K. KANAJI, K. MIZUIKE, T. NISHIGUCHI, "High performance liquid epoxy encapsulant for advanced semiconductor package", Proceedings of the 1997 1st Electronic Packaging Technology Conference, EPTC'97, pp. 215-218.

K. KANAJI, K. MIZUIKE, T. NISHIGUCHI, "High performance liquid epoxy encapsulant for advanced semiconductor package", Proceedings of the 1997 1st Electronic Packaging Technology Conference, EPTC'97, pp. 215-218. Copyright - [Précédente] [Première page] [Suivante] - Home

Article : [TRIAC081]

Info : REPONSE 58, le 05/02/2002.

Titre : K. KANAJI, K. MIZUIKE, T. NISHIGUCHI, High performance liquid epoxy encapsulant for advanced semiconductor package, Proceedings of the 1997 1st Electronic Packaging Technology Conference, EPTC'97, pp. 215-218.

Cité dans : [DIV333]  Recherche sur les mots clés thermal + shock + liquid , février 2002.
Cité dans : [DIV463]  Recherche sur les mots clés FLIP CHIP, juillet 2005.

Auteur : Kanaji, K. (Nagase-CIBA Ltd, Hyogo, Jpn)
Auteur : Mizuike, K.
Auteur : Nishiguchi, T.

Meeting : Proceedings of the 1997 1st Electronic Packaging Technology Conference, EPTC.
Location : Singapore, Singapore
Date : 08 Oct 1997-10 Oct 1997
Info : organization : IEEE
Source : Proceedings of the Electronic Technology Conference, EPTC 1997. IEEE, Piscataway, NJ, USA,97TH8307.
Pages : 215 - 218
CODEN : 003132
Année : 1997
Meeting_Number : 49120
Document_Type : Conference Article
Treatment_Code : Experimental
Language : English
Stockage :

Abstract :
LEE (Liquid epoxy encapsulant) has been used in the electronic
assembly industry mainly for COB (Chip On Board) applications in the past
which do not require high reliability performance. Nevertheless, the new
packages development has brought CDBGAs (Cavity Down BGAs), for example,
like Tape-BGA, Metal-BGA, and Plastic BGAs as well as flip chip
applications into the market where high performance encapsulant is
needed.Due to their unique configurations and requirements of these new
packages, potting and underfilling processes has replaced transfer molding
as the way for encapsulation and the conventional EMC (Epoxy Molding
Compound) has been substrates (mainly organic and some ceramic) instead of
metal leadframe, therefore low warpage is required.In addition, the
reliability requirement of temperature cycling, thermal shock and moisture
resistance which applied to conventional IC packages, are also applied to
BGA and flip chip application.An advanced epoxy encapsulant system for
potting and underfilling application was developed to meet stringent
requirement of new semiconductor packages with excellent
performance.(Author abstract)

References : 1 Refs.

Accession_Number : 1998(50):4079 COMPENDEX

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