Fiche : [DIV442]

Titre : Recherche sur les mots clés THERMAL RESISTANCE, juillet 2004.

Cité dans : [DIV096]  Recherches bibliographiques diverses, janvier 2019.
Cité dans : [DATA035] Recherche sur les mots clés thermal + fatigue + semiconductor et reliability + thermal + cycle, mars 2004.
Cité dans : [DIV334]  Recherche sur les mots clés power cycling of power device, mai 2002.
Cité dans : [DIV333]  Recherche sur les mots clés thermal + shock + liquid , février 2002.
Cité dans : [DIV107]  T. LEQUEU, Liste de références pour le calcul des résistances thermiques, décembre 2009.

Date : juillet 2004

Vers : Ajout de juillet 2004
Vers : Recherche STN du mercredi 7 juillet 2004

Recherche STN du mercredi 7 juillet 2004

Recherche par mots clés

Question : thermal AND resistance AND simulation
Réponses : 1549 réponses Dans la banque de données COMPENDEX
Réponses : 961 réponses Dans la banque de données INSPEC
Réponses : 2510 réponses au total

Question : thermal AND resistance AND simulation AND power AND electronics
Réponses : 94 réponses Dans la banque de données COMPENDEX
Réponses : 24 réponses Dans la banque de données INSPEC
Réponses : 118 réponses au total

Titres dans la banque de données COMPENDEX

1 New method for electrothermal simulations: HDTMOS in automotive applications.
2 An assessment of the impact of interconnect strategies on thermal performance of GaAs power amplifier IC devices.
3 Impact of die attach material and substrate design on RF GaAs power amplifier devices thermal performance.
4 System and package level thermal optimization of power amplifier modules with application in wireless communication.
5 Thermal management of transient power spikes in electronics - Phase change energy storage or copper heat sinks??.
6 Experimental study of innovative heat sinks for high power density electronic components.
7 Thermal management of QFN 48 package attached to different multi-layers of printed circuit board designs.
8 Compact thermal representations for several fundamental shapes in natural convection.
9 Compact thermal representations for several fundamental shapes in forced convection.
10 Determination of package die temperature in a set-top box using JEDEC thermal metrics.
11 Impact of die attach material and substrate design on RF GaAs power amplifier devices thermal performance.
12 RFICs Packages Electrical Performance Comparison of both Exposed Pad TQFP and Standard SSOP.
13 Electro-thermal simulation of hot-spot phenomena in cellular bipolar power transistors: The influence of package thermal resistance.
14 Passive cooling limits for unventilated notebook computers.
15 Generation of Equivalent Circuit Models from Simulation Data of a Thermal System.
16 Board-side boundary condition for a single component on a PCB in forced convection.
17 Experimental study of supercapacitor serial resistance and capacitance variations with temperature.
18 Temperature-aware microarchitecture.
19 Thermal modeling and design of liquid cooled heat sinks assembled with flip chip ball grid array packages.
20 Impact of wall region particle volume fraction distribution on thermal resistance of particle filled thermal interface materials.
21 Packaging and thermal management for kW/cm2 microwave amplifiers.
22 Design and characterization of a 10 GHz organic BGA package.
23 Thermal analysis of thermal spreaders used in power electronics cooling.
24 Thermal design of desktop server switch with detailed modeling of high power TBGA packages.
25 Influence of the material properties on the thermal behaviour of a package.

26 Ku-band MMiC's in low-cost, SMT compatible packages.
27 A simple practical technique for estimating the junction temperature and the thermal resistance of a GaAs HBT.
28 Heat transfer and thermal stress analysis in the new generation quasi-monolithic integration technology (QMIT).
29 Integrated cooling devices in silicon technology.
30 A simplified method of generating thermal models for power MOSFETs.
31 Electrothermal CAD of power devices and circuits with fully physical time-dependent compact thermal modeling of complex nonlinear 3-D systems.
32 Novel thermal validation metrology based on non-uniform power distribution for Pentium[registered trademark] III Xeon[trademark] cartridge processor design with integrated level two cache.
33 Heat transfer in high density electronics packaging.
34 Power module integrated cooling design using CFD simulation.
35 Thermal component model for electrothermal analysis of IGBT module systems.
36 A new approach to the dynamic thermal modelling of semiconductor packages.
37 A novel multicell silicon drift detector module for X-ray spectroscopy and imaging applications.
38 Current filamentation in bipolar power devices during dynamic avalanche breakdown.
39 High power chip stacks with interleaved heat spreading layers.
40 Double-sided cooling for high power IGBT modules using flip chip technology.
41 Investigation of the thermal performance of micro-whisker structured silicon heat spreaders for power devices.
42 Characterisation of die attach for power devices using thermal impedance measurement - practice and experiment.
43 Finite-element modeling of thermal and thermomechanical behavior for three-dimensional packaging of power electronics modules.
44 Thermomechatronics of power electronic packages.
45 Computational parameter study of chip scale package array cooling.
46 Investigation of thermal enhancement on flip chip plastic BGA packages using CFD tool.
47 Thermal RC-network approach to analyze multichip power packages.
48 Fan swirl effects on cooling heat sinks and electronic packages.
49 Investigation of the thermal performance of micro-whisker structured silicon heatspreaders for power devices.
50 Current handling and thermal considerations in a high current semiconductor switch package.

51 Investigation of thermal enhancement on flip chip plastic BGA packages using CFD tool.
52 Thermo-mechanical analysis of chip scale packaging.
53 Temperature-dependent electrothermal MOSFET model for calculating its current loadability.
54 Important properties of transient thermal impedance for MOS-gated power semiconductors.
55 Impact of FEM simulation on reliability improvement of packaging.
56 Development of plastic chip scale package for ATM switching systems.
57 Thermal analysis of insulated metal substrates for automotive electronic assemblies.
58 High power CSP module with optimized design and materials.
59 Optimizing cost and thermal performance: Rapid prototyping of a high pin count cavity-up enhanced plastic ball grid array (EPBGA) package.
60 Thermal design for flip chip on board in natural convection.
61 Finite element modeling of heat transfer in chip on tape packages.
62 Low thermal resistivity adhesive bonding of ceramic substrates to high performance coolers for the fabrication of power MCM's.
63 Thermal resistance analysis by induced transient (TRAIT) method for power electronic devices thermal characterization - Part II: Practice and experiments.
64 Thermal resistance analysis by induced transient (TRAIT) method for power electronic devices thermal characterization - Part I: Fundamentals and theory.
65 Design, simulation and technological realization of a reliable packaging concept for high power laser bars.
66 Effect of die attach layer delamination on the thermal performance of plastic packages.
67 Advanced packaging technology for high performance power devices.
68 Simulation and measurement of the temperature rise in a power semiconductor device under transient conditions.
69 Survey of the thermal stability of an active heat sink.
70 Simulation and measurement of the temperature rise in a power semiconductor device under transient conditions.
71 Proceedings of the 1997 IEE Colloquium on Modelling and Simulation for Thermal Management.
72 Thermal characterization of integrated circuit packages for electronic engine control.
73 Thermal evaluation of a cost-effective plastic ball grid array package - NuBGA.
74 High power multichip modules employing the planar embedding technique and microchannel water heat sinks.
75 Theoretical and experimental characteristics of the insulated-gate thyristor (IGTH).

76 Thermal limits of flip chip package - experimentally validated, CFD supported case studies.
77 Power transformers life expectancy under distorting power electronic loads.
78 SPICE generates thermal response models of a power semiconductor.
79 Proceedings of the 1996 12th Annual IEEE Semiconductor Thermal Measurement and Management Symposium.
80 Thermal evaluation of standard and power TQFP.
81 Survey of the thermal stability of an active heat sink.
82 Quick method for estimating junction temperature profiles in transient applications.
83 PBGA for high power: extending the thermal envelope.
84 Modeling the thermal transients in automotive power ICs.
85 Hybrid power modules advance motor controls.
86 Characterization of 6H-SiC JFETs for use in a temperature monitor operating from 25 degree C to 350 degree C.
87 Electron and thermal transport in InAs single-crystal free-standing wires.
88 Backside cooling solution for high power flip chip multi-chip modules.
89 Transient thermal model for the MQUAD(R) microelectronic package.
90 Optimization of extruded type external heat sink for multichip module.
91 Hybrid packaging technique for high power density circuit.
92 Internal resistance of a multi-chip packaging design for VLSI based systems.
93 Thermal simulation of a NASA get away special payload.
94 VLSI PACKAGING TECHNIQUE USING LIQUID-COOLED CHANNELS.

Titres dans la banque de données INSPEC

95 An experimental-numerical approach to thermal contact resistance.
96 Semiconductor power control modules of simple construction.
97 An investigation into heat transfer of electronic system packaging.
98 Experimental study of supercapacitor serial resistance and capacitance variations with temperature.
99 Multi-objective design of liquid cooled power electronic modules for transient operation.
100 Reducing power density through activity migration.

101 Electrothermal simulations of SiC GTO thyristors containing gate and drift regions of the same or opposite polarity in a clamped inductive-load circuit.
102 Physical insight into thermal behaviour of power DMOSFET and IGBT: a two-dimensional computer simulation study.
103 Investigation of the thermal performance of micro-whisker structured silicon heat spreaders for power devices.
104 Thermomechatronics of power electronic packages.
105 Investigation of the thermal performance of micro-whisker structured silicon heatspreaders for power devices.
106 Multi chip power packaging-reliability assessment.
107 Cooling modules with heat pipes for electronics devices.
108 The design of 2 V 1 GHz CMOS low-noise bandpass amplifier with good temperature stability and low power dissipation.
109 Technological aspects of wafer process and packaging interconnections of power MOSFETs for low voltage applications.
110 Thermal design for transient operation of the TIA wearable portable computer.
111 Optimization of cooling systems for power electronics by means of FEM/CFD-simulations.
112 High performance crystal oscillators for space applications.
113 High-performance quartz crystal oscillators.
114 Thermal characterization of MOS-controlled devices in transient conditions: verification of thermosensitive parameters by experimental and simulation tools.
115 Problems related to power semiconductor device modelling.
116 A hybrid approach to heat transfer modeling in electrothermal models of power semiconductor devices.
117 Thermal simulation in power electronics.
118 The simulation of a Gunn diode with temperature effects.

Recherche dans le titre

Titres dans la banque de données COMPENDEX

1 Contact thermal resistance of Li-ion cell electrode stack.
2 Effects of Printed-Circuit-Board Layout on Power Switch Case-to-Ambient Thermal Resistance.
3 Electro-thermal simulation of hot-spot phenomena in cellular bipolar power transistors: The influence of package thermal resistance.
4 Impact of wall region particle volume fraction distribution on thermal resistance of particle filled thermal interface materials.
5 A simple practical technique for estimating the junction temperature and the thermal resistance of a GaAs HBT.
6 Advanced thermal tester for accurate measurement of internal thermal resistance of high power electronic modules.
7 Low-thermal-resistance flip-chip fine package for 1-W voltage regulator IC.
8 Advanced thermal tester for accurate measurement of internal thermal resistance of high power electronic modules.
9 Advanced thermal resistance characterization technique for IC packages.
10 Characterization of interfacial thermal resistance by acoustic micrography imaging.
11 Thermal greases with exceptionally high thermal conductivity and low thermal resistance.
12 Characterization of interfacial thermal resistance for packaging high-power electronics modules.
13 Sub-millisecond thermal impedance and steady state thermal resistance explored.
14 Thermal resistance degradation of surface mounted power devices during thermal cycling.
15 Thermal resistance analysis by induced transient (TRAIT) method for power electronic devices thermal characterization - Part II: Practice and experiments.
16 Thermal resistance analysis by induced transient (TRAIT) method for power electronic devices thermal characterization - Part I: Fundamentals and theory.
17 On predicting the operational thermal resistance of electronic components.
18 Thermal resistance degradation of alloy die attached power devices during thermal cycling.
19 Thermal resistance and thermal warpage of cavity-down plastic ball grid array packages.
20 Thermal resistance of etched-pillar vertical-cavity surface-emitting laser diodes.
21 Low thermal resistance AlN PGA with low inductance of power lines.
22 On-resistance, thermal resistance and reverse recovery time of power MOSFETs at 77 K.
23 Package thermal resistance model: Dependency on equipment design.
24 Experimental study of thermal resistance of a power semiconductor package.
25 INTERNAL THERMAL RESISTANCE OF A MULTI-CHIP PACKAGING DESIGN FOR VLSI-BASED SYSTEMS.

26 PACKAGE THERMAL RESISTANCE MODEL DEPENDENCY ON EQUIPMENT DESIGN.
27 JUNCTION - TO - CASE THERMAL RESISTANCE - STILL A MYTH? .
28 NOVEL CONCEPT FOR REDUCING THERMAL CONTACT RESISTANCE.
29 THERMAL RESISTANCE OF IC PACKAGES.

Titres dans la banque de données INSPEC

30 An experimental-numerical approach to thermal contact resistance.
31 Effects of printed-circuit-board layout on power switch case-to-ambient thermal resistance.
32 Characterization of interfacial thermal resistance by acoustic micrography imaging.
33 Characterization of interfacial thermal resistance for packaging high-power electronics modules.
34 Thermal resistance analysis by induced transient method (TRAIT) applied to power electronic device packaging.
35 Film/substrate thermal boundary resistance for an Er-Ba-Cu-O high-Tc thin film.
36 Substrate and metallization selection for high power hybrid circuits based on thermal resistance and temperature cycling reliability.
37 Thermal resistance and temperature cycling endurance of DCB substrates.
38 On-resistance, thermal resistance and reverse recovery time of power MOSFETs at 77 K.
39 The computerized use of transient thermal resistance to avoid forward biased second breakdown in transistors.

Articles retenus STN juillet 2004

  [1] :  [ART572]  P.E. ROUGHAN, THERMAL RESISTANCE OF IC PACKAGES, 1973, pp. 96-99.
  [2] :  [ART573]  Thermal resistance degradation of surface mounted power devices during thermal cycling, 1999.
  [3] :  [ART574]  P.E. BAGNOLI, C. CASAROSA, M. CIAMPI, E. DALLAGO, Thermal resistance analysis by induced transient (TRAIT) method for power electronic devices thermal characterization - Part II: Practice and experiments, IEEE Transactions on Power Electronics, Vol. 13,
  [4] :  [ART575]  P.E. BAGNOLI, C. CASAROSA, M. CIAMPI, E. DALLAGO, Thermal resistance analysis by induced transient (TRAIT) method for power electronic devices thermal characterization - Part I: Fundamentals and theory, IEEE Transactions on Power Electronics, Vol. 13, N
  [5] :  [ART576]  On-resistance, thermal resistance and reverse recovery time of power MOSFETs at 77 K, 1989.
  [6] :  [ART577]  J.A. ANDREWS, Package thermal resistance model: Dependency on equipment design, IEEE Transactions on Components, Hybrids and Manufacturing Technology, Vol. 11, No. 4, 1988, pp. 528-537.
  [7] :  [ART578]  Experimental study of thermal resistance of a power semiconductor package, 1988.
  [8] :  [ART579]  PACKAGE THERMAL RESISTANCE MODEL DEPENDENCY ON EQUIPMENT DESIGN, 1988.
  [9] :  [ART580]  JUNCTION - TO - CASE THERMAL RESISTANCE - STILL A MYTH?, 1988.
 [10] :  [ART581]  NOVEL CONCEPT FOR REDUCING THERMAL CONTACT RESISTANCE, 1984.

Ajout de juillet 2004

  [1] :  [ART240]  V. SZEKELY, Enhancing reliability with thermal transient testing, Microelectronics Reliability, Volume 42, Issues 4-5, April-May 2002, pp. 629-640.
  [2] :  [PAP339]  N. RINALDI, A simple analytical approach for the thermal modeling of power devices and circuits, EPE'2001.
  [3] :  [PAP368]  R. Petersen, W. De Ceuninck, L. De Schepper, O. Vendier, H. Blanck, D. Pons, A refined method to measure the thermal resistance of heterojunction bipolar transistors under high-power conditions , ESREF'2001, pp. 1591-1596
  [4] : [SHEET127] P. ALOISI, Thermal fatigue in power semiconductor, PCI'87.
  [5] : [SHEET192] E. PROFUMO, A. TENCONI, S. FACELLI, B. PASSERINI, A. GUERRA, An Experimentally Validated Transient Thermal Impedance Model for High Power Diodes and Thyristors, EPE Journal, Volume 9, N° 3/4, january 2000, pp. 11-16.
  [6] :  [ART218]  P. COVA, M. CIAPPA, G. FRANCESCHINI, P. MALBERTI, F. FANTINI, Thermal characterization of IGBT power modules, Microelectronics Reliability, Vol. 37, Issues 10-11, October 1997, pp. 1731-1734.
  [7] : [SHEET055] J. le PONNER, J.-M. PETER, Thermal resistance and impedance of triacs,  Revue Generale de l'Electricite (Nov. 1972) vol.81, no.11, p.711-19.
  [8] :  [PAP226]  O'Flaherty, C. Cahill, K. Rodgers, O. Slattery, Thermal resistance measurement protocols, THERMINIC 96.
  [9] :  [PAP395]  H.PAPE, Treatment of Convection and Radiation without CFD in Thermal Resistance Calculations, pp. 43-49, THERMINIC'2001.
 [10] : [SHEET202] B. ROEHR, B. SHINER, Transient thermal resistance, general data and its use, AN 569, Motorola, 1972.

 [11] : [99ART190] [BE8200], Transmission de l'énergie thermique - Conduction, A. DEGIOVANNI, Technique de l'Ingénieur, avril 1999.
 [12] : [99ART191] [D3112], Semi-conducteurs de puissance - Problèmes thermiques (partie 1), J.-M. DORKEL, Technique de l'Ingénieur, mai 2003.

 [13] :  [DIV107]  T. LEQUEU, Liste de références pour le calcul des résistances thermiques, décembre 2009.
 [14] :  [DIV444]  T. LEQUEU, Cours de Composants en Commutation - 2004/2005, IUT GEII 2ème année, option EEP, notes de cours, septembre 2004.

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