S. FORSTER, "Mécanisme de fracture dans les matériaux fragiles et théorie du choc thermique", rapport interne, 8 novembre 2000, 13 pages.

S. FORSTER, "Mécanisme de fracture dans les matériaux fragiles et théorie du choc thermique", rapport interne, 8 novembre 2000, 13 pages. Copyright - [Précédente] [Première page] [Suivante] - Home

Fiche : [DATA213]

Titre : S. FORSTER, Mécanisme de fracture dans les matériaux fragiles et théorie du choc thermique, rapport interne, 8 novembre 2000, 13 pages.

Auteur : Stéphane FORSTER

Lien : private/TH-FRAC1.doc - 13 pages, 215 Ko.
Lien : private/TH-FRAC1.pdf - 13 pages, 196 Ko.

Bibliographie

Références : 12
[1] : A.E.Segall, J.R.Hellmann, R.E.Tressler, "Thermal Shock Behaviour - Testing and Modeling", Rapport du Gas Research Institute, 1992.
[2] : D.P.H.Hasselman, "Unified Theory of Thermal Shock Fracture Initiation and Crack Propagation in Brittle Ceramics", J.Amer.Ceram.Soc., vol.52, no.11, pp.600-607, 1969.
[3] : D.P.H.Hasselman, "Crack Propagation Under Constant Deformation and Thermal Stress Fracture", Int. J. Frac. Mech, vol.7, no.2, pp.157-161, 1971.
[4] : D. Broek, "Elementary Engineering Fracture Mechanics", juin 1982, Martinus Nijhoff Publishers, 524 pages.
[5] : J.P.Berry, "Some Kinetic Considerations of the Griffith Criterion for Fracture", J. Mech. Phys. Solids, 8, 1960, pp. 207-216.
[6] : A.Griffith, "Phenomena of Rupture and Flow in Solids", Phil. Trans. Roy. Soc (London), 221A, 163-98, 1920.
[7] : D.G.Yang, "Vertical die crack stresses of flip chip induced in major package assembly processes", Microelectronics Reliability, 40, pp. 1533-1538, 2000.
[8] : Manuel SOLIDIS-ISE Integrated Systems Engineering TCAD version 6.0, (1995-99).
[9] : P.Robert, "Matériaux de l'électro-technique", chapitre 6, Ed Dunod, 1987.
[10] : D.P.H.Hasselman, "Thermal stress crack stability and propagation in severe thermal environments", Ceramics in Severe Environments, Proc. of the Sixth Univ. Conf. on Ceram. Sci., North Carolina State Univ. at Raleigh, December 7-9, 1970.
[11] : T.Y.Kam, C.D.Lu, "Reliability analysis of brittle systems considering several random variables", Engineering fracture mechanics, vol.33, no.1, pp.37-44, 1989.
[12] : T.Y.Kam, C.D.Lu, "Thermal stress fracture analysis of brittle bodies", Engineering fracture mechanics, vol.32, no.5, pp.827-832, 1989.

  [1] : [SHEET125] A.E. SEGALL, J.R. HELLMANN, R.E. TRESSLER, Thermal Shock Behaviour - Testing and Modelling, GRI, December 1992, 232 pages.
  [2] : [SHEET431] D.P.H. HASSELMAN, Unified Theory of Thermal Shock Fracture Initiation and Crack Propagation in Brittle Ceramics, J. Amer. Ceram. Soc., vol. 52, no. 11, pp. 600-607, 1969.
  [3] : [SHEET432] D.P.H. HASSELMAN, Crack Propagation Under Constant Deformation and Thermal Stress Fracture, Int. J. Frac. Mech, vol. 7, no. 2, pp. 157-161,  1971.
  [4] : [LIVRE200] D. BROEK, Elementary Engineering Fracture Mechanics, June 1982, Martinus Nijhoff Publishers, 524 pages.
  [5] : [SHEET505] J.P. BERRY, Some kinetic considerations of the Griffith criterion for fracture- II Equations of motion at constant deformation, J. Mech. Phys. Solids, 1960, Vol. 8, pp. 207-216.
  [6] :  [PAP176]  A. GRIFFITH, Phenomena of Rupture and Flow in Solids, Philosophical Transaction of the Royal Society of London, part A, vol. 221, pp. 163-98, 1920.
  [7] : [SHEET468] D.G. YANG, L.J. ERNST, C. VAN'T HOF, M.S. KIASAT, J. BISSCHOP, J. JANSSEN, F. KUPER, Z. N. LIANG, R. SCHRAVENDEEL, G.Q. ZHANG, Vertical die crack stresses of Flip Chip induced in major package assembly processes, ESREF'2000, pp. 1533-1538.
  [8] :  [DATA127] ISE, Integrated Systems Engineering TCAD, version 6.0, 1995-1999.
  [9] : [LIVRE219] P. ROBERT, Volume II : Matériaux de l'électrotechnique, Ed Dunod, 1987.
 [10] : [SHEET433] D.P.H. HASSELMAN, Thermal Stress Crack Instability and Propagation in severe thermal environments, Ceramics in Severe Environments, Proc. of the Sixth Univ. Conf. on Ceram. Sci., North Carolina State Univ. at Raleigh, December 7-9, 1970.
 [11] : [SHEET503] T.Y. KAM, C.D. LU, Reliability analysis of brittle systems considering several random variables, Engineering fracture mechanics, vol.33, no.1, pp.37-44, 1989.
 [12] : [SHEET502] T.Y. KAM, C.D. LU, Thermal stress fracture analysis of brittle bodies, Engineering fracture mechanics, vol.32, no.5, pp.827-832, 1989.

Mise à jour le lundi 10 avril 2023 à 18 h 48 - E-mail : thierry.lequeu@gmail.com
Cette page a été produite par le programme TXT2HTM.EXE, version 10.7.3 du 27 décembre 2018.

Les informations contenues dans cette page sont à usage strict de Thierry LEQUEU et ne doivent être utilisées ou copiées par un tiers.
Powered by www.google.fr, www.e-kart.fr, l'atelier d'Aurélie - Coiffure mixte et barbier, La Boutique Kit Elec Shop and www.lequeu.fr.