H.D. SOLOMON, V. BRZOZOWSKI, D.G. THOMPSON, "Predictions of solder joint fatigue life", 1990

H.D. SOLOMON, V. BRZOZOWSKI, D.G. THOMPSON, "Predictions of solder joint fatigue life", 1990 Copyright - [Précédente] [Première page] [Suivante] - Home

Article : [SHEET304]

Titre : H.D. SOLOMON, V. BRZOZOWSKI, D.G. THOMPSON, Predictions of solder joint fatigue life, 1990

Cité dans : [DATA063] Recherche sur l'auteur H.D. SOLOMON.
Cité dans :[SHEET141]

Auteur : Solomon, H.D.
Auteur : Brzozowski, V.
Auteur : Thompson, D.G - GE Corporate Res. & Dev., Schenectady, NY, USA

Stockage : Thierry LEQUEU
Lien : private/Solomon1.pdf - 9 pages, xxx ko.
Source : Electronic Components and Technology Conference, 1990. Proceedings., 40th
Pages : 351 - 359 vol.1
Date : 20-23 May 1990
Info : Total Pages : 2 vol. xvi+1125

Abstract :
Procedures used to predict solder-joint life from calculations of
the joint strains and low-cycle fatigue data are described. The
fatigue lives of chip-carrier/printed-wiring-board joints are
predicted and compared to measured values. This prediction
utilizes a finite-element analysis of the string distributions in
a typical joint acted upon by an imposed displacement. These
strains are then used to determine the fatigue life through
low-cycle fatigue data. The correlation with joint behavior
requires a size-effect correction to the low-cycle fatigue lives.
This correction is required because typical joint dimensions are
smaller than the dimensions of the specimen utilized in the
fatigue tests, and the fatigue life depends on the joint size.

Subject_terms :
solder joint fatigue life prediction; chip carrier PCB joints;
joint strains; low-cycle fatigue data; fatigue lives;
chip-carrier/printed-wiring-board joints; finite-element
analysis; string distributions; imposed displacement; size-effect
correction; joint size; fatigue testing; finite element analysis;
reliability; soldering; surface mount technology

References : 19

Accession_Number : 3897389

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