Revue : [REVUE544]

Titre : Elsevier Science, Microelectronics Reliability, Volume 44, Issue 12, Pages 1891-2054 , December 2004.

Cité dans : [DATA197] Les revues Microelectronics Reliability et Microelectronics Journal, ELSEVIER, décembre 2004.

Volume : 44
Issue : 12
Pages : 1891 - 2054
Date : December 2004

[1] : Package and solder joint reliability analysed by FEM simulation and experiments EDITORIAL
Pages : 1891-1892
Bart Vandevelde and Dag Andersson
Lien : vide.pdf - | Full Text + Links | PDF (211 K)

[2] : Time-independent elastic -plastic behaviour of solder materials
Pages : 1893-1900
S. Wiese and S. Rzepka
Lien : vide.pdf - | Full Text + Links | PDF (641 K)

[3] : Morphology changes in solder joints--experimental evidence and physical understanding
Pages : 1901-1914
W. H. Müller
Lien : vide.pdf - | Full Text + Links | PDF (1532 K)

[4] : Characterization and FE analysis on the shear test of electronic materials
Pages : 1915-1921
M. Gonzalez, B. Vandevelde, R. Van Hoof and E. Beyne
Lien : vide.pdf - | Full Text + Links | PDF (463 K)

[5] : Microstructure and creep behaviour of eutectic SnAg and SnAgCu solders
Pages : 1923-1931
S. Wiese and K. -J. Wolter
Lien : vide.pdf - | Full Text + Links | PDF (806 K)

[6] : Parametric FE-approach to flip-chip reliability under various loading conditions
Pages : 1933-1945
B. Wunderle, W. Nüchter, A. Schubert, B. Michel and H. Reichl
Lien : vide.pdf - | Full Text + Links | PDF (769 K)

[7] : Parametric study on flip chip package with lead-free solder joints by using the probabilistic designing approach
Pages : 1947-1955
D. G. Yang, J. S. Liang, Q. Y. Li, L. J. Ernst and G. Q. Zhang
Lien : vide.pdf - | Full Text + Links | PDF (874 K)

  [1] :  [PAP554]  D.G. YANG, J.S. LIANG, Q.Y. LI, L.J. ERNST, G.Q. ZHANG, Parametric study on flip chip package with lead-free solder joints by using the probabilistic designing approach, Microelectronics Reliability, Volume 44, Issue 12, December 2004, pp.1947-1955.

[8] : Board level solder joint reliability analysis and optimization of pyramidal stacked die BGA packages
Pages : 1957-1965
Tong Yan Tee and Zhaowei Zhong
Lien : vide.pdf - | Full Text + Links | PDF (528 K)

[9] : Multi-physics modeling in virtual prototyping of electronic packages--combined thermal, thermo-mechanical and vapor pressure modeling
Pages : 1967-1976
X. J. Fan, J. Zhou and G. Q. Zhang
Lien : vide.pdf - | Full Text + Links | PDF (598 K)

[10] : A simulation-based multi-objective design optimization of electronic packages under thermal cycling and bending
Pages : 1977-1983
Leon Xu, Tommi Reinikainen, Wei Ren, Bo Ping Wang, Zhenxue Han and Dereje Agonafer
Lien : vide.pdf - | Full Text + Links | PDF (299 K)

[11] : Residual stresses in microelectronics induced by thermoset packaging materials during cure
Pages : 1985-1994
Marcel H. H. Meuwissen, Hedzer A. de Boer, Henk L. A. H. Steijvers, Piet J. G. Schreurs and Marc G. D. Geers
Lien : vide.pdf - | Full Text + Links | PDF (468 K)

[12] : Finite element simulation of package stress in transfer molded MEMS pressure sensors
Pages : 1995-2002
Rudolf Krondorfer, Yeong K. Kim, Jaeok Kim, Claes-Gøran Gustafson and Timothy C. Lommasson
Lien : vide.pdf - | Full Text + Links | PDF (599 K)

[13] : Prediction of crack growth in IC passivation layers
Pages : 2003-2009
Y. T. He, M. A. J. van Gils, W. D. van Driel, G. Q. Zhang, R. B. R. van Silfhout and L. J. Ernst
Lien : vide.pdf - | Full Text + Links | PDF (402 K)

[14] : Prediction of thermo-mechanical integrity of wafer backend processes
Pages : 2011-2017
V. Gonda, J. M. J. Den Toonder, J. Beijer, G. Q. Zhang, W. D. van Driel, R. J. O. M. Hoofman and L. J. Ernst
Lien : vide.pdf - | Full Text + Links | PDF (426 K)

[15] : Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods
Pages : 2019-2027
W. D. van Driel, C. J. Liu, G. Q. Zhang, J. H. J. Janssen, R. B. R. van Silfhout, M. A. J. van Gils and L. J. Ernst
Lien : vide.pdf - | Full Text + Links | PDF (651 K)

[16] : CMOS Telecom Data converters; Angel Rodriguez-Vazquez, Fernando Medeiro,
Edmond Janssens, editors. Kluwer Academic Publishers, Boston; 2003. Hardcover, 588pp, plus XXXIII, 128 euro. ISBN 1-4020-7546-4 BOOK REVIEW
Pages : 2029-2030
Mile Stojcev
Lien : vide.pdf - | Full Text + Links | PDF (216 K)

[17] : Design and control of RF power amplifier; Alireza Shirvani, Bruce Wooley.
Kluwer Academic Publishers, Boston; 2003. Hardcover, pp. 149, plus XVI, 127 euro. ISBN 1-4020-7562-6. BOOK REVIEW
Pages : 2031-2032
Mile Stojcev
Lien : vide.pdf - | Full Text + Links | PDF (210 K)

[18] : Low-voltage CMOS log companding analog design; Francisco Sera-Graells,
Andoracion Rueda, Jose L. Huertas. Kluwer Academic Publishers, Boston;

[2003] : REVIEW
Pages : 2033-2034
Mile Stojcev
Lien : vide.pdf - | Full Text + Links | PDF (210 K)

[19] : Contents of Volume 44 MISCELLANEOUS
Pages : 2035-2048
PDF (268 K)

[20] : Author index for Volume 44 MISCELLANEOUS
Pages : 2049-2054
PDF (213 K)

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