W.C. ZHENG, S.V. HARREN, A.F. SKIPOR, "Thermomechanical analysis of flip-chip-on-board electronic packaging assembly", Proceedings of the 1994 International Mechanical Engineering Congress & Exhibition, pp. 1-5.

W.C. ZHENG, S.V. HARREN, A.F. SKIPOR, "Thermomechanical analysis of flip-chip-on-board electronic packaging assembly", Proceedings of the 1994 International Mechanical Engineering Congress & Exhibition, pp. 1-5. Copyright - [Précédente] [Première page] [Suivante] - Home

Article : [TRIAC086]

Info : REPONSE 109, le 04/02/2002.

Titre : W.C. ZHENG, S.V. HARREN, A.F. SKIPOR, Thermomechanical analysis of flip-chip-on-board electronic packaging assembly, Proceedings of the 1994 International Mechanical Engineering Congress & Exhibition, pp. 1-5.

Cité dans : [DIV333]  Recherche sur les mots clés thermal + shock + liquid , février 2002.
Cité dans : [DIV643]  SEMIKRON,  Montage didactique à IGBT pour l'enseignement de l'électronique de puissance, Note d'application, 19 pages.

Auteur : Zheng, W.C. (Univ of Illinois at Chicago, Chicago, IL, USA)
Auteur : Harren, S.V.
Auteur : Skipor, A.F.

Meeting : Proceedings of the 1994 International Mechanical Engineering Congress & Exhibition, of the Winter Annual Meeting.
Location : Chicago, IL, USA
Date : 06 Nov 1994-11 Nov 1994

Source : Winter Annual Meeting of the American Society of Mechanical Engineers 1994.
Pages : 1 - 5
Info : 94-WA/EEP-14
CODEN : 85LPAT
Année : 1994
Meeting_Number : 42296
Document_Type : Journal
Treatment_Code : Application; Theoretical
Language : English
Stockage :

Abstract :
The Flip-Chip-on-Board (FCOB) packaging technique is a low profile,
small outline packaging scheme whereby a solder-bumped, bare silicon die
is directly attached to an epoxy-glass substrate.It has been found that
the thermal fatigue reliability of solder joints in such an assembly is
significantly enhanced when epoxy is deposited between the die and
substrate to encapsulate said joints. When an FCOB assembly is subject to
thermal cycling, mismatches in coefficients of thermal expansion could
possibly induce large irreversible strains in the solder
joints.Additionally, at room temperature and above, solders exhibit
pronounced strain rate sensitivity, or are significantly viscoplastic. In
this study, the isotropic form of the Bodner-Partom phenomenological
viscoplasticity model is used to describe the solder materials. The effect
of liquid-to-liquid thermal shock on the solder joints of the assembly is
ascertained through a two-dimensional finite element analysis.The results
of the analysis indicate that the plastic strains in the solder joints are
of fairly small magnitude, which points to high fatigue lives of the
solder joints.(Author abstract)

References : 11 Refs.

Accession_Number : 1995(11):8089 COMPENDEX

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