A.H. FISCHER, A.E. ZITZELSBERGER, "The quantitative assessment of stress-induced voiding in process qualification", IRPS'2001, April 30 - Mai 3, 2001, Orlando, Floride.
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Article : [PAP425]
Titre : A.H. FISCHER, A.E. ZITZELSBERGER, The quantitative assessment of stress-induced voiding in process qualification, IRPS'2001, April 30 - Mai 3, 2001, Orlando, Floride.
Cité dans : [DIV214] IRPS'2001, 2001 IEEE International Reliability Physics Symposium, 30 avril - 3 mai 2001, Orlando, Floride.
Cité dans : [PAP360] T. LEQUEU, Les tests en fiabilité, rapport interne LMP, novembre 2001.
Auteur : A.H. Fischer
Auteur : A.E. Zitzelsberger
Adresse : Infineon Technologies AG, Reliability Methodology, Otto Hahn Ring 6, D-81739 Munich, Germany
Lien : mailto:armin.fischer@infineon.com
Lien : private/FISCHER.pdf - 7 pages, 1243 Ko.
ABSTRACT :
Stress-induced voiding was studied on submicron aluminum
interconnects. A phenomenological model is derived to describe the
median time of failures which are caused by the growth of stress-
induced voids. Based on this model a procedure for the prediction of
lifetime is proposed. Furthermore, the influence of stress-induced
voids on the electromigration performance is discussed. It will be
shown, that a reduced current density exponent is found in stress-
induced void damaged lines, leading to a decrease of
electromigration lifetimes.
Keywords : Stress-induced voiding, Model for median time to failure, Failure distributions, Activation energy, Lifetime extrapolation, Reliability, Electromigration
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