F.S. POPELAR, "Parametric study of flip chip reliability based on solder fatigue modelling: Part II - flip chip on organic", 1998 International Symposium on Microelectronics, Nov. 1998, pp. 497-504.

F.S. POPELAR, "Parametric study of flip chip reliability based on solder fatigue modelling: Part II - flip chip on organic", 1998 International Symposium on Microelectronics, Nov. 1998, pp. 497-504. Copyright - [Précédente] [Première page] [Suivante] - Home

Article : [SHEET142]

Info : COMPENDEX Answer Number 11 - 22/02/2000

Titre : F.S. POPELAR, Parametric study of flip chip reliability based on solder fatigue modelling: Part II - flip chip on organic, 1998 International Symposium on Microelectronics, Nov. 1998, pp. 497-504.

Cité dans : [DATA035] Recherche sur les mots clés thermal + fatigue + semiconductor et reliability + thermal + cycle, mars 2004.

Auteur : Popelar, Scott F. (IC Interconnect, Colorado Springs, CO, USA)

Title : Proceedings of the 1998 International Symposium on Microelectronics.
Location : San Diego, CA, USA
Date : 01 Nov 1998-04 Nov 1998
Source : Proceedings of SPIE - The International Society for Optical Engineering v 3582 1998.SPIE, Bellingham, WA, USA.
Pages : 497 - 504
CODEN : PSISDG
ISSN : 0277-786X
Meeting_Number : 49809
Document_Type : Conference Article
Treatment_Code : Theoretical; Experimental
Language : English
Stockage : Thierry LEQUEU

Abstract :
A solder fatigue model for the 63Sn/Pb solder alloy is introduced
which characterizes the creep fatigue phenomena of the solder by
combining nonlinear finite element modeling with thermal fatigue
lives of various flip chip assemblies.The model correlates the
amount of creep strain energy dissipated per thermal cycle with the
characteristics Weibull life of the critical flip chip solder
joint.The model was validated for various sizes, bump geometries,
board materials and thermal profiles.Results showed that the
coefficient of thermal expansion of the underfill is the most
significant parameter affecting fatigue life, with no significant
difference seen between fatigue lives of underfilled ceramic and
organic assembled devices.

References : 6 Refs.

Accession_Number : 1999(15):3908

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