S. RAMMINGER, N. SELIGER, G. WACHUTKA, "Reliability Model for Al Wire Bonds subjected to Heel Crack Failures", ESREF'2000, pp. 1521-1526.

S. RAMMINGER, N. SELIGER, G. WACHUTKA, "Reliability Model for Al Wire Bonds subjected to Heel Crack Failures", ESREF'2000, pp. 1521-1526. Copyright - [Précédente] [Première page] [Suivante] - Home

Article : [SHEET465]

Titre : S. RAMMINGER, N. SELIGER, G. WACHUTKA, Reliability Model for Al Wire Bonds subjected to Heel Crack Failures, ESREF'2000, pp. 1521-1526.

Cité dans : [DATA126] ESREF'2000, 11th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Dresden, Germany, 2-6 octobre 2000.
Cité dans :[REVUE190] Elsevier Science, Microelectronics Reliability, Vol. 40, Issue 8-10, pp. 1243-1770, august-october 2000.
Cité dans :[THESE090] S. MOREAU, Fiabilité environnementale des composants de puissance : le TRIAC, Thèse de Doctorat, soutenue le 17 mai 2005, 127 pages.

Auteur : S. Ramminger
Auteur : N. Seliger
Auteur : G. Wachutka

Source : ESREF'2000, "11th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis", Dresden, Germany.
Date : 2-6 octobre 2000
Stockage : Thierry LEQUEU
Pages : 1521 - 1526
Lien : private/RAMMINGER1.pdf - 153 Ko, 5 pages.
Info : Al wire bons ISPSD'2000 ?? (cf SHEET396) Coffin-Manson Law

  [1] : [SHEET396] C. Hager, A. Stuck, Y. Tronel, R. Zehringer, W. Fichtner, Comparison between Finite-Element and Analytical Calculations for the Lifetime Estimation of Bond Wires in IGBT Modules, ISPSD'2000, pp. 291-294.

Abstract :
In power electronic packages wire bonding is used for the electrical contact of the chips and for
interconnections on the module substrate. Limiting factors for the reliability are solder fatigue and wire bond
failures. In this work we investigate the material fatigue of aluminum bonding wires stressed by cyclic lateral
bonding area displacement. Bond wire heel crack failures observed by experiments are found to be strongly
dependent on the loop geometry. Based on a finite element model that accounts for elastic-plastic material
properties, a life-time model for the Al wire (Coffin-Manson representation) is derived from the experiments.

Bibliographie

Références : 5
[1] : V. Mehrotra: "Wirebond Reliability in IGBT-Power Modules: Application of High Resolution Strain and Temperature Mapping", Proc. ISPSD’99, pp. 113-116, 1999.
[2] : H. Berg, E. Wolfgang: "Advanced IGBT modules for railway traction applications: Reliability testing", Microelectr. Reliab. 38, pp. 1319-1323, 1998.
[3] : S. Ramminger, G. Mitic, P. Türkes, G. Wachutka: "Thermo-Mechanical Simulation of Wire Bonding Joints in Power Modules", Proc. MSM1999, pp. 483-486, 1999.
[4] : S. Ramminger, P. Türkes, G. Wachutka: "Crack Mechanism in Wire Bonding Joints", Proc. ESREF 1998, pp. 1301-1305, 1998.
[5] : N. V. Chidambaram: "A Numerical and Experimental Study of Temperature Cycle Wire Bond Failure", Proc. Electronic Comp. and Technol. 1991, pp. 877-882, 1991.

  [1] : [99ART111] MEHROTRA V., HE J., DADKHAH M.S., RUGG K., SHAW M.C., Wirebond reliability in IGBT-Power modules : application of high resolution strain and temperature mapping, ISPSD'99.
  [2] :  [PAP401]  H. BERG, E. WOLFGANG, Advanced IGBT modules for railway traction applications: Reliability testing, Microelectronics Reliability, Volume 38, Issues 6-8, 8 June 1998, pp. 1319-1323.
  [3] :  [PAP158]  -------
  [4] :  [PAP400]  S. RAMMINGER, P. TURKES, G. WACHUTKA, Crack Mechanism in Wire Bonding Joints, Microelectronics Reliability, Volume 38, Issues 6-8, 8 June 1998, pp. 1301-1305.
  [5] :  [PAP158]  -------

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