T.E. WONG, I. SUASTEGUI, H.M. COHEN, A.H. MATSUNAGA, "Experimentally validated thermal fatigue life prediction model for leadless chip carrier solder joint", 1998.

T.E. WONG, I. SUASTEGUI, H.M. COHEN, A.H. MATSUNAGA, "Experimentally validated thermal fatigue life prediction model for leadless chip carrier solder joint", 1998. Copyright - [Précédente] [Première page] [Suivante] - Home

Article : [SHEET141]

Info : COMPENDEX Answer Number 9 - 22/02/2000

Titre : T.E. WONG, I. SUASTEGUI, H.M. COHEN, A.H. MATSUNAGA, Experimentally validated thermal fatigue life prediction model for leadless chip carrier solder joint, 1998.

Cité dans : [DATA035] Recherche sur les mots clés thermal + fatigue + semiconductor et reliability + thermal + cycle, mars 2004.
Cité dans : [DATA062] Recherche sur les auteurs COFFIN et MANSON, octobre 2001.
Cité dans : [DATA063] Recherche sur l'auteur H.D. SOLOMON.

Auteur : Wong, T.E. (Raytheon Systems Co, El Segundo, CA, USA)
Auteur : Suastegui,I.
Auteur : Cohen, H.M.
Auteur : Matsunaga, A.H.

Title : Proceedings of the 1998 ASME International Mechanical Engineering Congress and Exposition.
Location : Anaheim, CA, USA
Date : 15 Nov 1998-20 Nov 1998
Source : ASME, American Society of Mechanical Engineers (Paper) 1998.ASME, Fairfield, NJ, USA.
Pages : 1 - 5
CODEN : ASMSA4
ISSN : 0402-1215
Meeting_Number : 49454
Document_Type : Conference Article
Treatment_Code : Application; Theoretical; Experimental
Language : English
Stockage : Thierry LEQUEU

Abstract :
A study was conducted with the objective of developing an experimentally validated thermal fatigue
life prediction model for leadless chip carrier (LCC) solder joints. A thermostructural analysis
using a submodeling technique was conducted to calculate the nonelastic strains in the solder joints
during the temperature cycling. These nonelastic strains, combined with modified Manson-Coffin
fatigue life prediction theory, were then used in the thermal fatigue life prediction model of the
LCC solder joints. Finally, the model was calibrated to thermal life cycling test results provided
by Jet Propulsion Laboratory (JPL/NASA).

Accession_Number : 1999(20):2207

References : 16 Refs.
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[2] : ASM International, Electronic Materials Handbook, Volume 1, Packaging, Materials Park, Ohio, 1979.
[3] : Devore, J.A, "The Makeup of a Surface-Mount Solder Joint", Circuit Manufacturing, pp. 42-46, June 1990.
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[10] : Root, J.A., "MANTECH for Advanced Data/Signal Processing", WRDC-TR-89-8025, 1990/1991.
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[12] : Solomon, H.D., V. Brzozowski, and D.G. Thompson, "Predictions of Solder Joint Fatique Life", 40 ECTC, IEEE, pp. 351-359, 1990.
[13] : Solomon, H.D. Low Cycle Fatigue. ASTM STP-942, ASTM, pp. 342-371, 1988.
[14] : Wong B., D.E. Helling, and R.W. Clark, "A Creep-Rupture Model for Two-phase Eutectic Solders," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 11, No. 3, pp. 284-290, 1988.
[15] : Wong, T.E., L.A. Kachatorian, and H.M. Cohen, "J-Lead Solder Joint Thermal Fatigue Life Model," to be published in the 1997 ASME Winter Annual Meeting, 9th Symposium on Mechanics of Surface Mount Assemblies, Dallas, TX, 16-21 Nov. 1997a.
[16] : Wong, T.E., L.A. Kachatorian, and B.D. Tierney, "Gull-Wing Solder Joint Fatigue Life Sensitivity Evaluation," Journal of Electronic Packaging, Trans. Of the ASME, pp. 171-176, Sep. 1997b.

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 [12] : [SHEET304] H.D. SOLOMON, V. BRZOZOWSKI, D.G. THOMPSON, Predictions of solder joint fatigue life, 1990
 [13] : [SHEET325] H.D. SOLOMON, Low Cycle Fatigue ASTM STP-942, ASTM, pp. 342-371, 1988.
 [14] : [SHEET308] B. WONG, D.E. HELLING, R.W. CLARK, A creep-rupture model for two-phase eutectic solders, Sept. 1988.
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