Article : [SHEET317]

Info : COMPENDEX Answer Number 8, le 28/04/2000.
Info : REPONSE 266, le 29/03/2004.

Titre : S. Kitajo, S. Ohkawa, N. Senba, K. Hashimoto, N. Ebihara, Using thermal stress simulation to estimate stacked memory module reliability under thermal cycle test, 1999.

Cité dans : [DATA062] Recherche sur les auteurs COFFIN et MANSON, octobre 2001.
Cité dans : [DATA035] Recherche sur les mots clés thermal + fatigue + semiconductor et reliability + thermal + cycle, mars 2004.
Cité dans :[PAP360]

Meeting : Proceedings of the 1999 International Conference on High Density Packaging and MCMs.
Info : organization : IMAPS
Location : Denver, CO, USA
Date : 06 Apr 1999-09 Apr 1999
Source : Proceedings of SPIE - The International Society for Optical Engineering v 3830 1999.
Pages : 414 - 419
CODEN : PSISDG
ISSN : 0277-786X
Année : 1999
Meeting_Number : 55578
Document_Type : Journal
Treatment_Code : Application; Experimental
Language : English
Stockage :
Logiciel : oui

Abstract :
Thermal stress simulation is carried out to investigate the thermal
cycle reliability of a stacked memory module. A newly-developed
stacked memory module was applied to high performance electronic
equipment, such as computers, switching systems and space systems.
This module consists of four chip size packages (CSPs). In the CSP
stacking process, solder ball bumps are used to connect signal pads
on the carriers. Considering plasticity and creep of solder bump
material, the three-dimensional finite element model for a stacked
memory used in this simulation was built to have non-linear
characteristics. The fatigue life of a solder bump under a thermal
cycle test was predicted from a simulated inelastic strain value by
using the Coffin-Manson equation. In results, it was found that
filling resin around all the solder bumps makes fatigue life more
than 20 times longer than in a conventional noresin structure. The
optimum values for reducing solder bump stress and strain of two
resin properties, i.e., coefficient of thermal expansion and Young's
modulus, were calculated. It was clarified that thermal stress
simulation is a very effective means of predicting thermal cycling
package reliability.(Author abstract) 5 Refs.

Accession_Number : 2000(1):2414

Titre : Using thermal stress simulation to estimate stacked memory module reliability under thermal cycle test.

Cité dans : [DATA035] Recherche sur les mots clés thermal + fatigue + semiconductor et reliability + thermal + cycle, mars 2004.

Meeting : Proceedings of the 1999 International Conference on High Density Packaging and MCMs.

Info : organization : IMAPS
Location : Denver, CO, USA
Date : 06 Apr 1999-09 Apr 1999

Source : Proceedings of SPIE - The International Society for Optical Engineering v 3830 1999.p 414-419
CODEN : PSISDG
ISSN : 0277-786X
Année : 1999
Meeting_Number : 55578
Document_Type : Journal
Treatment_Code : Application; Experimental
Language : English
Stockage :
Switches :
Power :
Software :

Abstract :
Thermal stress simulation is carried out to investigate the thermal cycle reliability of a stacked memory module. A newly-developed stacked memory module was applied to high performance electronic equipment, such as computers, switching systems and space systems. This module consists of four chip size packages (CSPs). In the CSP stacking process, solder ball bumps are used to connect signal pads on the carriers. Considering plasticity and creep of solder bump material, the three-dimensional finite element model for a stacked memory used in this simulation was built to have non-linear characteristics. The fatigue life of a solder bump under a thermal cycle test was predicted from a simulated inelastic strain value by using the Coffin-Manson equation. In results, it was found that filling resin around all the solder bumps makes fatigue life more than 20 times longer than in a conventional noresin structure. The optimum values for reducing solder bump stress and strain of two resin properties, i.e., coefficient of thermal expansion and Young's modulus, were calculated. It was clarified that thermal stress simulation is a very effective means of predicting thermal cycling package reliability.(Author abstract) 5 Refs.

Accession_Number : 2000(1):2414 COMPENDEX

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