Article : [TRIAC085]

Info : REPONSE 76, le 05/02/2002.

Titre : N. YONEMURA, M. FUKUDA, T. SHIGI, Thermal shock reliability analysis of insulated metal substrates (IMS), IEEE/CPMT 20th IEMT, Apr 1997, pp. 303-307.

Cité dans : [DIV333]  Recherche sur les mots clés thermal + shock + liquid , février 2002.

Meeting : Proceedings of the 1997 IEEE/CPMT 20th International Electronic Manufacturing Symposium.
Info : organization : IEEE
Location : Tokyo, Jpn
Date : 16 Apr 1997-18 Apr 1997

Source : Proceedings of the IEEE/CPMT International Electronic Manufacturing Technology (IEMT) Symposium 1997.IEEE, Piscataway, NJ, USA,97CH36059.
Pages : 303-307
CODEN : 61UNAI
Année : 1997
Meeting_Number : 46958
Document_Type : Conference Article
Treatment_Code : Theoretical; Experimental
Language : English
Stockage :

Abstract :
To design a high performance IMS and extend its applications, the
influences of materials, which IMS consists of, i.e., base metal boards
and copper conductor thickness, were analyzed theoretically using FEM.In
addition, `thermal shock reliability' of an alumina substrate and IMS, was
examined and compared analytically and experimentally, too.The influences
of the materials have been clarified through the analysis and the data
were compared with experimental results.`Liquid phase thermal shock
tester' was used for the experimental data and it was found that the
analytical results and experimental data tend to be identical.(Author abstract)

Référence : 1 Refs.

Accession_Number : 1997(45):2123 COMPENDEX

Mise à jour le lundi 10 avril 2023 à 19 h 05 - E-mail : thierry.lequeu@gmail.com
Cette page a été produite par le programme TXT2HTM.EXE, version 10.7.3 du 27 décembre 2018.

Copyright 2023 :

Les informations contenues dans cette page sont à usage strict de Thierry LEQUEU et ne doivent être utilisées ou copiées par un tiers.
Powered by www.google.fr, www.e-kart.fr, l'atelier d'Aurélie - Coiffure mixte et barbier, La Boutique Kit Elec Shop and www.lequeu.fr.