S. MOREAU, T. LEQUEU, R. JERISIAN, "Comparative study of thermal cycling and thermal shock tests on electronic components reliability", Elsevier Science, Microelectronics Reliability, Volume 44, Issues 9-11, September-November 2004, pp. 1343-1347.

S. MOREAU, T. LEQUEU, R. JERISIAN, "Comparative study of thermal cycling and thermal shock tests on electronic components reliability", Elsevier Science, Microelectronics Reliability, Volume 44, Issues 9-11, September-November 2004, pp. 1343-1347. Copyright - [Précédente] [Première page] [Suivante] - Home

Article : [ART586]

Titre : S. MOREAU, T. LEQUEU, R. JERISIAN, Comparative study of thermal cycling and thermal shock tests on electronic components reliability, Elsevier Science, Microelectronics Reliability, Volume 44, Issues 9-11, September-November 2004, pp. 1343-1347.

Cité dans :[REVUE538] Elsevier Science, Microelectronics Reliability, Volume 44, Issues 9-11, Pages 1281-1890, September-November 2004.
Cité dans : [DIV423]  ESREF'2004, 15th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, du 4 au 8 octobre 2004, ETH, Zurich, Switzerland.
Cité dans : [ART538]  S. MOREAU, T. LEQUEU, R. JERISIAN, Comparative study of thermal cycling and thermal shock tests on electronic components reliability, ESREF'2004, 4-8 octobre 2004, ETH-Zurich, Switzerland, 4 pages.
Cité dans : [DATA033] Liste des publications de Thierry LEQUEU et activités de recherche, octobre 2022.

Auteur : Stéphane MOREAU
Auteur : Thierry LEQUEU
Auteur : Robert JERISIAN

Adresse : LMP-STMicroelectronics, 16 rue Pierre et Marie Curie, BP 7155, 37071 Tours Cedex 2, France
Source : Elsevier Science, Microelectronics Reliability
Volume : 44
Issues : 9-11
Date : September-November 2004
Pages : 1343 - 1347
Lien : private/MOREAU6.pdf - 978 Ko, 5 pages.

Vers : Bibliographie

Abstract :
In this work, the first reliability results of Thermal Cycling Tests (TCT, air-air test) and Thermal Shock Tests (TST, liquid-liquid test) on medium power electronic components are discussed. The influence of dwell times, extremes temperatures and mean temperature is investigated. This study is based on statistical data correlated with information coming from failure analysis and confirmed by a basic FEM analysis.

Bibliographie

References :
[1] : Lau J. H., Wong C., Prince J. and Nakayama W. Electronic Packaging: Design, Materials, Process, and Reliability. McGraw-Hill, 1998, 498 p.
[2] : Department of Defense - United States of America Test Method Standard - Semiconductor devices - MIL-STD-750D (4th edn) 28 February 1995
[3] : Abernethy R. B. The New Weibull Handbook (4th edn). 2000, 310 p.
[4] : ANSYS User Manual (V7.1)
[5] : Lee W., Nguyen L.T. and Selvaduray G. Solder Joint Fatigue Models - Review and Applicability to Chip Scale Packages. Microelectronics Reliability, 40 (2000), pp 231-244.

  [1] : [LIVRE057] J. LAU, C.P. WONG, J.L. PRINCE, W. NAKAYAMA, Electronic packaging : design, materials, process & reliability, McGraw-Hill, march 1998.
  [2] :  [DIV445]  Department of Defense - United States of America, MIL-STD-750D - Test Method Standard - Semiconductor devices, 4th edition, 28 February 1995.
  [3] : [LIVRE234] R.B. ABERNETHY, The New Weibull Handbook, 1996, 536 Oyster Road, North Palm Beach, FL 33408-4328.
  [4] :  [DATA259] ANSYS, Design Modeler Users Manual, Design Simulation Users Manual, ANSYS is a trademark of Inc., Houston, PA.
  [5] :  [PAP256]  W.W. LEE, L.T. NGUYEN, G.S. SELVADURAY, Solder joint fatigue models: review and applicability to chip scale packages, Microelectronics Reliability, Vol. 40, No. 2, 2000, pp. 231-244.

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