W. MENZ, J. MOHR, O. PAUL, "Microsystem technology", 01/2001, 500 pages.
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Fiche : [LIVRE236]
Titre : W. MENZ, J. MOHR, O. PAUL, Microsystem technology, 01/2001, 500 pages.
Cité dans :[LIVRE125] NENE, Microsystem technology,
Auteur : Menz, Wolfgang
Auteur : Mohr, Jürgen
Auteur : Paul, Oliver
Fiche : LMP01-03
Référence : 2001 xx / LMP
Date_d'achat : 01/02/2001
Prix_H.T. : 1207.06 F
Stockage : Bibliothèque LMP
Site : http://www.wiley-vch.de - Editeur John Wiley & Sons - Site allemand
Site : http://www.wiley-vch.de/books/tis/eng/3-527-29634-4.html
Mots_clef : silicium
Date : 01 - 2001
Langue : ANGLAIS
Pages : 1 500 pages
ISBN : 3-527-29634-4
Vers : Résumé
Vers : Sommaire
Vers : Table of contents
This completely revised edition includes the latest trends in this emerging
scientific discipline. The chapters on silicium and LIGA technology are
greatly expanded.
This completely revised edition of a bestselling concise introduction to microsystems
technology includes the latest trends in this emerging scientific discipline.
The chapters on silicium and LIGA technology are greatly expanded, whilst new topics include
application aspects in medicine and health technology, lithography and electroplating.
General introduction to microstructure technology.
The parallels to microelectrics.
The basis and materials in microtechnology.
Basic principles of vacuum technology.
Lithography.
The silicon micromechanics.
The LIGA process.
Alternative process of microstructuring.
Construction and junction techniques (CJT)/system technology.
Thèmes_du_livre : Théories - Appareillages - Dispositifs à l'état solide - composants
1 : General Introduction to Microstructure Technology 1
1.1 : What is Microstructure Technology...? 1
1.2 : From Microstructure Technology to Microsystems Technology 9
2 : The Parallels to Microelectronics 15
2.1 : The Production of Single Crystal Wafers 15
2.1.1 :
Production of Silicon-Single Crystals 17
2.1.2 : Production of GaAs Single Crystals 24
2.2 : Basic Technical Processes 26
2.2.1 : Film Deposition 27
2.2.2 : Lithography (Film Patterning) 30
2.2.3 : Surface Modification 31
2.2.4 : Etching (Film Removal) 35
2.3 : Packaging Technology 36
2.3.1 : Requirements for Packaging Technology 36
2.3.2 : Hybrid Technology 37
2.4 : Clean Room Techniques 39
3 : The Physical and Chemical Basics in Microtechnology 45
3.1 : Crystals and Crystallography 45
3.1.1 : Lattice and Types of Lattices 46
3.1.2 : Stereographic Projection 48
3.1.3 : The Silicon Single Crystal 53
3.1.4 : Reciprocal Lattice and the Analysis of the Crystal Structure 55
3.2 : Methods to Determine the Crystalline Structure 62
3.2.1 : X-ray Diffraction 62
3.2.2 : Electron Beam Diffraction 64
3.3 : Basic Concepts of Electroplating 66
3.3.1 : The Electrode-Electrolyte Interface 69
3.3.2 : Polarization and Overpotential 73
3.3.3 : Mechanisms of Cathodic Metal Deposition 74
3.4 : Materials of Microsystems Technology 81
4 : Basic Technologies in MEMS 109
4.1 : Basic Principles of Vacuum Technology 109
4.1.1 : The Mean Free Path 110
4.1.2 : The Monolayer Time 112
4.1.3 : Velocity of Atoms and Molecules 114
4.1.4 : Gas Dynamics 115
4.1.5 : The Classification of Technical Vacuums 116
4.2 : Vacuum Production
117
4.2.1
Pumps for Rough- and Fine Vacuums
118
4.2.2
High Vacuum- and Ultrahigh Vacuum Pumps
119
4.3
Vacuum Measurement
125
4.3.1
Pressure Transducer
125
4.3.2
Thermal Conductivity Vacuum Gauge
126
4.3.3
Friction Type Vacuum Gauge
126
4.3.4
Thermionic Ionization Vacuum Gauge
127
4.3.5
Cold Cathode Ionization Gauge (Penning Principle)
127
4.3.6
Leakage and Leak Detection
128
4.4
Properties of Thin Films
129
4.4.1
Structure Zone Model
129
4.4.2
Adhesive Strength of the Layer
132
4.5
Physical and Chemical Coating Techniques
133
4.5.1
Evaporation
133
4.5.2
Sputtering
135
4.5.3
Ion Plating or Plasma Assisted Deposition
139
4.5.4
Ion Cluster Beam Technology
140
4.5.5
CVD Processes
143
4.5.6
Epitaxy
146
4.5.7
Plasma Polymerization
148
4.5.8
Oxidation
148
4.6
Structuring of Thin Films with Dry Etch Processes
151
4.6.1
Physical Etch Technologies
155
4.6.2
Combined Physical and Chemical Etch Technologies
158
4.6.3
Chemical Etching Technologies
162
4.7
Analysis of Thin Films and Surfaces
164
4.7.1
Electron Probe Microanalysis (EPM)
165
4.7.2
Auger Electron Spectroscopy (AES)
166
4.7.3
X-Ray Photoelectron Spectroscopy (XPS)
168
4.7.4
Secondary Ion Mass Spectroscopy (SIMS)
168
4.7.5
Secondary Neutral Particle Mass Spectroscopy (SNMS)
169
4.7.6
Ion Scattering Spectroscopy (ISS)
169
4.7.7
Rutherford Back Scattering Spectroscopy (RBS)
169
4.7.8
Scanning Tunneling Microscope
170
5
Lithography
171
5.1
Overview and History
171
5.2
Resists
171
5.3
Process of Lithography
175
5.4
Computer Aided Design (CAD)
176
5.4.1
CAD-Layout
177
5.4.2
Alignment Patterns and Test Structures
178
5.4.3
Organization of the Design (Hierarchy, Layers).
181
5.5
Electron Beam Lithography
182
5.5.1
Gaussian Beams
182
5.5.2
Write Strategy with Gaussian Beams
185
5.5.3
Shaped Beams
187
5.5.4
Post Processor
189
5.5.5
Proximity Effect
190
5.6
Optical Lithography
192
5.6.1
Masks
193
5.6.2
Shadow Projection
194
5.6.3
Imaging Projection
196
5.6.4
Further Developments
198
5.6.5
Optical Lithography for Micromechanics
200
5.7
Ion Beam Lithography
202
5.8
X-Ray Lithography
202
5.8.1
Masks
203
5.8.2
X-Ray Sources
204
5.8.3
Synchrotron Radiation
204
5.8.4
Application of X-ray Lithography
208
6
Silicon Microsystem Technology
209
6.1
Silicon Technology
210
6.1.1
IC Processes and Substrates
210
6.1.2
Foundry Technologies
214
6.2
Silicon Micromachining
215
6.2.1
Introduction
215
6.2.2
Wet Etching
220
6.2.3
Basic Etch Shapes
227
6.2.4
Etching Control
234
6.2.5
Characterization of Anisotropic Wet Etchants
239
6.2.6
Dry Etching
241
6.3
Surface Micromachining
248
6.3.1
Polysilicon Micromachining
250
6.3.2
Sacrificial Aluminum Micromachining
253
6.3.3
Sacrificial Polymer micromachining
254
6.3.4
Stiction
255
6.4
Micro Transducers and Systems Based on Silicon Technology
257
6.4.1
Mechanical Devices and Systems
257
6.4.2
Thermal Micro Devices and Systems
263
6.4.3
Devices and Systems for Radiant Signals
273
6.4.4
Magnetic Devices and Systems
278
6.4.5
Chemical Microsensors
280
6.4.6
Micromachined Devices for Electrical Signal Processing
285
6.5
Summary and Outlook
287
7
The LIGA Process
289
7.1
Overview
289
7.2
Mask Production
291
7.2.1
The Principle Construction of a Mask
291
7.2.2
Production of the Carrier Foil
294
7.2.3
Structuring of the Resist for X-ray Intermediate Masks
295
7.2.4
Electroplating with Gold for X-ray Masks
298
7.2.5
Production of Process Masks
299
7.2.6
Window for Alignment in X-ray Process Masks
301
7.3
X-ray Lithography
301
7.3.1
Production of Thick Resist Layers
302
7.3.2
Beam Induced Reactions and Development of Resists
303
7.3.3
Requirements on the Absorbed Radiation Dosage
306
7.3.4
Influences on the Quality of the Structure
310
7.4
Galvanic Deposition
316
7.4.1
Galvanic Deposition of Nickel for the Production of Microstructures
316
7.4.2
Mold Insert Fabrication
321
7.4.3
Electrodeposition of Further Metals and Alloys
322
7.5
Plastic Molding in the LIGA Process
324
7.5.1
Production of Microstructures by Reaction Injection Molding
324
7.5.2
Fabrication of Microstructures by Injection Molding
327
7.5.3
Fabrication of Microstructures by Hot Embossing
333
7.5.4
Production of Metallic Microstructures from Molded Plastic Structures (Second Electroplating)
337
7.6
Variations and Additional Steps of the LIGA Technology
341
7.6.1
Sacrificial Layer Technology
341
7.6.2
3D-Structuring
344
7.6.3
Production of Light-Conducting Structures by Molding
347
7.7
Examples of Applications
349
7.7.1
Rigid Metallic Microstructures
349
7.7.2
Moving Microstructures, Microsensors and Microactuators
353
7.7.3
Fluidic Microstructures
366
7.7.4
LIGA-Structures for Optical Uses
368
8
Alternative Processes of Microstructuring
381
8.1
Mechanical Micromanufacturing
381
8.1.1
Production Process and Primary Structures
382
8.1.2
Examples of Applications
386
8.2
Electro-Discharge Machining
394
8.2.1
The Basics of EDM
394
8.2.2
Applications of EDM for Microsystems
397
8.3
Laser Micromachining
399
9
Packaging and Interconnecting Techniques (PIT)
403
9.1
Hybrid Technology
404
9.1.1
Substrates and Pastes
404
9.1.2
Layer Production
407
9.1.3
Placement and Soldering of the Circuit Components
408
9.1.4
Mounting and Contacting of Silicon Dies
412
9.2
Wire-Bonding Techniques
413
9.2.1
Thermocompression Wire-bonding (Hot-Pressure Welding Bonding)
413
9.2.2
Ultrasonic Wire-bonding (Ultrasonic Bonding)
414
9.2.3
Thermosonic Wire-bonding (Ultrasonic Hot-pressure Welding)
414
9.2.4
Ball-Wedge Bonding
415
9.2.5
Wedge-Wedge Bonding
416
9.2.6
Advantages and Disadvantages of the Wire-bond Processes
417
9.2.7
Test Processes and Alternatives
417
9.3
New Contacting Technologies
418
9.3.1
The TAB Technology
418
9.3.2
The Flip-Chip Technologies
420
9.4
Adhesion
422
9.4.1
Isotropic Adhesion
422
9.4.2
Anisotropic Adhesion
424
9.5
Anodic Bonding
425
9.5.1
Wafer-to-Glass Bonding
425
9.5.2
Wafer-to-Wafer Bonding
427
9.6
New Packaging Technologies
428
9.6.1
Low Temperature Cofired Ceramics (LTCC)
428
10
System Technology
431
10.1
Definition of a Microsystem
431
10.2
Sensors
433
10.3
Actuators
438
10.4 : Signal Processing 439
10.4.1 : Signal Processing for Sensors in Microsystems 440
10.4.2 : Neural Data Processing for Sensor Arrays 444
10.5 : Interfaces of Microsystems 449
10.5.1 : The IE-Transfer 452
10.5.2 : The S-Transfer 455
10.6 : The Module Concept of Microsystem Technology 456
10.7 : Design, Simulation, Integration, and Test of Microsystems 461
Literatur : 465
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