : Long time reliability study of soldered flip chips on flexible substrates,
Pages : 309-314
Barbara Pahl, Christine Kallmayer, Rolf Aschenbrenner and Herbert Reichl
Lien : vide.pdf - | Full Text + Links | PDF (465 K)

[17] : Experimental study on the thermal performance of micro-heat pipe with
cross-section of polygon, Pages 315-321
Seok Hwan Moon, Gunn Hwang, Sang Choon Ko and Youn Tae Kim
Lien : vide.pdf - | Full Text + Links | PDF (379 K)

[18] : Al surface morphology effect on flip-chip solder bump shear strength,
Pages : 323-331
Esther Wai Ching Yau, Jing Feng Gong and Philip Chan
Lien : vide.pdf - | Full Text + Links | PDF (635 K)

[19] : Load characterization during transportation, Pages 333-338
Arun Ramakrishnan and Michael Pecht
Lien : vide.pdf - | Full Text + Links | PDF (418 K)

[20] : Combinatorial methods for the evaluation of yield and operational
reliability of fault-tolerant systems-on-chip*1, Pages 339-350
Juan A. Carrasco and Víctor Suñé
Lien : vide.pdf - | Full Text + Links | PDF (441 K)

[21] : Design for good matching in multichannel low-noise amplifier for recording
neuronal signals in modern neuroscience experiments, Pages 351-361
W. Dbrowski, P. Grybo and T. Fiutowski
Lien : vide.pdf - | PDF (492 K)

[22] : Interconnecting and Computing over Satellite Networks; Yongguang Zhang
(Ed.). Kluwer Academic Publishers, Boston, 2003. Hardcover, pp. 262, plus
XXII, 128€. ISBN 1-4020-7424-7, Pages 363-364
Mile Stojcev
Lien : vide.pdf - | Full Text + Links | PDF (201 K)

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