E. WOIRGARD, C. ZARDINI, J.-L. AUCOUTURIER, "Study of the thermomechanical problems in hybrid assemblies satisfying the automotive electronics conditions", Conference Proceedings of the 9th European Hybrid Microelectronic, 2-4 June 1993, pp. 158-165.

E. WOIRGARD, C. ZARDINI, J.-L. AUCOUTURIER, "Study of the thermomechanical problems in hybrid assemblies satisfying the automotive electronics conditions", Conference Proceedings of the 9th European Hybrid Microelectronic, 2-4 June 1993, pp. 158-165. Copyright - [Précédente] [Première page] [Suivante] - Home

Article : [ART570]

Info : REPONSE 15, le 13/07/2004.

Titre : E. WOIRGARD, C. ZARDINI, J.-L. AUCOUTURIER, Study of the thermomechanical problems in hybrid assemblies satisfying the automotive electronics conditions, Conference Proceedings of the 9th European Hybrid Microelectronic, 2-4 June 1993, pp. 158-165.

Cité dans : [DIV441]  Recherche sur l'auteur Eric WOIRGARD, juillet 2004.
Cité dans : [DIV289]  Recherche sur l'auteur Christian ZARDINI, juillet 2004.

Auteur : Woirgard, E.
Auteur : Zardini, Ch.
Auteur : Aucouturier, J.L. (IXL-ENSERB, Bordeaux I Univ., Talence, France)

Source : 9th European Hybrid Microelectronic Conference Proceedings
Lieu : Versailles, France: Int. Soc. Hybrid Microelectron, 1993.
Pages : 158 - 165 of vii+499 pp.
Références : 3 refs.
Availability : ISHM France, 49 rue Lamartine, 78000 Versailles, France
Conference : Nice, France, 2-4 June 1993
Document_Type : Conference Article
Treatment_Code : Application; Practical
Info : Country of Publication : France
Language : English
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Abstract :
To design cost-effective modules satisfying the automotive environment, it is advisable to replace traditional substrates such as epoxy glass or alumina with a more adapted material. The insulated metal substrates (IMS) which are made by a stacking of three layers- metal, insulator and conductor- can be successfully used for automotive applications as well as for consumer industries and power applications. Surface mounting on IMS presents new problems due to the thermal coefficient of expansion (TCE) mismatch between materials like silicon, ceramic and aluminium. During temperature cycling, the solder joints between the component and the substrate can be damaged by thermal fatigue. To optimize the mounting of the components, it is necessary to study the thermomechanical behavior of the assemblies during operation of the modules and after thermal cycling. The first stage of this study is to quantify and then according to certain determining parameters, to minimize the instantaneous residual stresses accumulated in the assembly during the mounting solder reflow of the component on its substrate. This paper shows the thermomechanical problems of surface mounting on IMS of electronic components used in automotive applications, it then describes the thermomechanical study by finite element analysis of these hybrid assemblies.

Accession_Number : 1994:4794353 INSPEC

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