C. ZARDINI, E. WOIRGARD, H. HUILLET, J.-L. AUCOUTURIER, "Thermal simulation of hybrid power assemblies", Proceedings of the First International Conference Advanced Computational Methods in Heat Transfer, Vol. 3, 17-20 July 1990, pp. 333-342.

C. ZARDINI, E. WOIRGARD, H. HUILLET, J.-L. AUCOUTURIER, "Thermal simulation of hybrid power assemblies", Proceedings of the First International Conference Advanced Computational Methods in Heat Transfer, Vol. 3, 17-20 July 1990, pp. 333-342. Copyright - [Précédente] [Première page] [Suivante] - Home

Article : [ART571]

Info : REPONSE 16, le 13/07/2004.

Titre : C. ZARDINI, E. WOIRGARD, H. HUILLET, J.-L. AUCOUTURIER, Thermal simulation of hybrid power assemblies, Proceedings of the First International Conference Advanced Computational Methods in Heat Transfer, Vol. 3, 17-20 July 1990, pp. 333-342.

Cité dans : [DIV289]  Recherche sur l'auteur Christian ZARDINI, juillet 2004.
Cité dans : [DIV441]  Recherche sur l'auteur Eric WOIRGARD, juillet 2004.

Auteur : Zardini, C.
Auteur : Woirgard, E.
Auteur : Huillet, H.
Auteur : Aucouturier, J.-L. (IXL, ENSERB, Bordeaux 1 Univ., Talence, France)

Source : Advanced Computational Methods in Heat Transfer. Proceedings of the First International Conference
Editors : Wrobel, L.C.; Brebbia, C.A.; Nowak, A.J. Southampton, UK: Comput. Mech. Publications, 1990.
Pages : 333 - 342
Volume : 3 of 3 vol. (429+397+532) pp.
Références : 3 refs.
Conference : Southampton, UK.
Date : 17-20 July 1990
ISBN : 1-85312-105-3
Document_Type : Conference Article
Treatment_Code : Theoretical
Info : Country of Publication : United Kingdom
Language : English
Stockage :
Switches :
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Abstract :
The authors' current work on hybrid power circuits has led them to study the thermal behaviour of hybrid power assemblies. They have exposed results (obtained using a finite element code) relative to stackings constituted by a power chip, a heat-spreader and a ceramic substrate. However, in most applications, the equipped substrate is attached to the bottom of a metallic case using a solder alloy. They present the study of the thermal behaviour of the complete assembly in both steady and unsteady-states. Among the different ceramic substrates available for power applications, aluminum nitride, which is a non-toxic high thermal conductivity material, is the most attractive. So, the study has been carried out for different grades of commercially available aluminum nitride substrates of increasing thermal conductivities (k=70, 140 and 200 Wm-1 K-1). For the steady-state, the heat-spreader's optimal thickness, which is the value giving the minimum thermal resistance of the assembly is the same for the different grades of substrates. The unsteady-state study shows the interest of an optimal choice for the thickness of the heat-spreader. Even with a high thermal conductivity substrate and a copper case, the heat-spreader continues to play a very important role in delaying the temperature rise of a power chip submitted to an overload.

Accession_Number : 1991:3789022 INSPEC

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