S. FORSTER, T. LEQUEU, R. JERISIAN, "Operation of power semiconductors under transient thermal conditions: thermal fatigue reliability and mechanical aspects", Microelectronics Reliability, Volume 41, Issues 9-10, September

S. FORSTER, T. LEQUEU, R. JERISIAN, "Operation of power semiconductors under transient thermal conditions: thermal fatigue reliability and mechanical aspects", Microelectronics Reliability, Volume 41, Issues 9-10, September - October 2001, pp. 1677-1682. Copyright - [Précédente] [Première page] [Suivante] - Home

Article : [ART163]

Titre : S. FORSTER, T. LEQUEU, R. JERISIAN, Operation of power semiconductors under transient thermal conditions: thermal fatigue reliability and mechanical aspects, Microelectronics Reliability, Volume 41, Issues 9-10, September - October 2001, pp. 1677-1682.

Cité dans : [PAP370]  S. FORSTER, T. LEQUEU, R. JERISIAN, Operation of power semiconductors under transient thermal conditions: thermal fatigue reliability and mechanical aspects, ESREF'2001, pp. 1677-1682.
Cité dans :[REVUE279] Elsevier Science, Microelectronics Reliability, Volume 41, Issues 9-10, Pages 1273-1736, September - October 2001.
Cité dans : [DATA033] Liste des publications de Thierry LEQUEU et activités de recherche, octobre 2022.
Cité dans :[ART162]

Auteur : Stéphane Forster (1)(2)
Auteur : Thierry Lequeu (1)
Auteur : Robert Jérisian (1)

Adresse : (1) LMP-STMicroelectronics, (2) CLOES - France
Source : Microelectronics Reliability
Volume : 41
Issues : 9-10
Date : September - October 2001
Site : http://www.elsevier.com/locate/microrel
Page : 1677 - 1682
Lien : private/FORSTER3.pdf - 6 pages, 493 Ko.
Lien : ART162.HTM#Bibliographie - référence [2].

Abstract :
The authors explain the degradation mechanism of a TRIAC submitted to the application of strong di/dt during
the commutation at turn-on. The analysis is based on the evaluation of the thermo-mechanical forces concerned
in the Initially Turned on Area of the TRIAC in quadrant Q2. A mathematical expression is established giving
the number of commutations cycles before failure that the component can withstand. This expression is made
profitable to evaluate the reliability of the TRIAC.

Bibliographie

Références : 8
[1] : S. FORSTER, T. LEQUEU, R. JERISIAN, A. HOFFMANN, "3-D analysis of the breakdown localized defects of ACS(TM) through a TRIAC study", Microelectronics Reliability, Vol. 40, pp. 1695-1700, 2000.
[2] : I.L. SOMOS, L.O. ERIKSSON, W.H. TOBIN, "Understanding di/dt ratings and life expectancy for thyristors", Power Conversion And Intelligent Motion, pp. 56-59, February 1986.
[3] : R.G. RODRIGUES, D.E. PICCONE, W.H. TOBIN, L.W. WILLINGER, J.A. BARROW, T.A. HANSEN, J. ZHAO, L. CAO, "Operation Of Power Semiconductors At Their Thermal Limit", 1998 IEEE IAS Annual Meeting.
[4] : D. BROEK, "Elementary Engineering Fracture Mechanics", 1982, Martinus Nijhoff Publishers.
[5] : J.P. SINGH, K. NIIHARA, D.P.H. HASSELMAN, "Analysis of thermal fatigue behaviour of brittle structural materials", Journal of materials science, vol.16, pp.2789-2797, 1981.
[6] : R.B. ABERNETHY, "The New Weibull Handbook", Gulf Publishing Company, 1994.
[7] : W. KUO, W.-T. K. CHIEN, T. KIM, "Reliability, yield, and stress burn in : a unified approach for microelectronics systems manufacturing and software development", Kluwer Academic Publishers, 1998.
[8] : W. NELSON, "Applied Life Data Analysis", Wiley, 1982.

  [1] : [SHEET459] S. FORSTER, T. LEQUEU, R. JERISIAN, A. HOFFMANN, 3-D analysis of the breakdown localized defects of ACSTM through a triac study, Microelectronics Reliability, October 2000, Vol. 40, pp. 1695-1700.
  [2] : [SHEET204] I.L. SOMOS, L.O. ERIKSSON, W.H. TOBIN, Understanding di/dt ratings and life expectancy for thyristors, Power Conversion And Intelligent Motion, pp. 56-59, February 1986.
  [3] : [SHEET196] R.G. RODRIGUES, D.E. PICCONE, W.H. TOBIN, L.W. WILLINGER, J.A. BARROW, T.A. HANSEN, J. ZHAO, L. CAO, Operation Of Power Semiconductors At Their Thermal Limit, 1998 IEEE IASociety Annual Meeting, October 12-15, 1998, 12 pages.
  [4] : [LIVRE200] D. BROEK, Elementary Engineering Fracture Mechanics, June 1982, Martinus Nijhoff Publishers, 524 pages.
  [5] : [SHEET514] J.P. SINGH, K. NIIHARA, D.P.H. HASSELMAN, Analysis of thermal fatigue behaviour of brittle structural materials, Journal of materials  science, vol.16, pp.2789-2797, 1981.
  [6] : [LIVRE234] R.B. ABERNETHY, The New Weibull Handbook, 1996, 536 Oyster Road, North Palm Beach, FL 33408-4328.
  [7] : [LIVRE063] W. KUO, W.-T. K. CHIEN, T. KIM, Reliability, yield, and stress burn in: a unified approach for microelectronics systems manufacturing and software development, Kluwer Academic Publishers, january 1998.
  [8] : [LIVRE233] W. NELSON, Applied Life Data Analysis, Wiley, April 1982, 656 pages.

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