Livre : [LIVRE063]

Titre : W. KUO, W.-T. K. CHIEN, T. KIM, Reliability, yield, and stress burn in: a unified approach for microelectronics systems manufacturing and software development, Kluwer Academic Publishers, january 1998.

Cité dans : [DIV137]  Recherche sur les mots clés : FIABILIT* ou RELIABILITY, octobre 1999.
Cité dans :[PAP370]

Année : 1997/12
Stockage : bibliothèque LMP
Info. : Fiche N° LMP98-26j, Cde 98 LMP 70, luwer Academic Publishers, Boston. Hardbound,
Site : http://www.wkap.nl/kaphtml/homepage
ISBN : 0-7923-8107-6, January 1998, 424 pp.

Référence : Livre 9823
Date_d'achat : 1 juillet 1998
Prix : 1190,11 F

Reliability, Yield, and Stress Burn-In explains reliability issues in Microelectronics Systems Manufacturing and Software
Development with an emphasis on evolving manufacturing technology for the semiconductor industry. Since most
microelectronics components have an infant mortality period of about one year under ordinary operating conditions, and
many modern systems, such as PCs, are heavily used in the first few years, the reliability problem in the infant mortality
period becomes extremely important. Burn-in is an accelerated screening procedure that eliminates infant mortalities early
on in the shop before shipping out the products to the customers. This book will also help readers to analyze systems that
exhibit high failure rate during a long infant mortality period.

Reliability, Yield, and Stress Burn-In presents ways to systematically analyze burn-in policy at the component, sub-system,
and system levels. Various statistical methods are addressed including parametric, nonparametric, and Bayesian approaches.
Many case studies are introduced in combination with the developed theories. Included in the book is an introduction to
software reliability.

Reliability, Yield, and Stress Burn-In will help manufacturers and system designers to understand and to design a more
reliable product given constraints specified by the users and designers. An understanding of the infant mortality period
will solve many reliability problems, including those faced in the semiconductor industry and software industry.

Contents :
Preface.
1. Overview of Design, Manufacture, and Reliability.
2. Integrating Reliability into Microelectronics Manufacturing.
3. Basic Reliability Concept.
4. Yield and Modeling Yield.
5. Reliability Stress Tests.
6. Burn-In Performance, Cost, and Statistical Analysis.
7. Nonparametric Reliability Analysis.
8. Parametric Approaches to Decide Optimal System Burn-In Time.
9. Nonparametric Approach and Its Applications to Burn-In.
10. Nonparametric Bayesian Approach for Optimal Burn-In.
11. The Dirichlet Process for Reliability Analysis.
12. Software Reliability and Infant Mortality Period of the Bathtub Curve.
Epilogue : Cost-Effective Design for Stress Burn-In.
References.
Appendices :
A. Notation and Nomenclature.
B. Failure Modes for Parts.
C. Common Probability Distributions.
D. Simulation for U-Shaped Hazard Rate Curves.
E. Sample Programs.
Index.

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