Revue : [REVUE334]
Titre : Elsevier Science, Microelectronics Reliability, Volume 37, Issue 4, Pages 549-712 (April 1997.
Cité dans : [DATA197] Les revues Microelectronics Reliability et Microelectronics Journal, ELSEVIER, décembre 2004.Auteur : Elsevier Science
Volume : 37, Issue 4,
Pages : 549-712 (April 1997)
[1] : Estimation of the degradation of amorphous silicon solar cells, Pages
549-554
Takeshi Yanagisawa
Lien : vide.pdf - | Journal Format-PDF (347 K)
[2] : A reliability study of a small vehicle, Pages 555-556
H. Reiche
Lien : vide.pdf - | Journal Format-PDF (72 K)
[3] : Formulas for analyzing a redundant robot configuration with a built-in
safety system, Pages 557-563
B. S. Dhillon and N. Yang
Lien : vide.pdf - | Journal Format-PDF (257 K)
[4] : Poisson mixture yield models for integrated circuits: a critical review,
Pages : 565-580
M. Raghavachari, Aparna Srinivasan and Pasquale Sullo
Lien : vide.pdf - | Journal Format-PDF (866 K)
[5] : Comparative redundancy, an alternative to triple modular redundant system
design, Pages 581-585
Kenneth W. Philp and Norman D. Deans
Lien : vide.pdf - | Journal Format-PDF (195 K)
[6] : Analysis of consecutive k-out-of-n : F systems with single repair
facility, Pages 587-590
U. Dinesh Kumar and M. N. Gopalan
Lien : vide.pdf - | Journal Format-PDF (204 K)
[7] : Optimal design improving a communication network reliability, Pages
591-595
Shao Fang-Ming and Zhao Lian-Chang
Lien : vide.pdf - | Journal Format-PDF (276 K)
[8] : Consecutive-k, r-out-of-n:DFM systems, Pages 597-603
M. V. Koutras
Lien : vide.pdf - | Journal Format-PDF (419 K)
[9] : System reliability with common-cause hazard to obey an exponential power
model, Pages 605-608
M. A. El-Damcese
Lien : vide.pdf - | Journal Format-PDF (172 K)
[10] : Spice application in the study of the behaviour of multi-state systems
described by markov models, Pages 609-613
Muhammad Taher Abuelma'Atti and Isa Salman Qambar
Lien : vide.pdf - | Journal Format-PDF (183 K)
[11] : An optimal maintenance model using a number of different actions, Pages
615-622
Lam Yeh
Lien : vide.pdf - | Journal Format-PDF (447 K)
[12] : Probabilistic analysis of a two-unit cold standby redundant system subject
to failure of controlled weather device, Pages 623-628
M. A. W. Mahmoud and M. E. Moshref
Lien : vide.pdf - | Journal Format-PDF (252 K)
[13] : Optimization of connecting two communication networks subject to a
reliability constraint, Pages 629-633
Zhao Lian-Chang and Shao Fang-Ming
Lien : vide.pdf - | Journal Format-PDF (267 K)
[14] : Optimal assignment of priorities for the machine interference problems,
Pages : 635-640
Hsieh Yi-Chih
Lien : vide.pdf - | Journal Format-PDF (303 K)
[15] : Analysis of a two-unit warm standby system subject to degradation, Pages
641-647
G. S. Mokaddis, S. W. Labib and A. M. Ahmed
Lien : vide.pdf - | Journal Format-PDF (298 K)
[16] : Modelling of gate-induced drain leakage in relation to technological
parameters and temperature, Pages 649-652
A. Bouhdada, S. Bakkali and A. Touhami
Lien : vide.pdf - | Journal Format-PDF (198 K)
[17] : Reliability analysis and comparison of several structures, Pages 653-660
Lim Jae-Hak and Koh Jai-Sang
Lien : vide.pdf - | Journal Format-PDF (299 K)
[18] : Genetics based redundancy optimization, Pages 661-663
V. Ramachandran, V. Sivakumar, K. Sathiyanarayanan and S. Chandrasekaran
Lien : vide.pdf - | Journal Format-PDF (145 K)
[19] : Optimal replacement strategies--genetic algorithms approach, Pages 665-667
V. Ramachandran, J. Kannan, K. Sathiyanarayanan and V. Sivakumar
Lien : vide.pdf - | Journal Format-PDF (138 K)
[20] : Optimum interchangement time for a two-dissimilar-unit with two types of
repairman, Pages 669-671
V. Sridharan and P. Mohanavadivu
Lien : vide.pdf - | Journal Format-PDF (146 K)
[21] : Estimation of parameters of a model of a complex repairable system, Pages
673-676
Sanku Dey and Pranita Sarmah
Lien : vide.pdf - | Journal Format-PDF (161 K)
[22] : Survival function of a component under random strength attenuation, Pages
677-682
A. Rekha and T. Shyam Sunder
Lien : vide.pdf - | Journal Format-PDF (183 K)
[23] : Reliability of a cascade system with exponential strength and gamma
stress, Pages 683-685
A. Rekha and T. Shyam Sunder
Lien : vide.pdf - | Journal Format-PDF (118 K)
[24] : Some remarks on rare-event approximation., Page 687
Jerome Collet
Lien : vide.pdf - | Journal Format-PDF (75 K)
[25] : Planning and optimizing environmental stress screening., Page 687
Y. L. Mok and M. Xie
Lien : vide.pdf - | Journal Format-PDF (75 K)
[26] : Dependability standards: an international perspective., Page 687
Claudio Benski
Lien : vide.pdf - | Journal Format-PDF (75 K)
[27] : Quality enhances reliability. A utility's big customer will willingly sign
up for power that flows smoothly enough not to trip up electronic
equipment., Page 687
D. Daniel Sabin and Ashok Sundaram
Lien : vide.pdf - | Journal Format-PDF (75 K)
[28] : Proposed new DoD standard for product acceptance., Pages 687-688
Donald S. Ermer and Daniel P. Kedzie II
Lien : vide.pdf - | Journal Format-PDF (167 K)
[29] : An overview of environmental reliability testing., Page 688
Hank Caruso
Lien : vide.pdf - | Journal Format-PDF (91 K)
[30] : International standards: their role in a global economy., Page 688
Daniel J. O'Leary
Lien : vide.pdf - | Journal Format-PDF (91 K)
[31] : Higher-integrated spread-type stacked capacitor and its suitable arsenic
solid-diffusion method., Page 688
N. Matsuo, T. Miyoshi and K. Matsubara
Lien : vide.pdf - | Journal Format-PDF (91 K)
[32] : Development of ultra-compact plastic-packaged high-isolation GaAs SPDT
switch., Page 688
Hisanori Uda
Lien : vide.pdf - | Journal Format-PDF (91 K)
[33] : Using polymer thick film for cost-effective EMC protection on PCBs for
automotive applications., Pages 688-689
M. A. Saltzberg, A. L. Neller, C. S. Harvey, T. E. Borninski and R. J.
Gordon
Lien : vide.pdf - | Journal Format-PDF (184 K)
[34] : Field-based analysis of a high pincount board connector., Page 689
Heike Wolter
Lien : vide.pdf - | Journal Format-PDF (93 K)
[35] : Reliability and Au-concentration in OLB solder fillets of TAB-devices
having a 75 m pitch., Page 689
Elke Zakel, Jurgen Villain and Herbert Reichl
Lien : vide.pdf - | Journal Format-PDF (93 K)
[36] : Degradation of gold-aluminium ball bonds by aging and contamination., Page
689
V. Koeninger, H. H. Uchida and E. Fromm
Lien : vide.pdf - | Journal Format-PDF (93 K)
[37] : High-frequency measurement of multilayer ceramic capacitors., Page 689
Yukio Sakabe
Lien : vide.pdf - | Journal Format-PDF (93 K)
[38] : Reliability assessment of fielded plastic and hermetically packaged
microelectronics., Page 690
Bruce Johnson and Vani Verma
Lien : vide.pdf - | Journal Format-PDF (92 K)
[39] : The appropriateness of plastic encapsulated micro-circuits in a specific
wooden-round application., Page 690
John R. Gardner
Lien : vide.pdf - | Journal Format-PDF (92 K)
[40] : Electron and proton irradiation-induced degradation of epitaxial InP solar
cells., Page 690
R. J. Walters
Lien : vide.pdf - | Journal Format-PDF (92 K)
[41] : Plastic-encapsulated microcircuit reliability and cost-effectiveness
study., Pages 690-691
Douglas Emerson, Edward Hakim and Anand Govind
Lien : vide.pdf - | Journal Format-PDF (186 K)
[42] : Comparing the importance of system components by some structural
characteristics., Page 691
Fan C. Meng
Lien : vide.pdf - | Journal Format-PDF (94 K)
[43] : Modelling the cosmic ray-induced soft-error rate in integrated circuits:
an overview., Page 691
G. R. Srinivasan
Lien : vide.pdf - | Journal Format-PDF (94 K)
[44] : Avalanche breakdown of high-voltage p-n junctions of SiC., Pages 691-692
L. Pelaz
Lien : vide.pdf - | Journal Format-PDF (186 K)
[45] : Fuzzy reliability using a discrete stress-strength interference model.,
Page 692
D. Wang J and S. Liu T.
Lien : vide.pdf - | Journal Format-PDF (92 K)
[46] : Effortless incremental design FMEA., Page 692
Christopher J. Price
Lien : vide.pdf - | Journal Format-PDF (92 K)
[47] : Fault tree models for the analysis of complex computer-based systems.,
Page 692
Laura L. Pullum and Joanne Bechta Dugan
Lien : vide.pdf - | Journal Format-PDF (92 K)
[48] : Computational method for reliability data analysis., Page 692
Gordon Johnston
Lien : vide.pdf - | Journal Format-PDF (92 K)
[49] : A combined analysis approach to assessing requirements for safety critical
real-time control systems., Page 692
Peter L. Goddard
Lien : vide.pdf - | Journal Format-PDF (92 K)
[50] : Worst case circuit--an overview (electronic parts/circuits tolerance
analysis)., Page 693
Walter M. Smith
Lien : vide.pdf - | Journal Format-PDF (91 K)
[51] : Accelerated life testing for products without sequence effect., Page 693
Zigmund Bluvband
Lien : vide.pdf - | Journal Format-PDF (91 K)
[52] : Development of a fault isolation procedure., Page 693
Lemuel L. Means
Lien : vide.pdf - | Journal Format-PDF (91 K)
[53] : Designing for fault-tolerance in the commercial environment., Page 693
M. N. Karyagina
Lien : vide.pdf - | Journal Format-PDF (91 K)
[54] : Transformations of Star-Delta and Delta-Star reliability networks., Page
693
Sheng-De Wang and Cha-Hon Sun
Lien : vide.pdf - | Journal Format-PDF (91 K)
[55] : Consideration of node failures in network-reliability calculation., Pages
693-694
Victor A. Netes and Boris P. Filin
Lien : vide.pdf - | Journal Format-PDF (182 K)
[56] : Modified block-replacement for multiple-component systems., Page 694
Thomas W. Archibald and Rommert Dekker
Lien : vide.pdf - | Journal Format-PDF (91 K)
[57] : Modified `Practical Bayes-Estimators'., Page 694
Pasquale Erto and Massimiliano Giorgio
Lien : vide.pdf - | Journal Format-PDF (91 K)
[58] : The failure of Bayes system reliability inference based on data with
multi-level applicability., Page 694
Lloyd L. Philipson
Lien : vide.pdf - | Journal Format-PDF (91 K)
[59] : Miscellaneous Item, Page 694
Lien : vide.pdf - Format-PDF (91 K)
[60] : Hypothesis-test for reliability in a stress-strength model, with prior
information., Pages 694-695
S. B. Nandi and A. B. Aich
Lien : vide.pdf - | Journal Format-PDF (181 K)
[61] : Optimal algorithms for synthesis of reliable application-specific
heterogeneous multiprocessors., Page 695
Autobindo Dasgupta and Ramesh Karri
Lien : vide.pdf - | Journal Format-PDF (91 K)
[62] : Component redundancy vs system redundancy in the hazard rate ordering.,
Page 695
Philip J. Boland and Emad-El Neweihi
Lien : vide.pdf - | Journal Format-PDF (91 K)
[63] : The use of imprecise component reliability distributions in reliability
calculations., Page 695
Ian D. Roberts and Andrew E. Samuel
Lien : vide.pdf - | Journal Format-PDF (91 K)
[64] : Robust parameter-estimation using the bootstrap method for the 2-parameter
Weibull distribution., Page 695
Tetsurou Seki and Shin-Ichiro Yokoyama
Lien : vide.pdf - | Journal Format-PDF (91 K)
[65] : Safety assessment, reliability, and the Probability-Operation diagram.,
Page 695
Antony G. Vassakis
Lien : vide.pdf - | Journal Format-PDF (91 K)
[66] : Comment on: reliability modelling and performance of variable
link-capacity networks., Pages 695-696
R. Schanzer
Lien : vide.pdf - | Journal Format-PDF (184 K)
[67] : Mean time to first failure of repairable systems with one cold spare.,
Page 696
Winfrid G. Schneeweiss
Lien : vide.pdf - | Journal Format-PDF (93 K)
[68] : Determining the discrete-time reliability of a repairable 2-out-of-(N +
1): F system., Page 696
Kipp L. Bruning
Lien : vide.pdf - | Journal Format-PDF (93 K)
[69] : A unified domination approach for reliability analysis of networks with
arbitrary logic in vertices., Page 696
Arkadi A. Chernyak and Zhanna A. Chernyak
Lien : vide.pdf - | Journal Format-PDF (93 K)
[70] : Analysis of step-stress accelerated-life-test data: a new approach., Page
696
L. C. Tang, Y. S. Sun, T. N. Goh and H. L. Ong
Lien : vide.pdf - | Journal Format-PDF (93 K)
[71] : Lower and upper bounds for the reliability of connected-(r, s)-out-of-(m,
n): F lattice systems., Pages 696-697
Jacek Malinowski and Wolfgang Preuss
Lien : vide.pdf - | Journal Format-PDF (188 K)
[72] : An input-domain based method to estimate software reliability., Page 697
Alberto Pasquini, Elio De Agostino and Guiseppe Di Marco
Lien : vide.pdf - | Journal Format-PDF (94 K)
[73] : A comparison of fault-tolerant state machine architectures for space-borne
electronics., Page 697
Shailesh Niranjan and James F. Frenzel
Lien : vide.pdf - | Journal Format-PDF (94 K)
[74] : Solving ML equations for 2-parameter Poisson-process models for ungrouped
software-failure data., Page 697
George J. Knafl and Joseph Morgan
Lien : vide.pdf - | Journal Format-PDF (94 K)
[75] : How to model reliability-growth when times of design modifications are
known., Page 697
Nader Ebrahimi
Lien : vide.pdf - | Journal Format-PDF (94 K)
[76] : Tutorial: temperature as an input to microelectronics-reliability models.,
Pages : 697-698
Pradeep Lall
Lien : vide.pdf - | Journal Format-PDF (182 K)
[77] : Dynamic analysis of qualitative circuits for failure mode and effects
analysis., Page 698
David R. Pugh and Neal Snooke
Lien : vide.pdf - | Journal Format-PDF (88 K)
[78] : Modelling and simulation of a satellite constellation based on petri
nets., Page 698
Jean-Francois Ereau and Malecka Saleman
Lien : vide.pdf - | Journal Format-PDF (88 K)
[79] : The contamination audit--a vital tool for yield improvement., Page 698
S. Hamilton
Lien : vide.pdf - | Journal Format-PDF (88 K)
[80] : Prospects for terahertz technology., Page 698
C. M. Snowden
Lien : vide.pdf - | Journal Format-PDF (88 K)
[81] : A cost comparison of new MCM technologies., Page 698
A. T. Singer
Lien : vide.pdf - | Journal Format-PDF (88 K)
[82] : Semiconductor lithography for the next millennium., Page 698
Linda Geppert
Lien : vide.pdf - | Journal Format-PDF (88 K)
[83] : Reliability investigations of fluxless flip chip interconnections on green
tape ceramic substrates., Page 699
Joachim Kloeser, Elke Zakel, Franz Bechtold and Herbert Reichl
Lien : vide.pdf - | Journal Format-PDF (97 K)
[84] : Development of an inspection process for ball-grid-array technology using
scanned-beam X-ray laminography., Page 699
S. M. Rooks, B. Benhabib and K. C. Smith
Lien : vide.pdf - | Journal Format-PDF (97 K)
[85] : Temperature and stress time history responses in electronic packaging.,
Page 699
John H. Lau
Lien : vide.pdf - | Journal Format-PDF (97 K)
[86] : Optimum design and selection of heat sinks., Page 699
Seri Lee
Lien : vide.pdf - | Journal Format-PDF (97 K)
[87] : Optoelectronic packaging of two-dimensional surface active devices., Page
699
Nagesh R. Basavanhally, Michael F. Brady and D. Bruce Buchholz
Lien : vide.pdf - | Journal Format-PDF (97 K)
[88] : Use of BCB in high frequency MCM interconnects., Page 699
Vikram B. Krishnamurthy, H. S. Cole and T. Sitnik-Nieters
Lien : vide.pdf - | Journal Format-PDF (97 K)
[89] : Time-domain characterization and circuit modelling of a multilayer ceramic
package., Pages 699-700
Jong Jyh-Ming, Bozidar Janko and Vijai K. Tripathi
Lien : vide.pdf - | Journal Format-PDF (192 K)
[90] : A new bonding technique for microwave devices., Page 700
G. Rainer Dohle, John J. Callahan, Kevin P. Martin and Timothy J. Drabik
Lien : vide.pdf - | Journal Format-PDF (95 K)
[91] : A rigorous method to evaluate the electrical performance of MCM
interconnections in frequency and time domains., Page 700
Rachid Salik, Jun-Wu Tao, Gilbert Angenieux and Bernard Flechet
Lien : vide.pdf - | Journal Format-PDF (95 K)
[92] : Multichannel optical modules compatible with the fiber-in-board
technology., Page 700
Geert de Pestel
Lien : vide.pdf - | Journal Format-PDF (95 K)
[93] : SPICE-models for high-pincount board connectors., Page 700
Helmut Katzier, Renate Reischl and Peter Pagnin
Lien : vide.pdf - | Journal Format-PDF (95 K)
[94] : The evolution of IBM high performance cooling technology., Page 700
Robert E. Simons
Lien : vide.pdf - | Journal Format-PDF (95 K)
[95] : Achieving accurate thermal characterization using a CFD code--a case study
of plastic packages., Pages 700-701
Juan Burgos, Vincent P. Manno and Kaveh Azar
Lien : vide.pdf - | Journal Format-PDF (189 K)
[96] : An assessment of the thermal performance of the PBGA family., Page 701
Saailesh Mulgaonker
Lien : vide.pdf - | Journal Format-PDF (94 K)
[97] : Asymptotic thermal analysis of electronic packages and printed-circuit
boards., Page 701
Liu Da-Guang
Lien : vide.pdf - | Journal Format-PDF (94 K)
[98] : Experimental investigation of subcooled liquid nitrogen impingement
cooling of a silicon chip., Page 701
David T. Vader, Gregory M. Chrysler, Richard C. Chu and Robert E. Simons
Lien : vide.pdf - | Journal Format-PDF (94 K)
[99] : Miscellaneous Item, Page 701
Lien : vide.pdf - Format-PDF (94 K)
[100] : Thermal characterization of electronic devices with boundary condition
independent compact models., Page 702
Clemens J. M. Lasance, Heinz Vinke and Harvey Rosten
Lien : vide.pdf - | Journal Format-PDF (96 K)
[101] : System design methodologies: aiming at the 100 h design cycle., Page 702
Daniel D. Gajski
Lien : vide.pdf - | Journal Format-PDF (96 K)
[102] : Accelerated testing for cosmic soft-error rate., Page 702
J. F. Ziegler
Lien : vide.pdf - | Journal Format-PDF (96 K)
[103] : Fine line thin dielectric circuit board characterization., Page 702
Shih Chang Chi and Amit P. Agrawal
Lien : vide.pdf - | Journal Format-PDF (96 K)
[104] : A CMOS IC for GB/s Viterbi decoding: system design and VLSI
implementation., Pages 702-703
Herbert Dawid, Gerhard Fetiweis and Heinrich Keyr
Lien : vide.pdf - | Journal Format-PDF (192 K)
[105] : A hi-density C4/CBGA interconnect technology for a CMOS microprocessor.,
Page 703
Gary B. Kromann, R. David Gerke and Wei-Xu Huang Wayne
Lien : vide.pdf - | Journal Format-PDF (95 K)
[106] : Case study: the design of a mixed-signal global positioning system
receiver using multichip module packaging., Page 703
Patrick J. Zabinski
Lien : vide.pdf - | Journal Format-PDF (95 K)
[107] : Design and evaluation of an epoxy three-dimensional multichip module.,
Page 703
Jon M. Stern
Lien : vide.pdf - | Journal Format-PDF (95 K)
[108] : Intersubband lifetimes in Si/SiGe quantum wells., Page 703
W. Heiss
Lien : vide.pdf - | Journal Format-PDF (95 K)
[109] : Effects of the rear interface states and fixed charges on the electrical
characteristics of thin film transistors with thin amorphous silicon
layers., Page 704
Tai Ya-Hsiang
Lien : vide.pdf - | Journal Format-PDF (95 K)
[110] : Damage to Si substrates during SiO2 etching: opportunities of subsequent
removal by optimized cleaning procedures., Page 704
H. H. Richter, A. Wolff, K. Blum, K. Hoeppner, D. Kruger and R. Sorge
Lien : vide.pdf - | Journal Format-PDF (95 K)
[111] : Compact non-local modelling of impact ionization in SOI MOSFETs for
optimal CMOS device/circuit design., Page 704
S. Krishnan and J. G. Fossum
Lien : vide.pdf - | Journal Format-PDF (95 K)
[112] : Investigation of low power all-optical bistability in an InGaAs-InAlAs
superlattice., Page 704
J. Courturier, J. C. Harmand and P. Voisin
Lien : vide.pdf - | Journal Format-PDF (95 K)
[113] : A novel two-step etching process for reducing plasma-induced oxide
damage., Page 704
You Kuo-Feng and Wu Ching-Yuan
Lien : vide.pdf - | Journal Format-PDF (95 K)
[114] : New complementary BiCMOS digital gates for low-voltage environments.,
Pages : 704-705
S. S. Rofail and Kiat Seng Yeu
Lien : vide.pdf - | Journal Format-PDF (188 K)
[115] : Effect of GE incorporation on the performance of P-channel polycrystalline
Si1-xGex thin-film transistors., Page 705
C. Lin H., Y. Lin H. and Y. Chang C.
Lien : vide.pdf - | Journal Format-PDF (93 K)
[116] : Interplay of 2D and 3D charge carriers in Si--doped InSb layers grown
epitaxially on GaAs., Page 705
A. De Keyser
Lien : vide.pdf - | Journal Format-PDF (93 K)
[117] : The conduction properties of the silicon/off-stoichiometry-SiO2 diode.,
Page 705
M. Aceves, C. Falcony, A. Reynoso-Hernandez, W. Calleja and A Torres
Lien : vide.pdf - | Journal Format-PDF (93 K)
[118] : Quantum functional devices for advanced electronics., Page 705
N. Yokoyama
Lien : vide.pdf - | Journal Format-PDF (93 K)
[119] : Level crossing of nanometer sized InAs islands in GaAs., Page 705
B. Kowalski, P. Omling, M. S. Miller, S. Jeppesen and L. Samuelson
Lien : vide.pdf - | Journal Format-PDF (93 K)
[120] : Annealing effect of vacuum evaporated InSb thin films., Pages 705-706
Masahiro Tomisu, Narumi Inouse and Yoshizumi Yasuoka
Lien : vide.pdf - | Journal Format-PDF (185 K)
[121] : Polarization-sensitive photocurrents of metal-semiconductor structures
with flat and microrelief interfaces., Page 706
N. L. Dmitruk
Lien : vide.pdf - | Journal Format-PDF (92 K)
[122] : Correlation of the decay of tunneling currents with trap generation inside
thin oxides., Page 706
N. A. Dumin, K. J. Dickerson, D. J. Dumin and B. T. Moore
Lien : vide.pdf - | Journal Format-PDF (92 K)
[123] : Atomic force microscopy studies of SiGe films and Si/SiGe
heterostructures., Page 706
M. A. Lutz, R. M. Feenstra and J. O. Chu
Lien : vide.pdf - | Journal Format-PDF (92 K)
[124] : Discrimination of individual gases/odours using polar plot of an
integrated thick film sensor array., Page 706
V. K. Singh, R. Dwivedi and S. K. Srivastava
Lien : vide.pdf - | Journal Format-PDF (92 K)
[125] : A study of composite Bi2O3, In2O3 and RuO2 planar thick film
piezoresistive gauges., Page 706
D. G. Collins and K. I. Arshak
Lien : vide.pdf - | Journal Format-PDF (92 K)
[126] : Hybrid assembly: a strategy for expanding the role of `advanced' assembly
technology., Pages 706-707
Paul S. Wu, H. Y. Tam and Patri K. Venuvinjod
Lien : vide.pdf - | Journal Format-PDF (187 K)
[127] : Growth and characterization of HTSC thin films for microelectronic
devices., Page 707
A. Perrin
Lien : vide.pdf - | Journal Format-PDF (95 K)
[128] : Thin-film multimaterial optoelectronic integrated circuits., Page 707
Nan Marie Jokerst
Lien : vide.pdf - | Journal Format-PDF (95 K)
[129] : New optical and electrical hybrid packaging techniques using optical
waveguides for optoelectronic multichip modules., Page 707
Shinji Koike, Fusao Shimokawa, Tohru Matsurra and Hideyuki Takahara
Lien : vide.pdf - | Journal Format-PDF (95 K)
[130] : High speed laser ablation of microvia holes in non-woven Aramid reinforced
printed wiring boards to reduce cost., Pages 707-708
M. Weihold and D. J. Powell
Lien : vide.pdf - | Journal Format-PDF (189 K)
[131] : Focused ion beam preparation of inclined planes in semiconductor
materials., Page 708
B. Khamsehpour and S. T. Davies
Lien : vide.pdf - | Journal Format-PDF (94 K)
[132] : Focused beam machining and deposition for nanofabrication, Page 708
S. T. Davies and B. Khamsehpour
Lien : vide.pdf - | Journal Format-PDF (94 K)
[133] : MBE growth physics: application to device technology., Page 708
Marian A. Herman and Helmut Sitter
Lien : vide.pdf - | Journal Format-PDF (94 K)
[134] : Submicro- and nanometer structure fabricating using direct electron-beam
writing and reactive ion etching., Page 708
P. Hudek
Lien : vide.pdf - | Journal Format-PDF (94 K)
[135] : Modelling effects of focused ion beams., Page 708
F. Stern, S. E. Laux and A. Kumar
Lien : vide.pdf - | Journal Format-PDF (94 K)
[136] : Lateral electron depletion in focused-ion-beam implanted pseudomorphic
heterostructures with InxGa1-xAs channels., Pages 708-709
D. K. De Vries, H. Kunzel, K. Hausler, K. H. Ploog and A. D. Wieck
Lien : vide.pdf - | Journal Format-PDF (164 K)
[137] : Strong magnetic field dependence of laser emission from quantum wires
formed by cleaved edge overgrowth., Page 709
W. Wegschneider
Lien : vide.pdf - | Journal Format-PDF (70 K)
[138] : A methodology for laser-based thermal diffusivity measurement of advanced
multichip module ceramic materials., Page 709
L. Kehoe, P. V. Kelly, G. M. O'Connar, M. O'Reilly and G. M. Crean
Lien : vide.pdf - | Journal Format-PDF (70 K)
[139] : Growth of CuGaSe2 film by molecular beam epitaxy., Page 709
Akimasa Yamada
Lien : vide.pdf - | Journal Format-PDF (70 K)
[140] : Miscellaneous Item, Pages 711-712
Lien : vide.pdf - Format-PDF (101 K)
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