Revue : [REVUE519]

Titre : Elsevier Science, Microelectronics Reliability, Volume 44, Issue 5, Pages 709-888, May 2004.

Cité dans : [DATA197] Les revues Microelectronics Reliability et Microelectronics Journal, ELSEVIER, décembre 2004.

Volume : 44
Issue : 5
Pages : 709 - 888
Date : May 2004

[1] : Conduction mechanisms in MOS gate dielectric films
Pages : 709-718
B. L. Yang , P. T. Lai and H. Wong
Lien : vide.pdf - | Full Text + Links | PDF (474 K)

[2] : Reliability issues for flip-chip packages
Pages : 719-737
Paul S. Ho , Guotao Wang , Min Ding , Jie-Hua Zhao and Xiang Dai
Lien : vide.pdf - | Full Text + Links | PDF (1693 K)

[3] : On the reliability of ZrO2 films for VLSI applications
Pages : 739-745
Domenico Caputo and Fernanda Irrera
Lien : vide.pdf - | Full Text + Links | PDF (321 K)

[4] : Electromigration behavior of dual-damascene Cu interconnect-Structure, width, and length dependences
Pages : 747-754
A. V. Vairagar , S. G. Mhaisalkar and Ahila Krishnamoorthy
Lien : vide.pdf - | Full Text + Links | PDF (498 K)

[5] : Thermal design and experimental validation for optical transmitters
Pages : 755-769
Peter Z. F. Shi , Albert C. W. Lu , Y. M. Tan , Stephen C. K. Wong , Eric Tan and Ronson Tan
Lien : vide.pdf - | Full Text + Links | PDF (890 K)

[6] : An example of fault site localization on a 0.18 m CMOS device with combination of front and backside techniques
Pages : 771-778
Yoshiteru Yamada and Hirotaka Komoda
Lien : vide.pdf - | Full Text + Links | PDF (510 K)

[7] : Study on thermomechanical reliability of a tunable light modulator
Pages : 779-785
Zhimin Mo , Helge Kristiansen , Morten Eliassen , Shiming Li and Johan Liu
Lien : vide.pdf - | Full Text + Links | PDF (426 K)

[8] : Extraction of bonding strain data in diode lasers from polarization-resolved photoluminescence measurements
Pages : 787-796
Mark A. Fritz and Daniel T. Cassidy
Lien : vide.pdf - | Full Text + Links | PDF (468 K)

[9] : Technical challenges of stencil printing technology for ultra fine pitch flip chip bumping
Pages : 797-803
Dionysios Manessis , Rainer Patzelt , Andreas Ostmann , Rolf Aschenbrenner and Herbert Reichl
Lien : vide.pdf - | Full Text + Links | PDF (426 K)

[10] : Mechanical loading of flip chip joints before underfill: the impact on yield and reliability
Pages : 805-814
Frank Stepniak
Lien : vide.pdf - | Full Text + Links | PDF (499 K)

[11] : Effect of microwave preheating on the bonding performance of flip chip on flex joint
Pages : 815-821
R. A. Islam and Y. C. Chan
Lien : vide.pdf - | Full Text + Links | PDF (390 K)

[12] : Investigation on bondability and reliability of UV-curable adhesive joints for stable mechanical properties in photonic device packaging
Pages : 823-831
C. W. Tan , Y. C. Chan , H. P. Chan , N. W. Leung and C. K. So
Lien : vide.pdf - | Full Text + Links | PDF (642 K)

[13] : A testing method for assessing solder joint reliability of FCBGA packages
Pages : 833-840
Jinlin Wang , H. K. Lim , H. S. Lew , Woon Theng Saw and Chew Hong Tan
Lien : vide.pdf - | Full Text + Links | PDF (676 K)

[14] : Investigation of long-term reliability and failure mechanism of solder interconnections with multifunctional micro-moiré interferometry system
Pages : 841-852
X. Q. Shi , H. L. J. Pang and X. R. Zhang
Lien : vide.pdf - | Full Text + Links | PDF (795 K)

[15] : Statistical analysis for test lands positioning and PCB deformation during electrical testing
Pages : 853-859
L. Han and A. Voloshin
Lien : vide.pdf - | Full Text + Links | PDF (501 K)

[16] : A/D converter based on a new memory cell implemented using the switched current technique
Pages : 861-867
Pawe niataa and André S. Botha
Lien : vide.pdf - | Full Text + Links | PDF (387 K)

[17] : Digitally programmable CMOS transconductor for very high frequency
Pages : 869-875
Aránzazu Otín , Santiago Celma and Concepción Aldea
Lien : vide.pdf - | Full Text + Links | PDF (603 K)

[18] : A power-constrained design strategy for CMOS tuned low noise amplifiers
Pages : 877-883
O. Mitrea and M. Glesner
Lien : vide.pdf - | Full Text + Links | PDF (377 K)

[19] : Photo-CVD process for ultra thin SiO2 films
Pages : 885-888
V. Sánchez , J. Munguía and M. Estrada
Lien : vide.pdf - | Full Text + Links | PDF (280 K)

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