Revue : [REVUE163]

Titre : Elsevier Science, Microelectronics Reliability, Vol. 40, Issue 7, pp. 1069-1241, July 2000.

Cité dans : [DATA197] Les revues Microelectronics Reliability et Microelectronics Journal, ELSEVIER, décembre 2004.

[1] : Pages 1069-1071, Yves Danto, Pradeep Lall and Andrew A. O. Tay

[2] : Reliability of new packaging concepts, Pages 1073-1080
Nihal Sinnadurai

[3] : Assembly-level reliability of flex-substrate BGA, elastomer-on-flex packages and 0.5 mm pitch partial array packages, Pages 1081-1095
Pradeep Lall and Kingshuk Banerji

[4] : Vibration reliability characterization of PBGA assemblies, Pages 1097-1107
Q. J. Yang, H. L. J. Pang, Z. P. Wang, G. H. Lim, F. F. Yap and R. M. Lin

[5] : Near-CSP plastic ball grid array, Pages 1109-1116
Norman L. Owens

[6] : Solder joint fatigue life of fine pitch BGAs ¯ impact of design and material choices, Pages 1117-1127
Robert Darveaux, Jim Heckman, Ahmer Syed and Andrew Mawer

[7] : Mechanical cycling fatigue of PBGA package interconnects, Pages 1129-1133
Larry Leicht and Andrew Skipor

[8] : Method for rapid testing of thermo-mechanical characteristics of solder joints, Pages 1135-1146
M. Nowottnick, W. Scheel, K. Wittke and U. Pape
Lien : private/Nowottnick.pdf - 12 pages, 851 Ko.

[9] : Simulation of fatigue distributions for ball grid arrays by the Monte Carlo method, Pages 1147-1155
John W. Evans, Jillian Y. Evans, Reza Ghaffarian, Andrew Mawer, Kyoung-Taeg Lee and Chang-Ho Shin

[10] : Chip scale package issues, Pages 1157-1161
Reza Ghaffarian

[11] : Thermo-mechanical finite element analysis in press-packed IGBT design, Pages 1163-1172
A. Pirondi, G. Nicoletto, P. Cova, M. Pasqualetti and M. Portesine
Lien : private/Pirondi.pdf - 10 pages, 978 Ko.

[12] : Guidelines to select underfills for flip chip on board assemblies and compliant interposers for chip scale package assemblies, Pages 1173-1180
J. H. Okura, S. Shetty, B. Ramakrishnan, A. Dasgupta, J. F. J. M. Caers and T. Reinikainen

[13] : In process stress analysis of flip-chip assemblies during underfill cure, Pages 1181-1190
P. Palaniappan and Daniel F. Baldwin

[14] : A new experimental method to evaluate creep fatigue life of flip-chip solder joints with underfill, Pages 1191-1198
D. J. Xie

[15] : An investigation on the plasma treatment of integrated circuit bond pads, Pages 1199-1206
Y. F. Chong, R. Gopalakrishnan, C. F. Tsang, G. Sarkar, S. Lim and S. Tatti

[16] : Bonding strengths at plastic encapsulant¯gold-plated copper leadframe interface, Pages 1207-1214
Sung Yi, Jang-Kyo Kim, Chee Yoon Yue and Jang-Hsing Hsieh

[17] : Electro-conductive adhesives for high density package and flip-chip interconnections, Pages 1215-1226
Dominique Wojciechowski, Jan Vanfleteren, Elisabeth Reese and Hans-Werner Hagedorn

[18] : Reliability evaluation of adhesive bonded SMT components in industrial applications, Pages 1227-1234
M. G. Périchaud, J. Y. Delétage, H. Frémont, Y. Danto and C. Faure

[19] : Coupled package-device modeling for microelectromechanical systems, Pages 1235-1241
Stephen F. Bart, Susan Zhang, Vladimir L. Rabinovich and Shawn Cunningham

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