Revue : [REVUE378]

Titre : Elsevier Science, Microelectronics Reliability, Volume 42, Issue 12, Pages 1823-2034, December 2002.

Cité dans : [DATA197] Les revues Microelectronics Reliability et Microelectronics Journal, ELSEVIER, décembre 2004.

Volume : 42
Issue : 12
Pages : 1823 - 2034
Date : December 2002

[1] : Atomic-layer-deposited silicon-nitride/SiO2 stack - a highly potential gate dielectrics for advanced CMOS technology, Pages 1823-1835
Anri Nakajima, Quazi D. M. Khosru, Takashi Yoshimoto and Shin Yokoyama
Lien : vide.pdf - | Full Text + Links | PDF (742 K)

[2] : Solder joint reliability of a polymer reinforced wafer level package, Pages : 1837-1848
Deok-Hoon Kim, Peter Elenius, Michael Johnson and Scott Barrett
Lien : vide.pdf - | Full Text + Links | PDF (794 K)

[3] : Prediction of electromigration-void formation in copper conductors based on the electron configuration of matrix and solute atoms, Pages 1849-1855
A. Zehe
Lien : vide.pdf - | Full Text + Links | PDF (111 K)

[4] : An analytical effective channel-length modulation model for velocity overshoot in submicron MOSFETs based on energy-balance formulation, Pages 1857-1864
K. Y. Lim and X. Zhou
Lien : vide.pdf - | Full Text + Links | PDF (199 K)

[5] : On the correlation between radiation-induced oxide- and border-trap effects in the gate-oxide nMOSFET's, Pages 1865-1874
Boualem Djezzar
Lien : vide.pdf - | Full Text + Links | PDF (448 K)

[6] : On-state and off-state stress-induced degradation in unhydrogenated solid phase crystallized polysilicon thin film transistors, Pages 1875-1882
Dimitrios N. Kouvatsos
Lien : vide.pdf - | Full Text + Links | PDF (574 K)

[7] : Effect of substrate flexibility on solder joint reliability, Pages 1883-1891
Xingsheng Liu, Shuangyan Xu, Guo-Quan Lu and David A. Dillard
Lien : vide.pdf - | Full Text + Links | PDF (542 K)

[8] : The optimization design of bump interconnections in flip chip packages from the electrical standpoint, Pages 1893-1901
De-Shin Liu and Chin-Yu Ni
Lien : vide.pdf - | Full Text + Links | PDF (317 K)

[9] : Procedure for design optimization of a T-cap flip chip package, Pages 1903-1911
Chin-Yu Ni, De-Shin Liu and Ching-Yang Chen
Lien : vide.pdf - | Full Text + Links | PDF (467 K)

[10] : Anisotropic conductive film flip chip joining using thin chips, Pages 1913-1920
Erja Jokinen and Eero Ristolainen
Lien : vide.pdf - | Full Text + Links | PDF (212 K)

[11] : Failure criteria of flip chip joints during accelerated testing, Pages 1921-1930
Frank Stepniak
Lien : vide.pdf - | Full Text + Links | PDF (247 K)

[12] : Reliability studies and design improvement of mirror image CSP assembly, Pages : 1931-1937
Dongji Xie and Sammy Yi
Lien : vide.pdf - | Full Text + Links | PDF (474 K)

[13] : Encapsulation of naked dies for bulk silicon etching with TMAH, Pages 1939-1944
Silke Liebert
Lien : vide.pdf - | Full Text + Links | PDF (382 K)

[14] : Study of short-circuiting between adjacent joints under electric field effects in fine pitch anisotropic conductive adhesive interconnects, Pages 1945-1951
Y. W. Chiu, Y. C. Chan and S. M. Lui
Lien : vide.pdf - | Full Text + Links | PDF (271 K)

[15] : Thin film, thick film microstrip band pass filter: a comparison and effect of bulk overlay, Pages 1953-1958
Sunit Rane and Vijaya Puri
Lien : vide.pdf - | Full Text + Links | PDF (167 K)

[16] : Aging of the over-voltage protection elements caused by over-voltages, Pages : 1959-1966
Predrag Osmokrovic, Boris Loncar, Srboljub Stankovic and Aleksandra Vasic
Lien : vide.pdf - | Full Text + Links | PDF (230 K)

[17] : Analysis of burn-in time using the general law of reliability, Pages 1967-1974
E. M. Baskin
Lien : vide.pdf - | Full Text + Links | PDF (220 K)

[18] : Testing process capability for one-sided specification limit with application to the voltage level translator, Pages 1975-1983
P. C. Lin and W. L. Pearn
Lien : vide.pdf - | Full Text + Links | PDF (130 K)

[19] : Ultra-shallow n+p junction formed by PH3 and AsH3 plasma immersion ion implantation, Pages 1985-1989
B. L. Yang, N. W. Cheung, S. Denholm, J. Shao, H. Wong, P. T. Lai and Y. C. Cheng
Lien : vide.pdf - | Full Text + Links | PDF (287 K)

[20] : An IGBT DC subcircuit model with non-destructive parameters extraction and comparison with measurements, Pages 1991-1996
Shoucai Yuan and Changchun Zhu
Lien : vide.pdf - | Full Text + Links | PDF (166 K)

[21] : Open contact analysis of single bit failure in 0.18 m technology, Pages 1997-2001
Zhigang Song, Jiyan Dai and Shailesh Redkar
Lien : vide.pdf - | Full Text + Links | PDF (265 K)

[22] : On the analytical description of ageing kinetics in ceramic manganite-based NTC thermistors, Pages 2003-2007
V. O. Balitska, B. Butkievich, O. I. Shpotyuk and M. M. Vakiv
Lien : vide.pdf - | Full Text + Links | PDF (126 K)

[23] : Integrated process capability analysis with an application in backlight module, Pages 2009-2014
M. L. Huang, K. S. Chen and Y. H. Hung
Lien : vide.pdf - | Full Text + Links | PDF (199 K)

[24] : Author Index to Volume 42, Pages 2029-2034
PDF (47 K)

[25] : International IEEE conference on the business of electronic product reliability and liability, Pages I-II
PDF (49 K)

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