Revue : [REVUE295]

Titre : Elsevier Science, Microelectronics Reliability, Volume 42, Issue 3, Pages 307-461, March 2002.

Cité dans : [DATA197] Les revues Microelectronics Reliability et Microelectronics Journal, ELSEVIER, décembre 2004.

Volume : 42
Issue : 3
Pages : 307 - 461
Date : March 2002

[1] : A review of ULSI failure analysis techniques for DRAMs 1. Defect
localization and verification, Pages 307-316
Guenther Benstetter, Michael W. Ruprecht and Douglas B. Hunt
Lien : vide.pdf - | Article | Journal Format-PDF (662 K)

[2] : Recent developments in silicon optoelectronic devices, Pages 317-326
Hei Wong
Lien : vide.pdf - | Article | Journal Format-PDF (343 K)

[3] : Investigation and modeling of stressed thermal oxides, Pages 327-333
Domenico Caputo and Fernanda Irrera
Lien : vide.pdf - | Article | Journal Format-PDF (156 K)

[4] : A new empirical extrapolation method for time-dependent dielectric
breakdown reliability projections of thin SiO2 and nitride¯oxide
dielectrics, Pages 335-341
Fen Chen, Rolf-Peter Vollertsen, Baozhen Li, Dave Harmon and Wing L. Lai
Lien : vide.pdf - | Article | Journal Format-PDF (149 K)

[5] : Influence of polysilicon-gate depletion on the subthreshold behavior of
submicron MOSFETs, Pages 343-347
Juin J. Liou, R. Shireen, A. Ortiz-Conde, F. J. García Sánchez, A.
Cerdeira, X. Gao, Xuecheng Zou and C. S. Ho
Lien : vide.pdf - | Article | Journal Format-PDF (397 K)

[6] : The abnormality in gate oxide failure induced by stress-enhanced diffusion
of polycrystalline silicon, Pages 349-354
Yongseok Ahn, Sanghyun Lee, Gwanhyeob Koh, Taeyoung Chung and Kinam Kim
Lien : vide.pdf - | Article | Journal Format-PDF (293 K)

[7] : 1/f noise as a reliability indicator for subsurface Zener diodes, Pages
355-360
Yiqi Zhuang and Lei Du
Lien : vide.pdf - | Article | Journal Format-PDF (100 K)

[8] : Temperature-dependent noise characterization and modeling of on-wafer
microwave transistors, Pages 361-366
A. Caddemi and N. Donato
Lien : vide.pdf - | Article | Journal Format-PDF (322 K)

[9] : A thermo-mechanical study on the electrical resistance of aluminum wire
conductors, Pages 367-374
De-Shin Liu and Chin-Yu Ni
Lien : vide.pdf - | Article | Journal Format-PDF (368 K)

[10] : The impact of copper contamination on the quality of the second wire
bonding process using X-ray photoelectron spectroscopy method, Pages
375-380
T. Y. Lin, W. S. Leong, K. H. Chua, R. Oh, Y. Miao, J. S. Pan and J. W.
Chai
Lien : vide.pdf - | Article | Journal Format-PDF (164 K)

[11] : Development of gold to gold interconnection flip chip bonding for chip on
suspension assemblies, Pages 381-389
C. F. Luk, Y. C. Chan and K. C. Hung
Lien : vide.pdf - | Article | Journal Format-PDF (783 K)

[12] : Bump formation for flip chip and CSP by solder paste printing, Pages
391-398
Joachim Kloeser, Paradiso Coskina, Rolf Aschenbrenner and Herbert Reichl
Lien : vide.pdf - | Article | Journal Format-PDF (573 K)

[13] : Impact of component placement in solder joint reliability, Pages 399-406
T. Alander, S. Nurmi, P. Heino and E. Ristolainen
Lien : private/ALANDER1.pdf - 270 Ko, 8 pages.

  [1] :  [ART229]  T. ALANDER, S. NURMI, P. HEINO, E. RISTOLAINEN, Impact of component placement in solder joint reliability, Microelectronics Reliability, Volume 42, Issue 3, March 2002, pp. 399-406.

[14] : Board level reliability of a stacked CSP subjected to cyclic bending,
Pages : 407-416
J. D. Wu, S. H. Ho, C. Y. Huang, C. C. Liao, P. J. Zheng and S. C. Hung
Lien : vide.pdf - | Article | Journal Format-PDF (778 K)

[15] : A novel, zone based process monitoring method for low cost MCM-D
substrates manufactured on large area panels, Pages 417-426
Didier Cottet, Michael Scheffler and Gerhard Tröster
Lien : vide.pdf - | Article | Journal Format-PDF (416 K)

[16] : Multichannel mixed-mode IC for digital readout of silicon strip detectors,
Pages : 427-436
P. Grybo, W. Dbrowski, P. Hottowy, R. Szczygie, K. wientek and P. Wicek
Lien : vide.pdf - | Article | Journal Format-PDF (221 K)

[17] : On-line testable data path synthesis for minimizing testing time, Pages
437-453
A. A. Ismaeel, R. Bhatnagar and R. Mathew
Lien : vide.pdf - | Article | Journal Format-PDF (293 K)

[18] : MOS characteristics of NO-grown oxynitrides on n-type 6H-SiC, Pages
455-458
S. Chakraborty, P. T. Lai and P. C. K. Kwok
Lien : vide.pdf - | Article | Journal Format-PDF (125 K)

[19] : Prediction of long-term thermal behavior of an irradiated SRAM based on
isochronal annealing measurements, Pages 459-461
F. Saigné, O. Quittard, L. Dusseau, F. Joffre, C. Oudéa, J. Fesquet and J.
Gasiot
Lien : vide.pdf - | Article | Journal Format-PDF (192 K)

[20] : Calendar of forthcoming events, Pages I-VIII
Lien : Revue295.pdf - Format-PDF (38 K)

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