P. JACOB, M. HELD, P. SCACCO, "IGBT Power Semiconductor Reliability Analysis for Traction Application", IPFA'95, Singapore, pp. 169-175

P. JACOB, M. HELD, P. SCACCO, "IGBT Power Semiconductor Reliability Analysis for Traction Application", IPFA'95, Singapore, pp. 169-175 Copyright - [Précédente] [Première page] [Suivante] - Home

Article : [SHEET535]

Info : REPONSE 126, le 31/03/2004.

Titre : P. JACOB, M. HELD, P. SCACCO, IGBT Power Semiconductor Reliability Analysis for Traction Application, IPFA'95, Singapore, pp. 169-175

Cité dans : [CONF050] IPFA, International Symposium on the Physical and Failure Analysis of Integrated Circuits, octobre 2001.
Cité dans : [DATA035] Recherche sur les mots clés thermal + fatigue + semiconductor et reliability + thermal + cycle, mars 2004.
Cité dans :[SHEET396]

Auteur : Jacob, Peter (Swiss Federal Inst of Technology Zurich)
Auteur : Held, Marcel
Auteur : Scacco, Paolo

Lien : SHEET396.HTM#Bibliographie - référence [6]
Stockage :
Source : IPFA'95, Singapore
Pages : 169 - 175

Meeting : Proceedings of the 1995 5th International Symposium on the Physical & Failure Analysis of Integrated Circuits.

Info : organization : IEEE
Location : Singapore, Singapore
Date : 27 Nov 1995-01 Dec 1995

Source : Proceedings of the International Symposium on the Physical 7 Failure Analysis of Integrated Circuits, IPFA 1995.IEEE, Piscataway, NJ, USA.p 169-175
CODEN : 002346
Année : 1995
Meeting_Number : 44644
Document_Type : Conference Article
Treatment_Code : Application; Theoretical
Language : English
Stockage :
Switches :
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Abstract :
IGBT ( equals Insulated Gate Bipolar Transistor) power semiconductor modules become of importance for traction applications.However, the reliability of these power modules is still a concern, compared to those of press-packed GTOs. Although first IGBT-press-pack solutions have been presented to the market, IGBT-presspacking remains difficult and expensive. Besides this, customers prefer module technology solutions, because of their economical advantage and easiness of device mounting.Reliability tests have been developed and modules have been analyzed to judge critical reliability points and to show ways for improvement. (Author abstract) 9 Refs.

Accession_Number : 1996(26):6332 COMPENDEX

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